WIRESAW CUTTING METHOD
    2.
    发明申请
    WIRESAW CUTTING METHOD 有权
    WIRESAW切割方法

    公开(公告)号:US20110303210A1

    公开(公告)日:2011-12-15

    申请号:US13139017

    申请日:2009-12-21

    IPC分类号: B28D5/00

    摘要: The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.

    摘要翻译: 本发明提供了一种线锯切割方法,其包括:在从切屑流体的再循环储存器中向线锯施加水性切削液的同时用线锯切割工件,监测化学性质,物理特性或两者中的至少一个,并调整 在切割工件时切削液的化学成分保持被监测的性能。 本发明另外提供了一种执行本发明方法的装置。

    Wiresaw cutting method
    4.
    发明授权
    Wiresaw cutting method 有权
    焊丝切割方法

    公开(公告)号:US08960177B2

    公开(公告)日:2015-02-24

    申请号:US13139017

    申请日:2009-12-21

    摘要: The present invention provides a wiresaw cutting method comprising cutting a workpiece with a wiresaw while applying an aqueous cutting fluid to the wiresaw from a recirculating reservoir of cutting fluid, monitoring at least one of a chemical property, a physical property, or both, and adjusting the chemical composition of the cutting fluid while cutting the workpiece to maintain the property being monitored. The present invention additionally provides an apparatus to perform the inventive method.

    摘要翻译: 本发明提供了一种线锯切割方法,其包括:在从切屑流体的再循环储存器中向线锯施加水性切削液的同时用线锯切割工件,监测化学性质,物理特性或两者中的至少一个,并调整 在切割工件时切削液的化学成分保持被监测的性能。 本发明另外提供了一种执行本发明方法的装置。

    Polypyrrolidone polishing composition and method
    6.
    发明授权
    Polypyrrolidone polishing composition and method 有权
    聚吡咯烷酮抛光组合物及方法

    公开(公告)号:US08821215B2

    公开(公告)日:2014-09-02

    申请号:US13606599

    申请日:2012-09-07

    申请人: Nevin Naguib Sant

    发明人: Nevin Naguib Sant

    IPC分类号: B24B37/04

    摘要: The invention provides a polishing composition containing a pyrrolidone polymer, an aminophosphonic acid, a tetraalkylammonium salt, and water, wherein the composition has a pH of about 7 to about 11.7. The invention further provides a method of using such a polishing composition to polish a substrate, especially a substrate containing silicon.

    摘要翻译: 本发明提供一种包含吡咯烷酮聚合物,氨基膦酸,四烷基铵盐和水的抛光组合物,其中所述组合物的pH为约7至约11.7。 本发明还提供了使用这种抛光组合物来抛光衬底,特别是含有硅的衬底的方法。