公开(公告)号：US20150035164A1

公开(公告)日：2015-02-05

申请号：US14012447

申请日：2013-08-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Guang-Hwa Ma ,  Shih-Kuang Chiu ,  Shih-Ching Chen ,  Chun-Chi Ke ,  Chang-Lun Lu ,  Chun-Hung Lu ,  Hsien-Wen Chen ,  Chun-Tang Lin ,  Yi-Che Lai ,  Chi-Hsin Chiu ,  Wen-Tsung Tseng ,  Tsung-Te Yuan ,  Lu-Yi Chen ,  Mao-Hua Yeh

IPC: H01L23/538 ,  H01L23/00

CPC classification number: H01L24/96 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/82005 ,  H01L2224/82007 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced.

Abstract translation: 本发明提供一种半导体封装及其制造方法，包括：将具有相对的有源和非有源表面的半导体元件和邻接有源表面和非有效表面的侧表面放置在载体的沟槽中; 在所述凹槽中并且围绕所述半导体元件的侧表面的周边施加粘合剂材料; 在所述粘合剂材料和所述半导体元件的有源表面上形成介电层; 在所述电介质层上形成电连接到所述半导体元件的电路层; 以及在所述凹槽下方移除所述载体的第一部分，以将所述载体的第二部分保持在所述凹槽的侧壁上，以使所述第二部分用作支撑构件。 本发明不需要形成硅插入件，因此最终产品的总成本大大降低。

公开(公告)号：US20170148761A1

公开(公告)日：2017-05-25

申请号：US15400608

申请日：2017-01-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Guang-Hwa Ma ,  Shih-Kuang Chiu ,  Shih-Ching Chen ,  Chun-Chi Ke ,  Chang-Lun Lu ,  Chun-Hung Lu ,  Hsien-Wen Chen ,  Chun-Tang Lin ,  Yi-Che Lai ,  Chi-Hsin Chiu ,  Wen-Tsung Tseng ,  Tsung-Te Yuan ,  Lu-Yi Chen ,  Mao-Hua Yeh

IPC: H01L23/00 ,  H01L21/683 ,  H01L23/538 ,  H01L21/56

CPC classification number: H01L24/96 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/82005 ,  H01L2224/82007 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing in a groove of a carrier a semiconductor element having opposing active and non-active surfaces, and side surfaces abutting the active surface and the non-active surface; applying an adhesive material in the groove and around a periphery of the side surfaces of the semiconductor element; forming a dielectric layer on the adhesive material and the active surface of the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second portion of the carrier on a side wall of the groove intact for the second portion to function as a supporting member. The present invention does not require formation of a silicon interposer, and therefore the overall cost of a final product is much reduced.

公开(公告)号：US09515048B2

公开(公告)日：2016-12-06

申请号：US14744464

申请日：2015-06-19

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Wen-Kuang Wu ,  Tsung-Te Yuan ,  Chun-Hung Lu

IPC: H01L23/00 ,  H01L21/78 ,  H01L21/683 ,  H01L23/522

CPC classification number: H01L24/97 ,  H01L21/481 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5226 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2924/00

Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield.

Abstract translation: 提供了一种制造插入件的方法，其包括以下步骤：提供具有芯片安装侧和相对的外部连接侧的基板主体和连接芯片安装侧和外部连接侧的多个导电通孔，其中， 衬底主体的芯片安装侧被保护层覆盖; 在所述基板主体的外部连接侧进行切割处理; 通过其外部连接侧将衬底本体连接到载体上; 去除保护层; 并移除载体以形成多个插入物，从而简化制造工艺并提高产品产率。

公开(公告)号：US20160020190A1

公开(公告)日：2016-01-21

申请号：US14744464

申请日：2015-06-19

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Wen-Kuang Wu ,  Tsung-Te Yuan ,  Chun-Hung Lu

IPC: H01L23/00 ,  H01L21/78

CPC classification number: H01L24/97 ,  H01L21/481 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/147 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5226 ,  H01L24/14 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81002 ,  H01L2924/00

Abstract: A method for fabricating an interposer is provided, which includes the steps of: providing a substrate body having a chip mounting side and an opposite external connection side and a plurality of conductive through holes communicating the chip mounting side and the external connection side, wherein the chip mounting side of the substrate body is covered with a protection layer; performing a singulation process on the external connection side of the substrate body; bonding the substrate body to a carrier via the external connection side thereof; removing the protection layer; and removing the carrier to form a plurality of interposers, thereby simplifying the fabrication process and improving the product yield.

Abstract translation: 提供了一种制造插入件的方法，其包括以下步骤：提供具有芯片安装侧和相对的外部连接侧的基板主体和连接芯片安装侧和外部连接侧的多个导电通孔，其中， 衬底主体的芯片安装侧被保护层覆盖; 在所述基板主体的外部连接侧进行切割处理; 通过其外部连接侧将衬底本体连接到载体上; 去除保护层; 并移除载体以形成多个插入物，从而简化制造工艺并提高产品产率。

公开(公告)号：US20150035163A1

公开(公告)日：2015-02-05

申请号：US14012402

申请日：2013-08-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Guang-Hwa Ma ,  Shih-Kuang Chiu ,  Shih-Ching Chen ,  Chun-Chi Ke ,  Chang-Lun Lu ,  Chun-Hung Lu ,  Hsien-Wen Chen ,  Chun-Tang Lin ,  Yi-Che Lai ,  Chi-Hsin Chiu ,  Wen-Tsung Tseng ,  Tsung-Te Yuan ,  Lu-Yi Chen ,  Mao-Hua Yeh

IPC: H01L23/538 ,  H01L23/00

CPC classification number: H01L24/96 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/82005 ,  H01L2224/82007 ,  H01L2924/12042 ,  H01L2924/18162 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/00

Abstract: The present invention provides a semiconductor package and a method of fabricating the same, including: placing a semiconductor element in a groove of a carrier; forming a dielectric layer on the semiconductor element; forming on the dielectric layer a circuit layer electrically connected to the semiconductor element; and removing a first portion of the carrier below the groove to keep a second of the carrier on a sidewall of the groove intact for the second portion to function as a supporting part. The present invention does not require formation of a silicon interposer, therefore the overall cost of the final product is much reduced.

Abstract translation: 本发明提供一种半导体封装及其制造方法，包括：将半导体元件放置在载体的凹槽中; 在所述半导体元件上形成介电层; 在所述电介质层上形成电连接到所述半导体元件的电路层; 以及在所述凹槽下方移除所述载体的第一部分以将所述载体的第二载体保持在所述凹槽的侧壁上，以使所述第二部分用作支撑部分。 本发明不需要形成硅插入件，因此最终产品的总成本大大降低。