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公开(公告)号：US08183556B2
公开(公告)日：2012-05-22
申请号：US11305452
申请日：2005-12-15
申请人： Suman Datt{dot over (a)} , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amlan , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
发明人： Suman Datt{dot over (a)} , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amlan , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
IPC分类号： H01L21/84
CPC分类号： H01L29/7784 , H01L21/02178 , H01L21/02381 , H01L21/02546 , H01L21/823807 , H01L21/823885 , H01L21/8252 , H01L27/0605 , H01L27/092 , H01L29/1054 , H01L29/122 , H01L29/15 , H01L29/157 , H01L29/205 , H01L29/41783 , H01L29/42364 , H01L29/42376 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/7783
摘要： A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
摘要翻译： CMOS器件包括具有第一量子阱结构的PMOS晶体管和具有第二量子阱结构的NMOS器件。 PMOS和NMOS晶体管形成在衬底上。
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公开(公告)号：US20140291615A1
公开(公告)日：2014-10-02
申请号：US14302371
申请日：2014-06-11
申请人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
发明人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
IPC分类号： H01L27/092 , H01L29/15
CPC分类号： H01L29/7784 , H01L21/02178 , H01L21/02381 , H01L21/02546 , H01L21/823807 , H01L21/823885 , H01L21/8252 , H01L27/0605 , H01L27/092 , H01L29/1054 , H01L29/122 , H01L29/15 , H01L29/157 , H01L29/205 , H01L29/41783 , H01L29/42364 , H01L29/42376 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/7783
摘要： A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
摘要翻译： CMOS器件包括具有第一量子阱结构的PMOS晶体管和具有第二量子阱结构的NMOS器件。 PMOS和NMOS晶体管形成在衬底上。
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公开(公告)号：US20120199813A1
公开(公告)日：2012-08-09
申请号：US13450359
申请日：2012-04-18
申请人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
发明人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
IPC分类号： H01L27/092 , H01L21/8238
CPC分类号： H01L29/7784 , H01L21/02178 , H01L21/02381 , H01L21/02546 , H01L21/823807 , H01L21/823885 , H01L21/8252 , H01L27/0605 , H01L27/092 , H01L29/1054 , H01L29/122 , H01L29/15 , H01L29/157 , H01L29/205 , H01L29/41783 , H01L29/42364 , H01L29/42376 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/7783
摘要： A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
摘要翻译： CMOS器件包括具有第一量子阱结构的PMOS晶体管和具有第二量子阱结构的NMOS器件。 PMOS和NMOS晶体管形成在衬底上。
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公开(公告)号：US08518768B2
公开(公告)日：2013-08-27
申请号：US13450359
申请日：2012-04-18
申请人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
发明人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
IPC分类号： H01L21/70 , H01L21/8238
CPC分类号： H01L29/7784 , H01L21/02178 , H01L21/02381 , H01L21/02546 , H01L21/823807 , H01L21/823885 , H01L21/8252 , H01L27/0605 , H01L27/092 , H01L29/1054 , H01L29/122 , H01L29/15 , H01L29/157 , H01L29/205 , H01L29/41783 , H01L29/42364 , H01L29/42376 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/7783
摘要： A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
摘要翻译： CMOS器件包括具有第一量子阱结构的PMOS晶体管和具有第二量子阱结构的NMOS器件。 PMOS和NMOS晶体管形成在衬底上。
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公开(公告)号：US08802517B2
公开(公告)日：2014-08-12
申请号：US13962890
申请日：2013-08-08
申请人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
发明人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
IPC分类号： H01L21/338
CPC分类号： H01L29/7784 , H01L21/02178 , H01L21/02381 , H01L21/02546 , H01L21/823807 , H01L21/823885 , H01L21/8252 , H01L27/0605 , H01L27/092 , H01L29/1054 , H01L29/122 , H01L29/15 , H01L29/157 , H01L29/205 , H01L29/41783 , H01L29/42364 , H01L29/42376 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/7783
摘要： A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
摘要翻译： CMOS器件包括具有第一量子阱结构的PMOS晶体管和具有第二量子阱结构的NMOS器件。 PMOS和NMOS晶体管形成在衬底上。
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公开(公告)号：US20130328015A1
公开(公告)日：2013-12-12
申请号：US13962890
申请日：2013-08-08
申请人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
发明人： Suman Datta , Mantu K. Hudait , Mark L. Doczy , Jack T. Kavalieros , Majumdar Amian , Justin K. Brask , Been-Yih Jin , Matthew V. Metz , Robert S. Chau
IPC分类号： H01L27/092 , H01L21/8238
CPC分类号： H01L29/7784 , H01L21/02178 , H01L21/02381 , H01L21/02546 , H01L21/823807 , H01L21/823885 , H01L21/8252 , H01L27/0605 , H01L27/092 , H01L29/1054 , H01L29/122 , H01L29/15 , H01L29/157 , H01L29/205 , H01L29/41783 , H01L29/42364 , H01L29/42376 , H01L29/517 , H01L29/66462 , H01L29/66522 , H01L29/7783
摘要： A CMOS device includes a PMOS transistor with a first quantum well structure and an NMOS device with a second quantum well structure. The PMOS and NMOS transistors are formed on a substrate.
