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公开(公告)号:US06635839B1
公开(公告)日:2003-10-21
申请号:US09838672
申请日:2001-04-19
申请人: Glen P. Gilfeather , Srikar V. Chunduri , Brennan V. Davis , David H. Eppes , Victoria Bruce , Michael Bruce , Rosalinda M. Ring , Daniel Stone
发明人: Glen P. Gilfeather , Srikar V. Chunduri , Brennan V. Davis , David H. Eppes , Victoria Bruce , Michael Bruce , Rosalinda M. Ring , Daniel Stone
IPC分类号: B07C500
CPC分类号: G01N21/9501 , G01R31/311
摘要: Semiconductor die analysis is enhanced using a system that is adapted to perturb a die in a test chamber and to detect a response from the die to the perturbation. According to an example embodiment of the present invention, a semiconductor die analysis system includes a test chamber and a docking arrangement adapted to dock with the test chamber. A die is held in the docking arrangement and is presented inside of the test chamber when the docking arrangement is docked with the chamber. Two or more perturbation devices are used to perturb the die, and controller is adapted to control the perturbation. A data acquisition arrangement receives data from the die in response to the perturbation, and the data is used for analyzing the die.
摘要翻译: 使用适于扰动测试室中的管芯并检测从管芯到扰动的响应的系统来增强半导体管芯分析。 根据本发明的示例性实施例,半导体管芯分析系统包括测试室和适于与测试室对接的对接装置。 模具保持在对接装置中,并且当对接装置与腔室对接时,将模具放置在测试室的内部。 使用两个或更多个扰动装置扰乱管芯,并且控制器适于控制扰动。 数据采集装置响应于扰动从管芯接收数据,并且数据用于分析管芯。
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公开(公告)号:US06844928B1
公开(公告)日:2005-01-18
申请号:US09838717
申请日:2001-04-19
申请人: Glen P. Gilfeather , Srikar V. Chunduri , Brennan V. Davis , David H. Eppes , Victoria Bruce , Michael Bruce , Rosalinda M. Ring , Daniel Stone
发明人: Glen P. Gilfeather , Srikar V. Chunduri , Brennan V. Davis , David H. Eppes , Victoria Bruce , Michael Bruce , Rosalinda M. Ring , Daniel Stone
CPC分类号: G01N21/9501
摘要: The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that directs light between a light source and a die. In one example embodiment of the present invention, a light source is directed to a die in a semiconductor analysis arrangement using a fiber optic cable. The analysis arrangement is adapted to use light received via the fiber optic cable to analyze the die. The analysis includes one or more light-based applications, such as stimulating a selected portion of the die with the light and detecting a response therefrom. In this manner, light can be directed to a die in a variety of analysis implementations, such as for analyzing a die in a test chamber.
摘要翻译: 使用在光源和管芯之间引导光的方法和装置来增强基于光的半导体管芯分析的可操作性。 在本发明的一个示例实施例中,使用光纤电缆将光源引导到半导体分析装置中的管芯。 分析装置适于使用经由光纤电缆接收的光来分析模具。 该分析包括一种或多种基于光的应用,例如用光刺激所述裸片的选定部分并检测其中的响应。 以这种方式,可以在各种分析实现中将光导向模具,例如用于在测试室中分析模具。
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公开(公告)号:US06700659B1
公开(公告)日:2004-03-02
申请号:US09838671
申请日:2001-04-19
申请人: Srikar V. Chunduri , Glen P. Gilfeather , Brennan V. Davis , David H. Eppes , Victoria Bruce , Michael Bruce , Rosalinda M. Ring , Daniel Stone
发明人: Srikar V. Chunduri , Glen P. Gilfeather , Brennan V. Davis , David H. Eppes , Victoria Bruce , Michael Bruce , Rosalinda M. Ring , Daniel Stone
IPC分类号: G01N2188
CPC分类号: G01R31/311 , G01N21/9501
摘要: The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that can detect light leakage between a light source and a die. In one example embodiment of the present invention, a light source is directed to a semiconductor analysis arrangement using, for example, a fiber optic cable. The analysis arrangement is adapted to use light from the light source for analyzing the die. A light detection arrangement detects a condition of light leakage from the system and generates a signal representing the condition of light leakage. The generated signal can then be used to control the semiconductor analysis arrangement, such as by deactivating the light source in response to a detected leak, or by allowing the light source to function in response to not detecting a leak.
摘要翻译: 使用可以检测光源和管芯之间的光泄漏的方法和装置来增强基于光的半导体管芯分析的可操作性。 在本发明的一个示例性实施例中,使用例如光纤电缆将光源引导到半导体分析装置。 分析装置适于使用来自光源的光来分析模具。 光检测装置检测来自系统的光泄漏的状况,并产生表示漏光状况的信号。 所产生的信号然后可以用于控制半导体分析装置,例如通过响应于检测到的泄漏而停用光源,或者通过允许光源响应于不检测泄漏而起作用。
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公开(公告)号:US06417068B1
公开(公告)日:2002-07-09
申请号:US09247001
申请日:1999-02-08
申请人: Victoria Bruce , Susan Li , Jeffrey D. Birdsley
发明人: Victoria Bruce , Susan Li , Jeffrey D. Birdsley
IPC分类号: H01L2176
CPC分类号: H01L23/544 , B23K26/0624 , H01L23/525 , H01L2223/54473 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01077 , H01L2924/15174 , H01L2924/15311 , H01L2224/05599
摘要: According to one aspect of the disclosure, the present invention provides methods and arrangements for milling the substrate of a semiconductor device and exposing a selected region in the substrate. A laser is directed at a selected area of the back side of the device to create a small marker to be used for alignment during the milling process. The substrate is then milled to expose the selected area within the substrate, using the marker as alignment.
摘要翻译: 根据本公开的一个方面,本发明提供了用于铣削半导体器件的衬底并暴露衬底中的选定区域的方法和布置。 激光被引导到设备背面的选定区域,以产生在铣削过程中用于对准的小标记。 然后将衬底研磨以暴露衬底内的选定区域,使用标记作为对准。
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