公开(公告)号：US20170311445A1

公开(公告)日：2017-10-26

申请号：US15226996

申请日：2016-08-03

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Hung-Hsien Chang ,  Jyun-Ling Tsai ,  Yu-Ling Yeh ,  Wen-Tsung Tseng ,  Yi-Che Lai

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/144 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/92125 ,  H01L2924/10155 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/35121 ,  H05K1/11 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/2072 ,  H01L2924/00012

Abstract: A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiving space so as to strengthen the bonding between the substrate and the encapsulant, thereby preventing delamination from occurring therebetween.