公开(公告)号：US06787711B2

公开(公告)日：2004-09-07

申请号：US10195547

申请日：2002-07-16

申请人： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

发明人： Shunichi Kikuchi ,  Mitsutaka Yamada ,  Kenji Iketaki

IPC分类号： H05K111

CPC分类号： H05K1/0209 ,  H05K1/0201 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10204 ,  H05K2203/1121 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144

摘要： A printed wiring board device includes circuit parts which are mounted on a wiring board and constitute parts of a circuit in the printed wiring board device. Pads are provided on the wiring board in the circumference of the circuit parts, and the pads being electrically isolated from the circuit. Heat-absorbing dummy parts are mounted on the pads, and the dummy parts absorb heat from the circuit parts through the pads during reflow soldering.

摘要翻译： 印刷电路板装置包括安装在布线板上并构成印刷线路板装置中的电路的一部分的电路部分。 在电路部分的圆周上的布线板上设置有焊盘，并且焊盘与电路电隔离。 吸热虚拟部件安装在焊盘上，并且虚拟部件在回流焊接期间通过焊盘吸收来自电路部件的热量。

公开(公告)号：US06541898B2

公开(公告)日：2003-04-01

申请号：US09822636

申请日：2001-03-30

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC分类号： H01L41047

CPC分类号： H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

公开(公告)号：US20060007661A1

公开(公告)日：2006-01-12

申请号：US10976839

申请日：2004-11-01

申请人： Kenji Iketaki

发明人： Kenji Iketaki

IPC分类号： H05K7/20

CPC分类号： H05K1/0204 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/066 ,  H05K2201/10416 ,  H05K2201/10689

摘要： A circuit board includes a substrate having a pair of pads at mutually opposite positions of a front surface and a rear surface of the substrate; a circuit element having a heat dissipation part which is soldered to one of the pair of pads; and a heat transfer section which pierces through the substrate in a thickness direction, and both ends of which are soldered to the pair of pads respectively, wherein at least a part of the heat transfer section has a solid structure which prevents air from passing through between the front surface and the rear surface.

摘要翻译： 电路板包括：在基板的前表面和后表面相互相对的位置具有一对焊盘的基板; 电路元件，其具有焊接到所述一对焊盘中的一个焊盘的散热部; 以及传热部，其沿着厚度方向穿过基板，并且其两端分别焊接到所述一对焊盘，其中，所述传热部的至少一部分具有防止空气通过的固体结构 前表面和后表面。

公开(公告)号：US20070267465A1

公开(公告)日：2007-11-22

申请号：US11878537

申请日：2007-07-25

申请人： Kenji Iketaki

发明人： Kenji Iketaki

IPC分类号： B23K31/02 ,  B23K37/00

CPC分类号： B23K1/008 ,  B23K1/012 ,  H05K3/3494 ,  H05K2203/081 ,  H05K2203/1509

摘要： A reflowing apparatus for mounting parts on a printed wiring board, has a fixed heating portion for blowing the hot air to the printed wiring board, and a moving heating portion for locally varying the temperature of the hot air blown by the fixed heating portion to the printed wiring board.

摘要翻译： 用于将部件安装在印刷电路板上的回流装置具有用于将热空气吹送到印刷线路板的固定加热部分和用于局部地改变由固定加热部分吹送的热空气的温度的移动加热部分 印刷线路板。

公开(公告)号：US06744183B2

公开(公告)日：2004-06-01

申请号：US10347708

申请日：2003-01-21

申请人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

发明人： Masayuki Kitajima ,  Yutaka Noda ,  Seiichi Shimoura ,  Toru Okada ,  Masanao Fujii ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka

IPC分类号： H01L41047

CPC分类号： H01L41/29 ,  G11B5/5552 ,  G11B5/5556 ,  H01L41/0993 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/01327 ,  Y10T29/42 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

摘要翻译： 一种键合压电元件和电极的方法，包括以下步骤：在压电元件的接合表面上形成选自Au，Al，Zn，Cu和Sn的材料的第一涂层，并形成 在电极的接合表面上第二次涂覆选自Au，Al，Zn，Cu和Sn的材料。 第一和第二涂层的材料的组合优选为Au / Au，Au / Al，Zn / Cu或Sn / Cu。 该方法还包括使第一和第二涂层彼此紧密接触并在压力下加热它们以在第一和第二涂层之间形成金属键或金属间化合物，从而结合压电元件和电极的步骤。

公开(公告)号：US07759613B2

公开(公告)日：2010-07-20

申请号：US11878537

申请日：2007-07-25

申请人： Kenji Iketaki

发明人： Kenji Iketaki

IPC分类号： F27B9/10 ,  F27B9/36 ,  F27D7/04 ,  B23K1/012 ,  B23K31/02 ,  H05K3/34

CPC分类号： B23K1/008 ,  B23K1/012 ,  H05K3/3494 ,  H05K2203/081 ,  H05K2203/1509

摘要： A reflowing apparatus for mounting parts on a printed wiring board, has a fixed heating portion for blowing the hot air to the printed wiring board, and a moving heating portion for locally varying the temperature of the hot air blown by the fixed heating portion to the printed wiring board.

