公开(公告)号：US20060014327A1

公开(公告)日：2006-01-19

申请号：US10976732

申请日：2004-10-29

申请人： Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun ,  Jin-Soo Jeong ,  Chang-Sup Ryu ,  Jin-Yong Ahn

发明人： Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun ,  Jin-Soo Jeong ,  Chang-Sup Ryu ,  Jin-Yong Ahn

IPC分类号： H01L21/50

CPC分类号： H05K1/186 ,  H01L2224/82039 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H05K1/023 ,  H05K1/185 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10636 ,  H05K2203/1189 ,  Y02P70/611

摘要： Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the passive chip is mounted in the blind hole.

摘要翻译： 公开了一种制造包括嵌入式无源芯片的PCB的方法，其中无源芯片安装在PCB上，然后将绝缘体层合在PCB上，或者在PCB中形成用于接收无源芯片的盲孔 无源芯片安装在盲孔中。

公开(公告)号：US20060044734A1

公开(公告)日：2006-03-02

申请号：US10999442

申请日：2004-11-29

申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

IPC分类号： H01G4/20

CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/248 ,  H01G4/33 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1366 ,  Y10T29/42

摘要： Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

摘要翻译： 公开了一种包括嵌入式电容器的PCB及其制造方法。 使用具有高电容的陶瓷材料形成电介质层，从而确保电容器各自具有对应于去耦芯片电容器的电容的高介电常数。

公开(公告)号：US07351915B2

公开(公告)日：2008-04-01

申请号：US10999442

申请日：2004-11-29

申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

IPC分类号： H05K1/16

CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/248 ,  H01G4/33 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1366 ,  Y10T29/42

摘要： A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

摘要翻译： 提供了具有至少一个嵌入式电容器的印刷电路板（PCB）及其制造方法。 使用具有高电容的陶瓷材料形成电介质层，从而确保电容器各自具有对应于去耦芯片电容器的电容的高介电常数。

公开(公告)号：US20070146980A1

公开(公告)日：2007-06-28

申请号：US11681457

申请日：2007-03-02

申请人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

发明人： Jin-Yong Ahn ,  Chang-Sup Ryu ,  Suk-Hyeon Cho ,  Seok-Kyu Lee ,  Jong-Kuk Hong ,  Ho-Sik Jun

IPC分类号： H04R17/00

CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/1218 ,  H01G4/248 ,  H01G4/33 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2201/09763 ,  H05K2201/09881 ,  H05K2203/0568 ,  H05K2203/1366 ,  Y10T29/42

摘要： Disclosed is a PCB including embedded capacitors and a method of fabricating the same. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric constant corresponding to the capacitance of a decoupling chip capacitor.

摘要翻译： 公开了一种包括嵌入式电容器的PCB及其制造方法。 使用具有高电容的陶瓷材料形成电介质层，从而确保电容器各自具有对应于去耦芯片电容器的电容的高介电常数。

公开(公告)号：US07564116B2

公开(公告)日：2009-07-21

申请号：US12016919

申请日：2008-01-18

申请人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk-Hyeon Cho ,  Ho Sik Jeon

发明人： Jin Yong Ahn ,  Cheol Seong Hwang ,  Sung Kun Kim ,  Chang Sup Ryu ,  Suk-Hyeon Cho ,  Ho Sik Jeon

IPC分类号： H01L29/00 ,  H05K3/30 ,  H01L21/20

CPC分类号： H05K1/162 ,  H01L2924/0002 ,  H05K1/095 ,  H05K3/108 ,  H05K3/244 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2201/09509 ,  H05K2201/09881 ,  Y10S438/957 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

摘要： A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.

摘要翻译： 具有嵌入式电容器的印刷电路板包括：包含形成在其外层中的第一电路层的双面覆铜层压板，所述第一电路层包括底部电极和电路图案; 通过原子层沉积在第一电路层上沉积氧化铝膜而形成的介电层; 形成在电介质层上并包括顶电极和电路图案的第二电路层; 形成在第二电路层上的单面覆铜层压板; 盲孔通孔和形成在单面覆铜层压板的预定部分中的通孔; 以及形成在盲通孔和通孔中的镀层。 还公开了印刷电路板的制造方法。

公开(公告)号：US20060291173A1

公开(公告)日：2006-12-28

申请号：US11452322

申请日：2006-06-14

申请人： Suk-Hyeon Cho ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Jin Baek ,  Jin-Yong Ahn

发明人： Suk-Hyeon Cho ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Sang-Jin Baek ,  Jin-Yong Ahn

IPC分类号： H05K1/18

CPC分类号： H05K1/184 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10643 ,  Y10T29/4913

摘要： A printed circuit board with embedded electronic components and fabrication method thereof are disclosed. The printed circuit board with embedded electronic components having outer electrodes comprising a substrate on which insertion holes are formed for containing the electronic components, a filler for filling the gap between the electronic component and the insertion hole to secure the electronic components, and attachment layers laminated onto the substrate in contact with the electrodes, with circuits formed on the attachment layers, may provide superior electrical reliability, as the outer electrodes of the electronic components are in contact with the attachment layers, and may reduce fabrication cost and time, as it is not necessary to form via holes.