摘要翻译： CMOS器件包括具有第一量子阱结构的PMOS晶体管和具有第二量子阱结构的NMOS器件。 PMOS和NMOS晶体管形成在衬底上。
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7.发明授权公开(公告)号：US08120065B2
公开(公告)日：2012-02-21
申请号：US12541763
申请日：2009-08-14
IPC分类号： H01L21/02
CPC分类号： H01L29/66636 , H01L21/823807 , H01L21/823814 , H01L29/165 , H01L29/517 , H01L29/66628 , H01L29/7848 , Y10S438/933 , Y10S438/938
摘要： Enhancement mode transistors are described where a Group III-N compound is used in the source and drain regions to place tensile strain on the channel. The source and drain regions may be raised or embedded, and fabricated in conjunction with recessed or raised compression regions for p channel transistors.
摘要翻译： 描述了增强模式晶体管，其中在源极和漏极区域中使用III-N族化合物以在通道上施加拉伸应变。 源极和漏极区域可以被凸起或嵌入，并且与用于p沟道晶体管的凹陷或凸起的压缩区域一起制造。
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8.发明申请公开(公告)号：US20090302350A1
公开(公告)日：2009-12-10
申请号：US12541763
申请日：2009-08-14
IPC分类号： H01L29/78
CPC分类号： H01L29/66636 , H01L21/823807 , H01L21/823814 , H01L29/165 , H01L29/517 , H01L29/66628 , H01L29/7848 , Y10S438/933 , Y10S438/938
摘要： Enhancement mode transistors are described where a Group III-N compound is used in the source and drain regions to place tensile strain on the channel. The source and drain regions may be raised or embedded, and fabricated in conjunction with recessed or raised compression regions for p channel transistors.
摘要翻译： 描述了增强模式晶体管，其中在源极和漏极区域中使用III-N族化合物以在通道上施加拉伸应变。 源极和漏极区域可以被凸起或嵌入，并且与用于p沟道晶体管的凹陷或凸起的压缩区域一起制造。
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9.发明授权公开(公告)号：US07592213B2
公开(公告)日：2009-09-22
申请号：US11323688
申请日：2005-12-29
IPC分类号： H01L21/336
CPC分类号： H01L29/66636 , H01L21/823807 , H01L21/823814 , H01L29/165 , H01L29/517 , H01L29/66628 , H01L29/7848 , Y10S438/933 , Y10S438/938
摘要： Enhancement mode transistors are described where a Group III-N compound is used in the source and drain regions to place tensile strain on the channel. The source and drain regions may be raised or embedded, and fabricated in conjunction with recessed or raised compression regions for p channel transistors.
摘要翻译： 描述了增强模式晶体管，其中在源极和漏极区域中使用III-N族化合物以在通道上施加拉伸应变。 源极和漏极区域可以被凸起或嵌入，并且与用于p沟道晶体管的凹陷或凸起的压缩区域一起制造。
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公开(公告)号：US20080116485A1
公开(公告)日：2008-05-22
申请号：US11560494
申请日：2006-11-16
IPC分类号： H01L27/092
CPC分类号： H01L27/0605 , H01L21/8252 , H01L27/092
摘要： A group III-V material CMOS device may have NMOS and PMOS portions that are substantially the same through several of their layers. This may make the CMOS device easy to make and prevent coefficient of thermal expansion mismatches between the NMOS and PMOS portions.
摘要翻译： III-V族材料CMOS器件可以具有通过它们的几个层基本上相同的NMOS和PMOS部分。 这可能使CMOS器件易于制造并且防止NMOS和PMOS部分之间的热膨胀失配系数。
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