公开(公告)号：US07040017B2

公开(公告)日：2006-05-09

申请号：US10251483

申请日：2002-09-19

申请人： Stephen M. Smith ,  Randolph E. Treur

发明人： Stephen M. Smith ,  Randolph E. Treur

IPC分类号： B21K21/08 ,  B05B1/14

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902 ,  Y10T29/49432 ,  Y10T29/49433

摘要： A fluid delivery module for use in preparing a substrate is provided. The fluid delivery module includes a process bowl designed to contain a substrate to be prepared. The process bowl has a bottom wall and a sidewall. The fluid delivery module further includes a fluid delivery ring configured to be attached to the sidewall of the process bowl. The fluid delivery ring includes a plurality of inlet and outlet pairs. Each of the plurality of inlet and outlet pairs is defined in the fluid ring and is designed to receive a respective supply tube. Each respective supply tube has an end that terminates at each of the outlets of the fluid delivery ring and is configured to direct fluid onto a surface of the substrate.

摘要翻译： 提供了一种用于制备基板的流体输送模块。 流体输送模块包括设计成容纳要制备的基底的处理碗。 处理碗具有底壁和侧壁。 流体输送模块还包括流体输送环，该流体输送环被配置为附接到处理碗的侧壁。 流体输送环包括多个入口和出口对。 多个入口和出口对中的每一个限定在流体环中并且被设计成容纳相应的供给管。 每个相应的供应管具有终止于流体输送环的每个出口处的端部，并且构造成将流体引导到基板的表面上。

公开(公告)号：US06481447B1

公开(公告)日：2002-11-19

申请号：US09672173

申请日：2000-09-27

申请人： Stephen M. Smith ,  Randolph E. Treur

发明人： Stephen M. Smith ,  Randolph E. Treur

IPC分类号： B08B302

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902 ,  Y10T29/49432 ,  Y10T29/49433

摘要： A fluid delivery module for use in preparing a substrate is provided. The fluid delivery module includes a process bowl designed to contain a substrate to be prepared. The process bowl has a bottom wall and a sidewall. The fluid delivery module further includes a fluid delivery ring configured to be attached to the sidewall of the process bowl. The fluid delivery ring includes a plurality of inlet and outlet pairs. Each of the plurality of inlet and outlet pairs is defined in the fluid ring and is designed to receive a respective supply tube. Each respective supply tube has an end that terminates at each of the outlets of the fluid delivery ring and is configured to direct fluid onto a surface of the substrate.

摘要翻译： 提供了一种用于制备基板的流体输送模块。 流体输送模块包括设计成容纳要制备的基底的处理碗。 处理碗具有底壁和侧壁。 流体输送模块还包括流体输送环，该流体输送环被配置为附接到处理碗的侧壁。 流体输送环包括多个入口和出口对。 多个入口和出口对中的每一个限定在流体环中并且被设计成接收相应的供给管。 每个相应的供应管具有终止于流体输送环的每个出口处的端部，并且构造成将流体引导到基板的表面上。

公开(公告)号：US07494550B2

公开(公告)日：2009-02-24

申请号：US11285986

申请日：2005-11-23

申请人： Stephen M. Smith ,  Randolph E. Treur

发明人： Stephen M. Smith ,  Randolph E. Treur

IPC分类号： B08B3/02

CPC分类号： H01L21/67051 ,  B08B3/02 ,  Y10S134/902 ,  Y10T29/49432 ,  Y10T29/49433

摘要： A method for rinsing a semiconductor wafer in a module utilizing a fluid delivery ring is provided. The method includes providing a process bowl having a generally circular shape bottom wall, a sidewall that extends upwardly from the bottom wall to define a cylindrical chamber, and a plurality of channels in the sidewall that extend from the bottom wall to an upper edge of the sidewall. A fluid delivery ring is attached onto the sidewall of the process bowl. Utilizing the process bowl, a plurality of supply tubes is inserted into the fluid delivery ring. The fluid delivery ring has a plurality of ring inlet and outlet pairs and a plurality of respective slots. Fluid is supplied to the supply tubes, and fluid is directed onto a surface of the semiconductor wafer defined within the process bowl.

