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公开(公告)号:US07786944B2
公开(公告)日:2010-08-31
申请号:US11923873
申请日:2007-10-25
申请人: Steven J. Franson , Bruce Bosco
发明人: Steven J. Franson , Bruce Bosco
IPC分类号: H01Q13/10
CPC分类号: H01Q13/085 , H01Q1/38 , H01Q1/525
摘要: A communication device (110, 210) has an antenna (150, 152, 250, 252) positioned on a multilayer substrate/printed circuit board (154, 254, 254′). A first high frequency material (116, 216) is disposed over a first side of the substrate (154, 254) characterized for low frequency devices. A conductive layer (118, 218) is patterned over the first high frequency material (116, 216), defining first and second circuit traces (122, 124, 222, 224) and first and second antenna traces (132, 134, 232, 234). The first and second antenna traces (132, 134, 232, 234) define a first slot (116, 216) in the first conductive layer (122, 222), which is aligned with a cutout (162, 262) defined by the substrate (154, 254). One of a transmitter (112, 212) and a receiver (114, 214) are disposed over the high frequency material (116, 216) and coupled to the edge emitting antenna (150, 250) by the first and second circuit traces (122, 124, 222, 224). The other of the transmitter (112) and receiver (114) may be positioned on the same or opposed side (aligned or staggered) of the substrate (254) in a similar manner. One or more layers (262), which may be patterned to provide resonant features, are formed between the substrate (254, 254′) for isolation.
摘要翻译: 通信设备(110,210)具有位于多层基板/印刷电路板(154,254,254')上的天线(150,152,250,252)。 第一高频材料(116,216)设置在衬底(154,254)的第一侧上,其特征在于用于低频器件。 导电层(118,218)在第一高频材料(116,216)上图案化,限定第一和第二电路迹线(122,124,222,224)以及第一和第二天线迹线(132,134,232, 234)。 第一和第二天线迹线(132,134,232,234)在第一导电层(122,222)中限定第一槽(116,216),其与由衬底限定的切口(162,262)对准 (154,254)。 发射器(112,212)和接收器(114,214)中的一个设置在高频材料(116,216)之上,并通过第一和第二电路迹线(122)耦合到边缘发射天线(150,250) ,124,222,224)。 发射器(112)和接收器(114)中的另一个可以以类似的方式定位在衬底(254)的相同或相对侧(对齐或交错)上。 可以在衬底(254,254')之间形成可以被图案化以提供谐振特征的一个或多个层(262),用于隔离。
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公开(公告)号:US20060267181A1
公开(公告)日:2006-11-30
申请号:US11139400
申请日:2005-05-27
申请人: Rudy Emrick , Bruce Bosco , Stephen Rockwell
发明人: Rudy Emrick , Bruce Bosco , Stephen Rockwell
IPC分类号: H01L23/14
CPC分类号: H01L23/49894 , H01L23/145 , H01L23/49827 , H01L23/49833 , H01L23/66 , H01L24/48 , H01L25/0657 , H01L2223/6627 , H01L2224/32145 , H01L2224/48235 , H01L2924/00014 , H01L2924/12044 , H01L2924/14 , H01L2924/1903 , H01L2924/19104 , H01L2924/3011 , H05K1/0271 , H05K3/4632 , H05K3/4688 , H05K2201/0141 , H05K2201/068 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: A device (10) is provided for matching the CTE between substrates (12, 14), e.g., a semiconductor substrate and packaging material. The first substrate (12) has a first coefficient of thermal expansion and the second substrate (14) has a second coefficient of thermal expansion. At least two layers (16) of liquid crystal polymer are formed between the first substrate (12) and the second substrate (14), each layer having a unique coefficient of thermal expansion progressively higher in magnitude from the first substrate (12) to the second substrate (14).
摘要翻译: 提供了一种用于使诸如半导体衬底和包装材料的衬底(12,14)之间的CTE匹配的装置(10)。 第一基板(12)具有第一热膨胀系数,第二基板(14)具有第二热膨胀系数。 在第一基板(12)和第二基板(14)之间形成至少两层液晶聚合物层(16),每层具有从第一基板(12)到第二基板(12)的尺寸逐渐变高的独特的热膨胀系数 第二基板(14)。
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公开(公告)号:US20070001287A1
公开(公告)日:2007-01-04
申请号:US11174268
申请日:2005-06-29
申请人: Bruce Bosco , Rudy Emrick , Steven Franson , John Holmes , Stephen Rockwell
发明人: Bruce Bosco , Rudy Emrick , Steven Franson , John Holmes , Stephen Rockwell
IPC分类号: H01L23/12
CPC分类号: H01L23/10 , H01L2924/0002 , H01L2924/01079 , H01L2924/09701 , H01L2924/1423 , H01L2924/3011 , H01L2924/00
摘要: A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).
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公开(公告)号:US20060092086A1
公开(公告)日:2006-05-04
申请号:US10978779
申请日:2004-10-29
申请人: Steven Franson , Bruce Bosco , Rudy Emrick , John Holmes
发明人: Steven Franson , Bruce Bosco , Rudy Emrick , John Holmes
IPC分类号: H01Q13/10
CPC分类号: H01Q13/085 , G01S7/032
摘要: In one embodiment, an improved transceiver assembly for a vehicle capable of detecting potentially hazardous objects is disclosed. The transceiver assembly comprises a tapered slot feed antenna for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that oscillates to sweep the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna. The antenna is preferably formed on a printed circuit board (PCB) (substrate), which can include additional circuitry necessary to operate the antenna, and which is preferably mounted at an acute angle with respect to the housing to direct the beam at the parabolic dish.
