摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
摘要:
A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.
摘要:
A prosthetic hip stem for use in a prosthetic hip joint. The hip stem generally includes a core having a stem portion and a neck portion, a polymer matrix layer substantially covering the stem portion of the core, and a porous metal layer substantially covering the polymer matrix layer. The polymer matrix layer connects the core and the porous metal layer, and may be injection molded therebetween. The neck portion of the hip stem has a relatively thin or slender profile which allows for an increased degree of articulating movement of the hip stem with respect to the acetabular component of a prosthetic hip joint. The neck portion of the hip stem additionally includes a version indicator element, such as a bump or a protrusion, which may be tactilely felt by a surgeon to aid the surgeon in positioning the hip stem during a minimally invasive total hip arthroplasty procedure, for example, where direct visualization of the hip stem by the surgeon may not be possible. Additionally, the core of the hip stem includes grooves, ridges, flats, dimples or other features to enhance the mechanical interconnection between the core and the polymer matrix layer.
摘要:
An orthopaedic implant is forged from a metallic body consisting of a cobalt-chromium alloy. The forged implant is descaled by blasting the implant with a particulate blasting agent at a momentum which is sufficient to remove scale formed on the implant during the forging step but insufficient to otherwise cause major structural surface deformation to the implant. The descaled implant is electro-chemical polished by submersing the implant in an acid bath having a temperature of between approximately 80.degree. F. and 90.degree. F. The acid bath includes approximately 45% sulfuric acid and 50% phosphoric acid. Direct current electrical power ranging between approximately 10 volts D.C. and 13 volts D.C. is applied to the implant. The polished implant is ultrasonically cleaned. The implant is inspected with a fluorescent penetrant to determine whether surface defects exist in the implant.