Mos transistor adopting titanium-carbon-nitride gate electrode and
manufacturing method thereof
    1.
    发明授权
    Mos transistor adopting titanium-carbon-nitride gate electrode and manufacturing method thereof 失效
    采用钛碳氮化物栅电极的Mos晶体及其制造方法

    公开(公告)号:US5965911A

    公开(公告)日:1999-10-12

    申请号:US960290

    申请日:1997-10-29

    CPC分类号: H01L21/28088 H01L29/4966

    摘要: A MOS transistor employing a titanium-carbon-nitride (TiCN) gate electrode is provided. The MOS transistor has a gate insulating film, a gate electrode, and a source/drain region on a semiconductor substrate. The gate electrode is formed of a single TiCN film or a double film having a TiCN film and a low-resistant metal film formed thereon. The TiCN gate electrode exhibits a low resistance of about 80-100 .mu..OMEGA.-cm and can control variations in Fermi energy level.

    摘要翻译: 提供采用钛 - 氮化钛(TiCN)栅电极的MOS晶体管。 MOS晶体管在半导体衬底上具有栅极绝缘膜,栅极电极和源极/漏极区域。 栅极由单个TiCN膜或其上形成有TiCN膜和低电阻金属膜的双层膜形成。 TiCN栅电极具有约80-100μΩ的OMEGA-cm的低电阻,并且可以控制费米能级的变化。

    MOS transistor adopting titanium-carbon-nitride gate electrode and
manufacturing method thereof
    2.
    发明授权
    MOS transistor adopting titanium-carbon-nitride gate electrode and manufacturing method thereof 失效
    采用氮化钛栅电极的MOS晶体管及其制造方法

    公开(公告)号:US5795817A

    公开(公告)日:1998-08-18

    申请号:US619361

    申请日:1996-03-21

    IPC分类号: H01L21/28 H01L29/49 H01L29/78

    CPC分类号: H01L21/28088 H01L29/4966

    摘要: A MOS transistor employing a titanium-carbon-nitride (TiCN) gate electrode is provided. The MOS transistor has a gate insulating film, a gate electrode, and a source/drain region on a semiconductor substrate. The gate electrode is formed of a single TiCN film or a double film having a TiCN film and a low-resistant metal film formed thereon. The TiCN gate electrode exhibits a low resistance of about 80-100 .mu..OMEGA.-cm and can control variations in Fermi energy level.

    摘要翻译: 提供采用钛 - 氮化钛(TiCN)栅电极的MOS晶体管。 MOS晶体管在半导体衬底上具有栅极绝缘膜,栅极电极和源极/漏极区域。 栅极由单个TiCN膜或其上形成有TiCN膜和低电阻金属膜的双层膜形成。 TiCN栅电极具有约80-100μΩ的OMEGA-cm的低电阻,并且可以控制费米能级的变化。

    Methods of fabricating ferroelectric capacitors
    3.
    发明授权
    Methods of fabricating ferroelectric capacitors 失效
    铁电电容器的制造方法

    公开(公告)号:US5843818A

    公开(公告)日:1998-12-01

    申请号:US760576

    申请日:1996-12-03

    申请人: Suk-ho Joo Jong Moon

    发明人: Suk-ho Joo Jong Moon

    摘要: Methods of producing ferroelectric capacitors where the electrodes are formed in a contact hole. These methods include the steps of forming an insulating layer on an integrated circuit substrate. A contact hole is then formed through the insulating layer layer to expose a region of the integrated circuit substrate and to define a storage node pattern. A layer of oxidation-resistant conductive material is formed in the contact hole and the insulating layer removed to define a first storage electrode by exposing the layer of oxidation-resistant conductive material. A ferroelectric layer is then formed on the first storage electrode and a second storage electrode is formed on the ferroelectric layer opposite the first storage electrode.

    摘要翻译: 制造在接触孔中形成电极的铁电电容器的方法。 这些方法包括在集成电路基板上形成绝缘层的步骤。 然后通过绝缘层层形成接触孔以暴露集成电路衬底的区域并限定存储节点图案。 在接触孔中形成抗氧化导电材料层,并且通过暴露耐氧化导电材料层去除绝缘层以限定第一存储电极。 然后在第一存储电极上形成铁电层,并且在与第一存储电极相对的铁电层上形成第二存储电极。

    Phase changable memory device structures
    4.
    发明申请
    Phase changable memory device structures 有权
    相变存储器件结构

    公开(公告)号:US20060148125A1

    公开(公告)日:2006-07-06

    申请号:US11364950

    申请日:2006-03-01

    IPC分类号: H01L21/00

    摘要: A phase-changeable memory device may include a substrate, an insulating layer on the substrate, first and second electrodes, and a pattern of a phase-changeable material between the first and second electrodes. More particularly, the insulating layer may have a hole therein, and the first electrode may be in the hole in the insulating layer. Moreover, portions of the second electrode may extend beyond an edge of the pattern of phase-changeable material. Related methods are also discussed.

    摘要翻译: 可相变存储器件可以包括衬底,衬底上的绝缘层,第一和第二电极以及第一和第二电极之间的相变材料的图案。 更具体地,绝缘层可以在其中具有孔,并且第一电极可以在绝缘层中的孔中。 此外,第二电极的部分可以延伸超过相变材料图案的边缘。 还讨论了相关方法。