摘要翻译： 公开了具有嵌入式电子部件的印刷电路板及其制造方法。 具有嵌入式电子元件的印刷电路板具有外部电极，该基板具有形成有用于容纳电子部件的插入孔的基板，用于填充电子元件与插入孔之间的间隙的填充物，以固定电子部件， 由于电子部件的外部电极与附着层接触，所以与形成在连接层上的电路形成在电极上的电路可以提供优异的电可靠性，并且可以降低制造成本和时间，因为它是 不需要形成通孔。

公开(公告)号：US20070111380A1

公开(公告)日：2007-05-17

申请号：US11598141

申请日：2006-11-13

申请人： Suk-Hyeon Cho ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Han Kim

发明人： Suk-Hyeon Cho ,  Chang-Sup Ryu ,  Han-Seo Cho ,  Han Kim

IPC分类号： H01L21/00

CPC分类号： H05K1/162 ,  H01F17/0033 ,  H01F41/046 ,  H05K1/165 ,  H05K1/167 ,  H05K2201/0355 ,  H05K2201/086 ,  H05K2201/09509 ,  H05K2201/09881 ,  H05K2203/0361

摘要： A method of fabricating a printed circuit board having embedded components is disclosed. The method of fabricating a printed circuit board having embedded components according to an embodiment of the present invention comprises stacking a first conductive layer and a second conductive layer on a substrate in order, forming a hole in the second conductive layer and filling with dielectric material, stacking a third conductive layer on the second conductive layer and removing portions to form an upper electrode located on the dielectric material and a pad electrically connected with the first conductive layer, and stacking an insulation layer on the third conductive layer and forming a via hole and an outer layer circuit electrically connected with the upper electrode and the pad, so that it is easy to process the dielectric material to have a uniform thickness, and the capacitor and the resistor can be implemented simultaneously.

摘要翻译： 公开了一种制造具有嵌入式部件的印刷电路板的方法。 根据本发明的实施例的制造具有嵌入部件的印刷电路板的方法包括在基板上层叠第一导电层和第二导电层，以在第二导电层中形成孔并填充电介质材料， 在所述第二导电层上堆叠第三导电层并去除部分以形成位于所述电介质材料上的上电极和与所述第一导电层电连接的焊盘，以及在所述第三导电层上堆叠绝缘层并形成通孔，以及 与上电极和焊盘电连接的外层电路，使得容易将电介质材料加工成具有均匀的厚度，并且可以同时实现电容器和电阻器。

公开(公告)号：US20070007636A1

公开(公告)日：2007-01-11

申请号：US11474974

申请日：2006-06-27

申请人： Jin-Yong Ahn ,  Chang Ryu ,  Suk-Hyeon Cho ,  Joon Kim ,  Han Cho

发明人： Jin-Yong Ahn ,  Chang Ryu ,  Suk-Hyeon Cho ,  Joon Kim ,  Han Cho

IPC分类号： H01L23/02 ,  H01L21/00

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3512 ,  H05K1/185 ,  H05K1/186 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/063 ,  H05K2203/1189 ,  Y02P70/611 ,  Y10T29/49128

摘要： A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes.

摘要翻译： 公开了一种并行芯片嵌入式印刷电路板及其制造方法。 利用制造并联芯片嵌入式印刷电路板的方法，其特征在于包括：（a）通过使用至少一个电容器形成平行芯片来并联连接多个单元芯片，所述多个单元芯片具有形成在其上表面和下表面上的电极或电连接构件 导电构件; （b）将平行芯片一侧的电极连接到第一板上; 和（c）将平行芯片的另一侧的电极连接到第二板，由于可以一次嵌入多个单元芯片，因此可以以低成本将芯片嵌入印刷电路板中，并且机械钻 或者可以使用路由器代替激光钻孔来对空腔或通孔进行穿孔。

公开(公告)号：US08683684B2

公开(公告)日：2014-04-01

申请号：US13200920

申请日：2011-10-05

申请人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

发明人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC分类号： H05K3/30

CPC分类号： H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

摘要： A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

摘要翻译： 一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。

公开(公告)号：US20080055863A1

公开(公告)日：2008-03-06

申请号：US11896769

申请日：2007-09-05

申请人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

发明人： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC分类号： H05K7/00 ,  H05K3/44 ,  H05K7/20

CPC分类号： H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

摘要： A method of manufacturing an optical component embedded printed circuit board is disclosed. An optical component embedded printed circuit board that includes a metal core in which at least one cavity is formed, an optical component embedded in the cavity, a first insulation layer stacked on one side of the metal core, a second insulation layer stacked on the other side of the metal core, and a circuit pattern which is formed on the first insulation layer and which is electrically connected with the optical component, provides a thin printed circuit board having a superb heat releasing effect.

摘要翻译： 公开了一种制造光学元件嵌入式印刷电路板的方法。 一种光学部件嵌入式印刷电路板，包括其中形成有至少一个空腔的金属芯，嵌入在所述空腔中的光学部件，堆叠在所述金属芯的一侧的第一绝缘层，在另一个上堆叠的第二绝缘层 并且形成在第一绝缘层上并且与光学部件电连接的电路图案提供了具有优良散热效果的薄印刷电路板。