-
公开(公告)号：US12114421B2
公开(公告)日：2024-10-08
申请号：US18138437
申请日：2023-04-24
CPC分类号： H05K1/0243 , H01Q1/241 , H04R1/1016 , H04R1/1033 , H04R2420/07
摘要： A wireless earphone incorporates a wire antenna having a form factor driven innovative antenna shape that minimizes antenna detuning caused by user interactions with the earphones. The wire shape, diameter, and distance of the wire antenna from the printed circuit board (PCB) are selected for an acceptable tradeoff between antenna bandwidth and radiated efficiency. By inserting an end through a through-hole of the PCB, the wire antenna is electrically connected to a multi-layer PCB without traditional approaches such as springs, pogo pins, and the like. An antenna holder further secures the antenna within a thin profile housing for precise placement and manufacturing consistency. A PCB-specific RF VIA geometry is also utilized for partial impedance matching of a transmission line to the wire antenna. In addition, a more constant impedance is maintained along the transmission line connecting a radio device with the wire antenna.
-
公开(公告)号：US20200021014A1
公开(公告)日：2020-01-16
申请号：US16577365
申请日：2019-09-20
摘要： Embodiments include an antenna assembly comprising a non-conductive housing having an open end; an antenna element positioned inside the non-conductive housing; an electrical cable having a first end electrically coupled to the antenna element and a second end extending out from the open end; one or more dielectric materials positioned inside the non-conductive housing; and a conductive gasket coupled to a portion of the electrical cable positioned adjacent to the open end and outside the non-conductive housing. One embodiment includes a portable wireless bodypack device comprising a frame having a first external sidewall opposite a second external sidewall; a first antenna housing forming a portion of the first sidewall and including a first diversity antenna; and a second antenna housing forming a portion of the second sidewall and including a second diversity antenna.
-
公开(公告)号：US20170365911A1
公开(公告)日：2017-12-21
申请号：US15187514
申请日：2016-06-20
摘要： Embodiments include an antenna assembly comprising a non-conductive housing having an open end; an antenna element positioned inside the non-conductive housing; an electrical cable having a first end electrically coupled to the antenna element and a second end extending out from the open end; one or more dielectric materials positioned inside the non-conductive housing; and a conductive gasket coupled to a portion of the electrical cable positioned adjacent to the open end and outside the non-conductive housing. One embodiment includes a portable wireless bodypack device comprising a frame having a first external sidewall opposite a second external sidewall; a first antenna housing forming a portion of the first sidewall and including a first diversity antenna; and a second antenna housing forming a portion of the second sidewall and including a second diversity antenna. Embodiments also include a method of manufacturing an antenna assembly for a portable wireless bodypack device.
-
公开(公告)号：US20170365910A1
公开(公告)日：2017-12-21
申请号：US15187063
申请日：2016-06-20
IPC分类号： H01Q1/22 , H01Q1/50 , H01Q1/36 , H04B1/3827 , H01Q5/50
CPC分类号： H01Q1/2291 , H01Q1/36 , H01Q1/50 , H01Q5/50 , H04B1/3833 , H04R1/00 , H04R1/04 , H04R2420/07
摘要： Embodiments include a wireless microphone comprising an elongated main body configured for handheld operation of the microphone; a display bezel area included in the main body; a first antenna positioned at a bottom end of the main body; and a second antenna integrated into the display bezel area. Embodiments also include a wireless handheld microphone comprising a main body having a conductive housing and a tubular shape configured for handheld operation of the microphone; an opening included on a side surface of the conductive housing; a non-conductive cover coupled to the conductive housing and configured to cover the opening; and an antenna positioned adjacent to the non-conductive cover.
-
公开(公告)号：US20230420825A1
公开(公告)日：2023-12-28
申请号：US18367709
申请日：2023-09-13
CPC分类号： H01Q1/2291 , H04R1/00 , H04R1/04 , H01Q5/50 , H01Q1/36 , H01Q1/50 , H04B1/3833 , H04R2420/07
摘要： Embodiments include a wireless microphone comprising an elongated main body configured for handheld operation of the microphone; a display bezel area included in the main body; a first antenna positioned at a bottom end of the main body; and a second antenna integrated into the display bezel area. Embodiments also include a wireless handheld microphone comprising a main body having a conductive housing and a tubular shape configured for handheld operation of the microphone; an opening included on a side surface of the conductive housing; a non-conductive cover coupled to the conductive housing and configured to cover the opening; and an antenna positioned adjacent to the non-conductive cover.
