公开(公告)号：US11699684B2

公开(公告)日：2023-07-11

申请号：US17234427

申请日：2021-04-19

Applicant: SK hynix Inc.

Inventor： Joo Wan Hong

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L23/13 ,  H01L23/498 ,  H01L25/18

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/367 ,  H01L23/49833 ,  H01L23/49838 ,  H01L24/14 ,  H01L25/18 ,  H01L2224/14519 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

公开(公告)号：US12255183B2

公开(公告)日：2025-03-18

申请号：US18322440

申请日：2023-05-23

Applicant: SK hynix Inc.

Inventor： Joo Wan Hong

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L25/18

Abstract: A semiconductor package includes an interposer including first and second surfaces opposite to each other. The semiconductor package also includes a heat dissipation layer disposed on the first surface of the interposer and a first semiconductor die mounted on the first surface of the interposer. The semiconductor package additionally includes a stack of second semiconductor dies mounted on the second surface of the interposer. The semiconductor package further includes a thermally conductive connection part for transferring heat from the stack of the second semiconductor dies to the heat dissipation layer.

公开(公告)号：US09941253B1

公开(公告)日：2018-04-10

申请号：US15597484

申请日：2017-05-17

Applicant: Sk hynix Inc.

Inventor： Yeon Seung Jung ,  Jin Woo Park ,  Joo Wan Hong

IPC: H01L25/065 ,  H01L23/538 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/538 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06568 ,  H01L2225/06582 ,  H01L2924/15311

Abstract: A semiconductor package and or method of fabricating a semiconductor package may be provided. The semiconductor package may include a package substrate. The semiconductor package may include a first semiconductor die coupled to the package substrate by first interconnectors. The semiconductor package may include a second semiconductor die coupled to the first semiconductor die by second interconnectors. The second semiconductor die may be coupled to the substrate.