METHOD FOR FABRICATING AN INTERPOSER
    4.
    发明申请
    METHOD FOR FABRICATING AN INTERPOSER 有权
    用于制作间隔器的方法

    公开(公告)号:US20160020190A1

    公开(公告)日:2016-01-21

    申请号:US14744464

    申请日:2015-06-19

    Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield.

    Abstract translation: 提供了一种制造插入件的方法,其包括以下步骤:提供具有芯片安装侧和相对的外部连接侧的基板主体和连接芯片安装侧和外部连接侧的多个导电通孔,其中, 衬底主体的芯片安装侧被保护层覆盖; 在所述基板主体的外部连接侧进行切割处理; 通过其外部连接侧将衬底本体连接到载体上; 去除保护层; 并移除载体以形成多个插入物,从而简化制造工艺并提高产品产率。

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