摘要:
Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.
摘要:
Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
摘要:
A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.
摘要:
Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.