公开(公告)号：US07569867B2

公开(公告)日：2009-08-04

申请号：US11252917

申请日：2005-10-18

申请人： Sumio Shimonishi ,  Akira Takekuma ,  Yoshifumi Yamaoka

发明人： Sumio Shimonishi ,  Akira Takekuma ,  Yoshifumi Yamaoka

IPC分类号： H01L29/74

CPC分类号： H01L33/54 ,  G02B3/00 ,  G02B3/14 ,  G02B26/004 ,  H01L33/58

摘要： A light-emitting device which comprises as one unit a semiconductor light-emitting element; a first liquid for condensing the light from the semiconductor light-emitting element; a second liquid that is separate from but contacts the first liquid; an airtight space in which at least first liquid and second liquid are disposed; and first and second electrodes to which voltage is applied so as to change the shape of the interface between first liquid and second liquid and adjust the condensed state of the light from semiconductor light-emitting element.

摘要翻译： 一种发光器件，其包括半导体发光元件作为一个单元; 用于冷凝来自半导体发光元件的光的第一液体; 与第一液体分开但接触的第二液体; 其中设置至少第一液体和第二液体的气密空间; 以及施加电压以便改变第一液体和第二液体之间的界面的形状并调节来自半导体发光元件的光的聚光状态的第一和第二电极。

公开(公告)号：US20060114678A1

公开(公告)日：2006-06-01

申请号：US11252917

申请日：2005-10-18

申请人： Sumio Shimonishi ,  Akira Takekuma ,  Yoshifumi Yamaoka

发明人： Sumio Shimonishi ,  Akira Takekuma ,  Yoshifumi Yamaoka

IPC分类号： F21V5/00

CPC分类号： H01L33/54 ,  G02B3/00 ,  G02B3/14 ,  G02B26/004 ,  H01L33/58

摘要： A light-emitting device which comprises as one unit a semiconductor light-emitting element; a first liquid for condensing the light from the semiconductor light-emitting element; a second liquid that is separate from but contacts the first liquid; an airtight space in which at least first liquid and second liquid are disposed; and first and second electrodes to which voltage is applied so as to change the shape of the interface between first liquid and second liquid and adjust the condensed state of the light from semiconductor light-emitting element.

公开(公告)号：US20050275748A1

公开(公告)日：2005-12-15

申请号：US11144863

申请日：2005-06-03

申请人： Akira Takekuma ,  Yoshifumi Yamaoka

发明人： Akira Takekuma ,  Yoshifumi Yamaoka

IPC分类号： G03B13/36 ,  G02B7/28 ,  G03B17/02 ,  H01L33/00 ,  H01R33/05 ,  H01R33/06 ,  H04N5/222 ,  H04N5/225 ,  H04N5/232

CPC分类号： H04N5/2256

摘要： A socket in which a light-emitting diode can be attached and detached as needed close to the structure for holding a camera module. Socket comprises a spring contact part for contacting the leads or electrodes of the light-emitting diode, and an anchor for anchoring such that the direction of a dome section has a predetermined relationship with the camera module.

摘要翻译： 其中发光二极管可以根据需要靠近用于保持相机模块的结构被附接和分离的插座。 插座包括用于接触发光二极管的引线或电极的弹簧接触部分和用于锚定的锚固件，使得圆顶部分的方向与相机模块具有预定的关系。

公开(公告)号：US07679673B2

公开(公告)日：2010-03-16

申请号：US11144863

申请日：2005-06-03

申请人： Akira Takekuma ,  Yoshifumi Yamaoka

发明人： Akira Takekuma ,  Yoshifumi Yamaoka

IPC分类号： H04N5/225

CPC分类号： H04N5/2256

摘要： A socket in which a light-emitting diode can be attached and detached as needed close to the structure for holding a camera module. Socket comprises a spring contact part for contacting the leads or electrodes of the light-emitting diode, and an anchor for anchoring such that the direction of a dome section has a predetermined relationship with the camera module.

