公开(公告)号：US07438563B2

公开(公告)日：2008-10-21

申请号：US11295208

申请日：2005-12-05

申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

IPC分类号： H01R4/58

CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件和在高密度导电硅树脂部件下方基本上垂直取向形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。

公开(公告)号：US08502553B2

公开(公告)日：2013-08-06

申请号：US13007721

申请日：2011-01-17

申请人： Soon-Geol Hwang

发明人： Soon-Geol Hwang

IPC分类号： G01R31/02 ,  G01R31/26

CPC分类号： G01R31/26

摘要： A semiconductor package test apparatus having a test head and a test handler is provided. The semiconductor package test apparatus may include an insert in which a plurality of semiconductor packages are stacked and received in an offset fashion. Further, the semiconductor package test apparatus may include a plurality of sockets located adjacent to the insert and each of the inserts may have a plurality of socket pins. The sockets have different surface levels and are aligned with the semiconductor packages.

摘要翻译： 提供了具有测试头和测试处理器的半导体封装测试设备。 半导体封装测试装置可以包括其中以偏移的方式堆叠和接收多个半导体封装的插入件。 此外，半导体封装测试装置可以包括邻近插入件定位的多个插座，并且每个插入件可以具有多个插座销。 插座具有不同的表面电平并与半导体封装对准。

公开(公告)号：US08981804B2

公开(公告)日：2015-03-17

申请号：US13530273

申请日：2012-06-22

申请人： Hun-Kyo Seo ,  Soon-Geol Hwang ,  Jang-Sun Kim

发明人： Hun-Kyo Seo ,  Soon-Geol Hwang ,  Jang-Sun Kim

IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R31/28

CPC分类号： G01R1/0466 ,  G01R31/2889

摘要： A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.

摘要翻译： 接触装置包括具有第一表面和第二表面的推动器，第一表面连接到压力单元，从推动器的第二表面的边缘突出的止动件远离压力单元;推动器块，其具有彼此面对的第一和第二表面 ，所述第一表面面向所述推动器，并且所述第二表面连接到半导体器件，将推动器连接到推动器块的联接构件以及设置在推动器和推动器块之间的连接器，连接器的至少一部分表面 圆形表面与推动器或推动块形成点接触。

公开(公告)号：US20130088250A1

公开(公告)日：2013-04-11

申请号：US13530273

申请日：2012-06-22

申请人： Hun-Kyo SEO ,  Soon-Geol Hwang ,  Jang-Sun Kim

发明人： Hun-Kyo SEO ,  Soon-Geol Hwang ,  Jang-Sun Kim

IPC分类号： G01R31/26 ,  G01R1/067

CPC分类号： G01R1/0466 ,  G01R31/2889

摘要： A contact apparatus includes a pusher having first and second surfaces, the first surface being connected to a pressure unit, stoppers protruding from edges of the second surface of the pusher away from the pressure unit, a pusher block having first and second surfaces facing each other, the first surface facing the pusher, and the second surface being connected to a semiconductor device, coupling members connecting the pusher to the pusher block, and a connector disposed between the pusher and the pusher block, at least part of a surface of the connector being circular, and the circular surface making a point contact with the pusher or the pusher block.

摘要翻译： 接触装置包括具有第一表面和第二表面的推动器，第一表面连接到压力单元，从推动器的第二表面的边缘突出的止动件远离压力单元;推动器块，其具有彼此面对的第一和第二表面 ，所述第一表面面向所述推动器，并且所述第二表面连接到半导体器件，将推动器连接到推动器块的联接构件以及设置在推动器和推动器块之间的连接器，连接器的至少一部分表面 圆形表面与推动器或推动块形成点接触。

公开(公告)号：US20110215826A1

公开(公告)日：2011-09-08

申请号：US13007721

申请日：2011-01-17

申请人： Soon-Geol Hwang

发明人： Soon-Geol Hwang

IPC分类号： G01R31/26

CPC分类号： G01R31/26

摘要： A semiconductor package test apparatus having a test head and a test handler is provided. The semiconductor package test apparatus may include an insert in which a plurality of semiconductor packages are stacked and received in an offset fashion. Further, the semiconductor package test apparatus may include a plurality of sockets located adjacent to the insert and each of the inserts may have a plurality of socket pins. The sockets have different surface levels and are aligned with the semiconductor packages.

摘要翻译： 提供了具有测试头和测试处理器的半导体封装测试设备。 半导体封装测试装置可以包括其中以偏移的方式堆叠和接收多个半导体封装的插入件。 此外，半导体封装测试装置可以包括邻近插入件定位的多个插座，并且每个插入件可以具有多个插座销。 插座具有不同的表面电平并与半导体封装对准。

公开(公告)号：US20060121757A1

公开(公告)日：2006-06-08

申请号：US11295208

申请日：2005-12-05

申请人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

发明人： Young-Bae Chung ,  Hyun-Seop Shim ,  Jeong-Ho Bang ,  Jae-Il Lee ,  Hyun-Kyo Seo ,  Young-Soo An ,  Soon-Geol Hwang

IPC分类号： H01R4/58

CPC分类号： G01R1/0483 ,  G01R1/045 ,  G01R1/0466 ,  G01R31/2863

摘要： In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.

摘要翻译： 在一个实施例中，使用绝缘硅氧烷粉末和导电粉末的混合物制造连接器。 连接器包括由绝缘硅氧烷粉末形成的连接器主体，并且通过将导电粉末迁移到对应于半导体封装的焊料球的连接部位而形成的或更优选地规则排列的导电硅树脂构件。 导电硅树脂构件包括形成为接近连接器主体的上表面并从其突出的高密度导电硅树脂部件，以及在高密度导电硅树脂部件下方大致垂直取向地形成的低密度导电硅树脂部件， 低密度导电硅部件，其具有从连接器本体的下表面露出的下表面。