摘要翻译： 提供了一种利用流体输送环冲洗模块中的半导体晶片的方法。 该方法包括提供具有大致圆形形状的底壁的过程碗，从底壁向上延伸以限定圆柱形室的侧壁，以及在侧壁中从底壁延伸到上边缘的多个通道 侧壁。 流体输送环附接到处理碗的侧壁上。 利用处理碗，将多个供给管插入到流体输送环中。 流体输送环具有多个环入口和出口对以及多个相应的槽。 流体被供应到供应管，并且流体被引导到在处理碗内限定的半导体晶片的表面上。

公开(公告)号：US07087122B2

公开(公告)日：2006-08-08

申请号：US11005754

申请日：2004-12-06

申请人： Stephen M. Smith ,  Randolph E. Treur

发明人： Stephen M. Smith ,  Randolph E. Treur

IPC分类号： B08B7/00 ,  C23F1/00

CPC分类号： H01L21/68728 ,  H01L21/68785 ,  H01L21/68792

摘要： A method for spinning a wafer to enable rinsing and drying is provided. The method includes engaging the wafer at a wafer processing plane and spinning the wafer. The method further includes moving a wafer backside plate from a first position to a second position as spinning of the wafer proceeds to an optimum spinning speed. The second position defines a reduced gap between an under surface of the wafer and a top surface of the wafer backside plate. The method also includes repositioning the wafer backside plate from the second position to the first position as the spinning reduces in speed. The first position defines an enlarged gap to enable loading and unloading of the wafer from the engaged position.

摘要翻译： 提供了一种用于纺丝晶片以实现冲洗和干燥的方法。 该方法包括使晶片在晶片处理平面处接合并旋转晶片。 该方法还包括当晶片的旋转进行到最佳旋转速度时，将晶片背面板从第一位置移动到第二位置。 第二位置限定晶片的下表面和晶片背面板的顶表面之间的减小的间隙。 该方法还包括当旋转速度降低时将晶片背面板从第二位置重新定位到第一位置。 第一位置限定了扩大的间隙，以使晶片能够从接合位置加载和卸载。

公开(公告)号：US06827092B1

公开(公告)日：2004-12-07

申请号：US09747660

申请日：2000-12-22

申请人： Stephen M. Smith ,  Randolph E. Treur

发明人： Stephen M. Smith ,  Randolph E. Treur

IPC分类号： B08B300

CPC分类号： H01L21/68728 ,  H01L21/68785 ,  H01L21/68792

摘要： An apparatus for preparing a wafer is provided. The apparatus includes a wafer backside plate and a central shaft. The wafer backside plate has a top surface that includes a cylindrical edge lip, which defines a central aperture. The central shaft is designed to fit within the central aperture. The wafer backside plate is designed to automatically slide between an up position during rotational wager processing and a down position when the wafer is not in rotational wafer processing. A gap defined between the top surface of the wafer backside plate and the wafer is less when the wafer backside plate is in the up position than when the wafer backside plate is in the down position.

摘要翻译： 提供了一种用于制备晶片的装置。 该装置包括晶片背面板和中心轴。 晶片背面板具有顶表面，其包括限定中心孔的圆柱形边缘。 中心轴设计成适合中心孔。 晶片背面板被设计成在旋转下注处理期间的上升位置和当晶片不处于旋转晶片处理时的向下位置之间自动滑动。 当晶片背面板处于向上位置时，当晶片背面板处于向下位置时，在晶片背面板的顶表面和晶片之间限定的间隙较小。

公开(公告)号：US06578853B1

公开(公告)日：2003-06-17

申请号：US09747665

申请日：2000-12-22

申请人： Randolph E. Treur ,  Stephen M. Smith

发明人： Randolph E. Treur ,  Stephen M. Smith

IPC分类号： H01L21304

CPC分类号： H01L21/68728 ,  G03F7/3021 ,  H01L21/68785 ,  H01L21/68792 ,  Y10S134/902 ,  Y10T279/185 ,  Y10T279/1973

摘要： A chuck assembly for use in a substrate spin, rinse, and dry (SRD) module is provided. The chuck assembly includes a wedge, a chuck body, and a plurality of grippers. The wedge has a sidewall and is designed to move from a lower position to an upper position and from the upper position to the lower position thus opening and closing the chuck assembly, respectively. The chuck body has a cylindrical shape and is designed to include a plurality of linkage arms. The chuck body is designed to enclose the wedge such that each linkage arm is substantially in contact with the sidewall of the wedge. The cylindrical shape of the chuck body is designed to reduce air disturbance around a surface of a substrate. The plurality of grippers are designed to be coupled to the chuck body via a plurality of rotation pins. Each of the grippers is configured to stand substantially upright so as to engage the substrate when the wedge is in a lower position, and each of the grippers is configured to lie substantially flat so as to disengage the substrate when the wedge is in the lower position.