摘要翻译: 在一个实施例中,公开了一种用于能够检测潜在危险物体的用于车辆的改进的收发机组件。 收发器组件包括用于产生光束并用于检测从潜在危险反射的光束的锥形狭缝进给天线。 天线形成在外壳中或外壳上,该外壳还包含抛物面盘,其摆动以将辐射束扫过车辆外部的潜在危险。 在优选实施例中,从天线产生大约77GHz的辐射并由天线检测。 天线优选地形成在印刷电路板(PCB)(基板)上,其可以包括操作天线所需的附加电路,并且其优选地相对于外壳以锐角安装,以将光束引导到抛物线盘 。
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公开(公告)号:US20090149146A1
公开(公告)日:2009-06-11
申请号:US11950873
申请日:2007-12-05
申请人: Rudy Emrick , Bruce Bosco
发明人: Rudy Emrick , Bruce Bosco
IPC分类号: H04B1/18
CPC分类号: H04B7/0805 , H01Q3/2605 , H04B7/10
摘要: A method of receiving an RF signal in a wireless communication device includes receiving (1002) a signal having a frequency greater than 10 gigahertz by at least two of a plurality of millimeter wave antennas (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) positioned within the portable wireless communication device. A characteristic of the signal at each antenna (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) is determined (1004) and at least one of the plurality of millimeter wave antennas (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) is selected (1006) based on the characteristics. The signal from the selected millimeter wave antenna (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928) is forwarded (1008) to a device controller 104. A combination of signals from the plurality of antennas may be evaluated prior to selecting two or more of the antennas (122, 124, 126, 128, 822, 824, 826, 828, 922, 924, 926, 928).
摘要翻译: 一种在无线通信设备中接收RF信号的方法包括:通过至少两个毫米波天线(122,124,126,128,822,824,...)接收(1002)具有大于10千兆赫兹的频率的信号, 826,828,922,924,926,928),其位于便携式无线通信设备内。 确定每个天线(122,124,126,128,822,824,826,828,922,924,926,928)处的信号的特性(1004)和多个毫米波天线中的至少一个( 基于特性来选择(1006)(1006),122,124,126,128,822,824,826,828,922,924,926,928。 来自所选毫米波天线(122,124,126,128,822,824,926,828,922,924,926,928)的信号被转发(1008)到设备控制器104.来自 可以在选择天线(122,124,126,128,822,824,826,828,922,924,926,928)中的两个或更多个之前评估多个天线。
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公开(公告)号:US20090109109A1
公开(公告)日:2009-04-30
申请号:US11923873
申请日:2007-10-25
申请人: Steven Franson , Bruce Bosco
发明人: Steven Franson , Bruce Bosco
IPC分类号: H01Q13/00
CPC分类号: H01Q13/085 , H01Q1/38 , H01Q1/525
摘要: A communication device (110, 210) has an antenna (150, 152, 250, 252) positioned on a multilayer substrate/printed circuit board (154, 254, 254′). A first high frequency material (116, 216) is disposed over a first side of the substrate (154, 254) characterized for low frequency devices. A conductive layer (118, 218) is patterned over the first high frequency material (116, 216), defining first and second circuit traces (122, 124, 222, 224) and first and second antenna traces (132, 134, 232, 234). The first and second antenna traces (132, 134, 232, 234) define a first slot (116, 216) in the first conductive layer (122, 222), which is aligned with a cutout (162, 262) defined by the substrate (154, 254). One of a transmitter (112, 212) and a receiver (114, 214) are disposed over the high frequency material (116, 216) and coupled to the edge emitting antenna (150, 250) by the first and second circuit traces (122, 124, 222, 224). The other of the transmitter (112) and receiver (114) may be positioned on the same or opposed side (aligned or staggered) of the substrate (254) in a similar manner. One or more layers (262), which may be patterned to provide resonant features, are formed between the substrate (254, 254′) for isolation.
摘要翻译: 通信设备(110,210)具有位于多层基板/印刷电路板(154,254,254')上的天线(150,152,250,252)。 第一高频材料(116,216)设置在衬底(154,254)的第一侧上,其特征在于用于低频器件。 导电层(118,218)在第一高频材料(116,216)上图案化,限定第一和第二电路迹线(122,124,222,224)以及第一和第二天线迹线(132,134,232, 234)。 第一和第二天线迹线(132,134,232,234)在第一导电层(122,222)中限定第一槽(116,216),其与由衬底限定的切口(162,262)对准 (154,254)。 发射器(112,212)和接收器(114,214)中的一个设置在高频材料(116,216)之上,并通过第一和第二电路迹线(122)耦合到边缘发射天线(150,250) ,124,222,224)。 发射器(112)和接收器(114)中的另一个可以以类似的方式定位在衬底(254)的相同或相对侧(对齐或交错)上。 可以在衬底(254,254')之间形成可以被图案化以提供谐振特征的一个或多个层(262),用于隔离。
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