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    Semiconductor interposer and package structure having the same
    4.
    发明授权
    Semiconductor interposer and package structure having the same 有权
    半导体插入器和封装结构具有相同的功能

    公开(公告)号：US09263380B2

    公开(公告)日：2016-02-16

    申请号：US14515970

    申请日：2014-10-16

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Jyun-Ling Tsai ,  Chang-Lun Lu

    IPC: H01L23/12 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31

    CPC classification number: H01L23/49838 ,  H01L23/147 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16235

    Abstract: A semiconductor interposer is provided, which includes: a substrate body having a surface defined with an inner area and a peripheral area around the inner area; a plurality of conductive posts embedded in the substrate body and each having one end exposed from the surface of the substrate body; a passivation layer formed on the surface of the substrate body and having a peripheral portion formed in the peripheral area, a plurality of ring-shaped portions formed around peripheries of the exposed ends of the conductive posts in the inner area and a plurality of strip-shaped portions formed between the ring-shaped portions for connecting the ring-shaped portions; and a UBM layer formed on the exposed end of each of the conductive posts and extending on the ring-shaped portion around the periphery of the exposed end of the conductive post, thereby effectively reducing stresses to prevent warping of the semiconductor interposer.

    Abstract translation: 提供了一种半导体插入器，其包括：具有限定有内部区域的表面和围绕内部区域的周边区域的基板; 多个导电柱，其嵌入到所述基板主体中，并且每个具有从所述基板主体的表面露出的一端; 形成在所述基板主体的表面上并且具有形成在所述周边区域中的周边部分的钝化层，形成在所述内部区域中的所述导电柱的暴露端的周围的多个环状部分和多个带状部分， 形成在环形部分之间的用于连接环形部分的圆形部分; 以及形成在每个导电柱的暴露端上的UBM层，并且在导电柱的暴露端的周围的环形部分上延伸，由此有效地减少了应力以防止半导体插入件的翘曲。

    SEMICONDUCTOR INTERPOSER AND PACKAGE STRUCTURE HAVING THE SAME
    5.
    发明申请
    SEMICONDUCTOR INTERPOSER AND PACKAGE STRUCTURE HAVING THE SAME 有权
    半导体插件和具有相同的封装结构

    公开(公告)号：US20150303138A1

    公开(公告)日：2015-10-22

    申请号：US14515970

    申请日：2014-10-16

    Applicant: Siliconware Precision Industries Co., Ltd.

    Inventor： Jyun-Ling Tsai ,  Chang-Lun Lu

    IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

    CPC classification number: H01L23/49838 ,  H01L23/147 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/17 ,  H01L2224/16113 ,  H01L2224/16227 ,  H01L2224/16235

    Abstract: A semiconductor interposer is provided, which includes: a substrate body having a surface defined with an inner area and a peripheral area around the inner area; a plurality of conductive posts embedded in the substrate body and each having one end exposed from the surface of the substrate body; a passivation layer formed on the surface of the substrate body and having a peripheral portion formed in the peripheral area, a plurality of ring-shaped portions formed around peripheries of the exposed ends of the conductive posts in the inner area and a plurality of strip-shaped portions formed between the ring-shaped portions for connecting the ring-shaped portions; and a UBM layer formed on the exposed end of each of the conductive posts and extending on the ring-shaped portion around the periphery of the exposed end of the conductive post, thereby effectively reducing stresses to prevent warping of the semiconductor interposer.

    Abstract translation: 提供了一种半导体插入器，其包括：具有限定有内部区域的表面和围绕内部区域的周边区域的基板; 多个导电柱，其嵌入到所述基板主体中，并且每个具有从所述基板主体的表面露出的一端; 形成在所述基板主体的表面上并且具有形成在所述周边区域中的周边部分的钝化层，形成在所述内部区域中的所述导电柱的暴露端的周围的多个环状部分和多个带状部分， 形成在环形部分之间的用于连接环形部分的圆形部分; 以及形成在每个导电柱的暴露端上的UBM层，并且在导电柱的暴露端的周围的环形部分上延伸，由此有效地减少了应力以防止半导体插入件的翘曲。

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