摘要翻译： 提供了一种用于衬底旋转，冲洗和干燥（SRD）模块的卡盘组件。 卡盘组件包括楔形物，卡盘主体和多个夹具。 楔形件具有侧壁并且被设计成从下部位置移动到上部位置并且从上部位置移动到下部位置，从而分别打开和关闭卡盘组件。 卡盘体具有圆筒形状并且被设计成包括多个连杆臂。 卡盘体被设计成围绕楔形物，使得每个连杆臂基本上与楔形物的侧壁接触。 卡盘体的圆柱形被设计成减小基体表面周围的空气扰动。 多个夹持器被设计成经由多个旋转销耦合到卡盘主体。 每个夹持器构造成基本上竖直地站立，以便当楔形件处于较低位置时接合基板，并且每个夹具构造成基本上平坦，以便当楔形件处于较低位置时使基板脱离 。

公开(公告)号：US06866051B1

公开(公告)日：2005-03-15

申请号：US10259023

申请日：2002-09-26

申请人： Afshin Nickhou ,  Randolph E. Treur ,  Michael Ravkin

发明人： Afshin Nickhou ,  Randolph E. Treur ,  Michael Ravkin

IPC分类号： B08B3/12 ,  H01L21/00

CPC分类号： H01L21/67057 ,  B08B3/12 ,  Y10S134/902

摘要： A megasonic module for substrate processing is provided. Embodiments of the present invention include a tank configured to hold processing fluids in which the substrate is submerged, and a lid configured to mate with and seal the tank. At least two megasonic transducers are positioned within the megasonic module to direct megasonic energy to each of an active surface and a backside surface of the substrate. A pair of drive wheels are configured to receive an edge of the substrate to support and rotate the substrate in a horizontal orientation between the at least two megasonic transducers. The substrate is supported against the pair of drive wheels by a substrate stabilizing arm/wheel which also allows the rotation of the substrate. A drive motor is configured to rotate the pair of drive wheels, and a fluid recirculation system provides for temperature control and use of a plurality of processing fluids.

摘要翻译： 提供了用于基板处理的兆声模块。 本发明的实施例包括一种被配置为保持其中浸没了基底的处理流体的罐和构造成与罐相配合并密封的盖。 至少两个兆声传感器位于兆声波模块内，以将兆声波能量引导到基板的有源表面和背面。 一对驱动轮被构造成接收基板的边缘以在至少两个兆声换能器之间水平取向地支撑和旋转基板。 基板通过基板稳定臂/轮支撑在一对驱动轮上，基板稳定臂/轮也允许基板旋转。 驱动马达被配置成旋转所述一对驱动轮，并且流体再循环系统提供多个处理流体的温度控制和使用。

公开(公告)号：US06748961B2

公开(公告)日：2004-06-15

申请号：US09823813

申请日：2001-03-30

申请人： Randolph E. Treur

发明人： Randolph E. Treur

IPC分类号： B08B302

CPC分类号： H01L21/67028 ,  Y10S134/902

摘要： A wafer preparation module is provided. The wafer preparation module includes an enclosure, which contains wafer engaging rollers. The wafer engaging rollers are oriented at an angle and are designed to spin a wafer at an angle during preparation.

摘要翻译： 提供了晶片制备模块。 晶片制备模块包括一个包含晶圆接合辊的外壳。 晶片接合辊以一定角度取向，并被设计成在制备期间以一定角度旋转晶片。

公开(公告)号：US06558964B2

公开(公告)日：2003-05-06

申请号：US09752614

申请日：2000-12-27

申请人： Randolph E. Treur

发明人： Randolph E. Treur

IPC分类号： H01L2166

CPC分类号： H01L21/67253 ,  H01L21/67034 ,  Y10S438/974

摘要： In one method for monitoring a semiconductor wafer during a spin drying operation, a capacitance value between a capacitance sensor and the wafer is measured as the wafer is being spun to dry a surface thereof. When it is determined that the measured capacitance value has reached a substantially constant level, a signal is generated indicating that the surface of the semiconductor wafer is dry. In another method, light is directed toward a surface of the wafer as the wafer is being spun to dry a surface thereof. The light is directed such that the light that reflects off of the surface of the wafer is substantially perpendicular to the surface of the wafer. The intensity of the light reflected off of the surface of the semiconductor wafer is measured. A signal indicating that the surface of the wafer is dry is generated when the measured intensity of the light reflected off of the surface of the wafer reaches an intensity level that corresponds to a measured intensity of light reflected off of the surface of the wafer when the surface is dry. In methods for spin drying a semiconductor wafer, spinning of the wafer is stopped in response to the signal. Apparatus for spin drying a semiconductor wafer including either a capacitance sensor or an interferometric sensor also are described.

公开(公告)号：US06488568B1

公开(公告)日：2002-12-03

申请号：US09712825

申请日：2000-11-14

申请人： Randolph E. Treur ,  John M. Boyd ,  Stephan H. Wolf

发明人： Randolph E. Treur ,  John M. Boyd ,  Stephan H. Wolf

IPC分类号： B24B722

CPC分类号： B24B37/013 ,  B24B49/12 ,  B24D7/12

摘要： An optical endpoint system for a CMP system with a viewport located off-center on the platen, said view port being adjustable in height so that the window of the viewport can be made flush with the top of the polishing pad.

摘要翻译： 一种用于CMP系统的光学终点系统，其具有位于压板上偏心的视口，所述视口可高度调节，使得视口的窗口可以与抛光垫的顶部齐平。