公开(公告)号：US09548219B2

公开(公告)日：2017-01-17

申请号：US14584428

申请日：2014-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yan-Heng Chen ,  Chung-Tang Lin ,  Chieh-Yuan Chi

IPC: H01L21/48 ,  H01L23/498 ,  H01L21/56 ,  H05K1/02 ,  H01L23/00

CPC classification number: H01L21/48 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0298 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/014

Abstract: A carrier structure is provided, which includes: a metal oxide plate having opposite first and second surfaces and a plurality of through holes penetrating the first and second surfaces; a plurality of conductive portions formed in the through holes, respectively; and a plurality of conductive pads formed on the first surface of the metal oxide plate, wherein each of the conductive pads is correspondingly positioned on and in contact with a plurality of the conductive portions so as to be electrically connected to the plurality of the conductive portions. By replacing a conventional silicon interposer with the metal oxide plate, the present invention eliminates the need to form through silicon vias as required in the prior art and therefore simplifies the fabrication process.

Abstract translation: 提供了一种载体结构，其包括：具有相对的第一和第二表面的金属氧化物板和穿过第一表面和第二表面的多个通孔; 分别形成在通孔中的多个导电部分; 以及形成在金属氧化物板的第一表面上的多个导电焊盘，其中每个导电焊盘相应地定位在多个导电部分上并与多个导电部分接触，以便电连接到多个导电部分 。 通过用金属氧化物板替代传统的硅插入器，本发明消除了如现有技术中所需要通过硅通孔形成的需要，因此简化了制造工艺。

公开(公告)号：US20150325508A1

公开(公告)日：2015-11-12

申请号：US14584428

申请日：2014-12-29

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yan-Heng Chen ,  Chung-Tang Lin ,  Chieh-Yuan Chi

IPC: H01L23/498 ,  H05K1/02 ,  H01L21/56

CPC classification number: H01L21/48 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0298 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/014

Abstract: A carrier structure is provided, which includes: a metal oxide plate having opposite first and second surfaces and a plurality of through holes penetrating the first and second surfaces; a plurality of conductive portions formed in the through holes, respectively; and a plurality of conductive pads formed on the first surface of the metal oxide plate, wherein each of the conductive pads is correspondingly positioned on and in contact with a plurality of the conductive portions so as to be electrically connected to the plurality of the conductive portions. By replacing a conventional silicon interposer with the metal oxide plate, the present invention eliminates the need to form through silicon vias as required in the prior art and therefore simplifies the fabrication process.

Abstract translation: 提供一种载体结构，其包括：具有相对的第一和第二表面的金属氧化物板和穿过第一和第二表面的多个通孔; 分别形成在通孔中的多个导电部分; 以及形成在金属氧化物板的第一表面上的多个导电焊盘，其中每个导电焊盘相应地定位在多个导电部分上并与多个导电部分接触，以便电连接到多个导电部分 。 通过用金属氧化物板替代传统的硅插入器，本发明消除了如现有技术中所需要通过硅通孔形成的需要，因此简化了制造工艺。