公开(公告)号：US20100091472A1

公开(公告)日：2010-04-15

申请号：US12411713

申请日：2009-03-26

申请人： Steven A. KUMMERL ,  Sreenivasan K. Koduri

发明人： Steven A. KUMMERL ,  Sreenivasan K. Koduri

IPC分类号： H01R9/00 ,  H01L21/50

CPC分类号： H01L25/105 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49589 ,  H01L24/16 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.

摘要翻译： 各种示例性实施例提供半导体封装的部件，装置和方法。 所公开的封装部件可以包括设置在引线框架周围的模具材料和至少一个集成电路（IC），其中IC与引线框架的一侧电连接。 包括例如引线段的引线框架的相对侧可以从模具材料露出。 然后可以通过暴露的区域来组装各种其它部件，装置和包装件，例如超过公开的包装部件，以便改善包装密度。

公开(公告)号：US20120015479A1

公开(公告)日：2012-01-19

申请号：US13244384

申请日：2011-09-24

申请人： Steven A. KUMMERL ,  Sreenivasan K. KODURI

发明人： Steven A. KUMMERL ,  Sreenivasan K. KODURI

IPC分类号： H01L21/60

CPC分类号： H01L25/105 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49551 ,  H01L23/49589 ,  H01L24/16 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Various exemplary embodiments provide components, devices, and methods of semiconductor packaging. The disclosed packaging component can include a mold material disposed around a lead frame and at least an integrated circuit (IC), wherein the IC is electrically connected with one side of the lead frame. The opposite side of the lead frame including, for example, lead segments, can be exposed from the mold material. A variety of other components, devices, and packages can then be assembled, e.g., over the disclosed packaging component, through the exposed regions so as to improve packaging densities.

摘要翻译： 各种示例性实施例提供半导体封装的部件，装置和方法。 所公开的封装部件可以包括设置在引线框架周围的模具材料和至少一个集成电路（IC），其中IC与引线框架的一侧电连接。 包括例如引线段的引线框架的相对侧可以从模具材料露出。 然后可以通过暴露的区域来组装各种其它部件，装置和包装件，例如超过公开的包装部件，以便改善包装密度。