-
公开(公告)号：US20230262878A1
公开(公告)日：2023-08-17
申请号：US18138437
申请日：2023-04-24
CPC分类号： H05K1/0243 , H01Q1/241 , H04R1/1016 , H04R1/1033 , H04R2420/07
摘要： A wireless earphone incorporates a wire antenna having a form factor driven innovative antenna shape that minimizes antenna detuning caused by user interactions with the earphones. The wire shape, diameter, and distance of the wire antenna from the printed circuit board (PCB) are selected for an acceptable tradeoff between antenna bandwidth and radiated efficiency. By inserting an end through a through-hole of the PCB, the wire antenna is electrically connected to a multi-layer PCB without traditional approaches such as springs, pogo pins, and the like. An antenna holder further secures the antenna within a thin profile housing for precise placement and manufacturing consistency. A PCB-specific RF VIA geometry is also utilized for partial impedance matching of a transmission line to the wire antenna. In addition, a more constant impedance is maintained along the transmission line connecting a radio device with the wire antenna.
-
公开(公告)号：US20210392741A1
公开(公告)日：2021-12-16
申请号：US17344110
申请日：2021-06-10
摘要： A wireless earphone incorporates a wire antenna having a form factor driven innovative antenna shape that minimizes antenna detuning caused by user interactions with the earphones. The wire shape, diameter, and distance of the wire antenna from the printed circuit board (PCB) are selected for an acceptable tradeoff between antenna bandwidth and radiated efficiency. By inserting an end through a through-hole of the PCB, the wire antenna is electrically connected to a multi-layer PCB without traditional approaches such as springs, pogo pins, and the like. An antenna holder further secures the antenna within a thin profile housing for precise placement and manufacturing consistency. A PCB-specific RF VIA geometry is also utilized for partial impedance matching of a transmission line to the wire antenna. In addition, a more constant impedance is maintained along the transmission line connecting a radio device with the wire antenna.
-
公开(公告)号：US10230159B2
公开(公告)日：2019-03-12
申请号：US14947933
申请日：2015-11-20
摘要： Embodiments include an antenna assembly for a wireless microphone, comprising a helical antenna including a feed point and at least one contact pin coupling the feed point to the wireless microphone. The helical antenna is configured for operation in first and second frequency bands. Embodiments also include a wireless microphone comprising a main body having top and bottom ends and an antenna assembly coupled to the bottom end. The antenna assembly comprises a helical antenna configured to transmit and receive wireless signals, an inner core configured to support the helical antenna on an outer surface of the inner core, and an outer shell formed over the inner core and the helical antenna. Embodiments further include a method of manufacturing an antenna assembly for a wireless microphone using a first manufacturing process to form a core unit of the antenna assembly and a second manufacturing process to form an overmold.
-
公开(公告)号：US11672078B2
公开(公告)日：2023-06-06
申请号：US17344110
申请日：2021-06-10
CPC分类号： H05K1/0243 , H01Q1/241 , H04R1/1016 , H04R1/1033 , H04R2420/07
摘要： A wireless earphone incorporates a wire antenna having a form factor driven innovative antenna shape that minimizes antenna detuning caused by user interactions with the earphones. The wire shape, diameter, and distance of the wire antenna from the printed circuit board (PCB) are selected for an acceptable tradeoff between antenna bandwidth and radiated efficiency. By inserting an end through a through-hole of the PCB, the wire antenna is electrically connected to a multi-layer PCB without traditional approaches such as springs, pogo pins, and the like. An antenna holder further secures the antenna within a thin profile housing for precise placement and manufacturing consistency. A PCB-specific RF VIA geometry is also utilized for partial impedance matching of a transmission line to the wire antenna. In addition, a more constant impedance is maintained along the transmission line connecting a radio device with the wire antenna.
-
公开(公告)号：US20230155274A1
公开(公告)日：2023-05-18
申请号：US18154558
申请日：2023-01-13
CPC分类号： H01Q1/2291 , H04R1/00 , H04R1/04 , H01Q5/50 , H01Q1/36 , H01Q1/50 , H04B1/3833 , H04R2420/07
摘要： Embodiments include a wireless microphone comprising an elongated main body configured for handheld operation of the microphone; a display bezel area included in the main body; a first antenna positioned at a bottom end of the main body; and a second antenna integrated into the display bezel area. Embodiments also include a wireless handheld microphone comprising a main body having a conductive housing and a tubular shape configured for handheld operation of the microphone; an opening included on a side surface of the conductive housing; a non-conductive cover coupled to the conductive housing and configured to cover the opening; and an antenna positioned adjacent to the non-conductive cover.
-
-
-
-
-
-
-
-
-
搜索结果
27 条记录 (耗时 0.018 秒)