摘要翻译： 用于将部件安装在印刷电路板上的回流装置具有用于将热空气吹送到印刷线路板的固定加热部分和用于局部地改变由固定加热部分吹送的热空气的温度的移动加热部分 印刷线路板。

公开(公告)号：US06467141B2

公开(公告)日：2002-10-22

申请号：US09820553

申请日：2001-03-29

申请人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

发明人： Toru Okada ,  Kenji Iketaki ,  Hidehiko Kobayashi ,  Yutaka Noda ,  Masayuki Kitajima ,  Seiichi Shimoura ,  Masakazu Takesue ,  Keiichi Yamamoto ,  Hisao Tanaka ,  Masanao Fujii

IPC分类号： H04R1710

CPC分类号： G11B5/5552 ,  H01L41/313 ,  Y10T29/42 ,  Y10T29/49025 ,  Y10T29/49055

摘要： A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing. Finally, the adhered laminate thus obtained is placed in a heating furnace, and is heated at a predetermined temperature for a predetermined period of time, whereby each of the adhesives is fully cured.

摘要翻译： 提供了一种组装微致动器的方法，其中具有多个致动器基座的基架被放置在台架上，第一粘合剂被施加到每个致动器基座，以及具有多个基极的基极框架 被放置在第一粘合剂上。 第一粘合剂通过加热和压制半固化。 将第二粘合剂施加到每个基底电极上，并且将多个压电元件放置在第二粘合剂上。 第二粘合剂通过加热和压制半固化。 将第三粘合剂施加到压电元件，并且具有多个可移动电极的可动电极框架放置在第三粘合剂上。 第三粘合剂通过加热和压制半固化。 接下来，将第四粘合剂施加到每个可移动电极，并且具有多个铰链板的铰链板框架放置在第四粘合剂上。 第四粘合剂通过加热和加压半固化。 最后，将如此获得的粘合层压材料放置在加热炉中，并在预定温度下加热预定的时间，从而使各种粘合剂完全固化。

公开(公告)号：US5560534A

公开(公告)日：1996-10-01

申请号：US380579

申请日：1995-01-30

申请人： Toru Okada ,  Kenji Iketaki ,  Naoki Yamasaki

发明人： Toru Okada ,  Kenji Iketaki ,  Naoki Yamasaki

IPC分类号： B23K1/08 ,  H05K3/00 ,  H05K3/34

CPC分类号： B23K1/085 ,  H05K3/3447 ,  B23K2201/40 ,  H05K2203/0126 ,  H05K2203/0746 ,  H05K2203/111 ,  H05K3/0008 ,  H05K3/3468 ,  H05K3/3489

摘要： A soldering apparatus wherein lead pins of a part inserted from above in through-holes of a printed circuit board are soldered to the through-holes from below. The soldering apparatus comprises a solder supplying nozzle, a preliminary heating nozzle and a flux nozzle. Each of the nozzles has an opening and a pair of slits formed to extend downwardly from the opening. The nozzles are moved upwardly and downwardly in a Z direction by respective elevators and are moved and positioned in X and Y directions by a moving table. A printed circuit board to which a lead part to be soldered is temporarily fastened is disposed on the nozzles. As the moving table and the elevators are controlled so that the lead pins projecting to the rear face of the printed circuit board pass through the slits of the nozzles from sidewardly, application of flux to and preliminary heating of the lead pins are performed, and soldering of the lead pins is performed with molten solder supplied to the opening at the upper portion of the solder supplying nozzle.

摘要翻译： 焊接装置，其中从上方插入印刷电路板的通孔的部分的引脚从下方被焊接到通孔。 焊接装置包括焊料供给喷嘴，预热加热喷嘴和焊剂喷嘴。 每个喷嘴具有开口和形成为从开口向下延伸的一对狭缝。 喷嘴通过相应的电梯在Z方向上下移动，并通过移动台在X和Y方向上移动和定位。 将要焊接的引线部分暂时固定的印刷电路板设置在喷嘴上。 由于移动台和电梯被控制，使得突出到印刷电路板的背面的引线销从侧面穿过喷嘴的狭缝，进行焊剂的施加和引脚的预加热，并且焊接 引导引脚的供电通过供给到焊料供给喷嘴的上部的开口处的熔融焊料进行。