摘要翻译： 其中发光二极管可以根据需要靠近用于保持相机模块的结构被附接和分离的插座。 插座包括用于接触发光二极管的引线或电极的弹簧接触部分和用于锚定的锚固件，使得圆顶部分的方向与相机模块具有预定的关系。

公开(公告)号：US20060044815A1

公开(公告)日：2006-03-02

申请号：US11207252

申请日：2005-08-19

申请人： Akira Takekuma

发明人： Akira Takekuma

IPC分类号： B60Q1/076

CPC分类号： H01L25/0753 ,  H01L2924/0002 ,  Y10S362/80 ,  H01L2924/00

摘要： A light emitting diode comprises light-emitting elements inside a cup structure and a lens part that condenses the light from these elements. Light-emitting element placed at the center along the optical axis of the lens emits an outgoing beam of light with a narrow directional angle along this optical axis, and light-emitting element placed away from the optical axis emits an outgoing beam of light in an oblique direction. The light-emitting elements are individually turned on and off in accordance with the distance of the subject to be photographed.

公开(公告)号：US07311420B2

公开(公告)日：2007-12-25

申请号：US11208834

申请日：2005-08-22

申请人： Siew Kim Tan ,  Sundar Yoganandan ,  Akira Takekuma

发明人： Siew Kim Tan ,  Sundar Yoganandan ,  Akira Takekuma

IPC分类号： F21V11/00

CPC分类号： F21K9/00 ,  H01L25/0753 ,  H01L2224/48091 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

摘要： In one embodiment, an opto-electronic package includes a substrate, a cavity, mounting pads and transverse walls interspersed along the cavity, pads separated by transverse walls, and transverse walls being lower than cavity-defining walls; and LED dice mounted to the pads. In another embodiment, a system is disclosed for backlighting an LCD screen. The system includes an opto-electronic package having a substrate; LED dice mounted to the substrate; an encapsulant disposed over LED dice; and a light guide having an input portion to receive light provided by LED dice, the input portion in attachment to encapsulant, and an output portion configured to transmit light to LCD screen. In yet another embodiment, a method of manufacturing an opto-electronic package includes: fabricating a substrate; attaching LED dice to the substrate; electrically connecting each LED dice to an outer portion of the substrate; and disposing encapsulant over the LED dice.

摘要翻译： 在一个实施例中，光电子封装包括衬底，空腔，安装焊盘和沿着空腔散布的横向壁，由横向壁分隔的焊盘以及比空腔限定壁低的横向壁; 和LED骰子安装在垫上。 在另一个实施例中，公开了一种用于背光LCD屏幕的系统。 该系统包括具有基板的光电子封装; LED芯片安装在基板上; 设置在LED骰子上的密封剂; 以及导光体，其具有用于接收由LED芯片提供的光的输入部分，附着到密封剂的输入部分和被配置为将光传输到LCD屏幕的输出部分。 在又一个实施例中，制造光电封装的方法包括：制造衬底; 将LED骰子连接到基板上; 将每个LED晶片电连接到所述衬底的外部; 并将密封剂放置在LED骰子上。

公开(公告)号：US20060033117A1

公开(公告)日：2006-02-16

申请号：US11188413

申请日：2005-07-25

申请人： Akira Takekuma

发明人： Akira Takekuma

IPC分类号： H01L33/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： A Light-emitting diode which comprises a pair of metal plate leads connected to a light-emitting element. The pair of metal plate leads comprise, at the edges of the metal plates, surface mounting-type connecting parts that connect facing the pads of a circuit substrate. Furthermore, the light-emitting diode comprises a support member that has a part, other than leads, that contacts the circuit substrate so that it can be positioned on the circuit substrate with stability during the reflow process.

摘要翻译： 一种发光二极管，包括连接到发光元件的一对金属板引线。 一对金属板引线在金属板的边缘处包括面向电路基板的焊盘的表面安装型连接部件。 此外，发光二极管包括支撑构件，其具有与引线不同的部分，其与电路基板接触，使得其可以在回流工艺期间稳定地定位在电路基板上。

公开(公告)号：US06617617B2

公开(公告)日：2003-09-09

申请号：US09929332

申请日：2001-08-14

申请人： Akira Takekuma ,  Shunichi Ishikawa

发明人： Akira Takekuma ,  Shunichi Ishikawa

IPC分类号： H01L3300

CPC分类号： H01L33/62 ,  H01L2224/16 ,  H01L2924/12041

摘要： A light-emitting diode with which the LED chip will not be destroyed comprises an LED chip 40 mounted on plate-shaped wiring means 60 inside a light-emitting diode. Wiring means 60 comprises conductive paths 61 and 62 that electrically lead to a pair of opposing surfaces. The top surface is used for mounting the LED chip. Part of the conductive paths 61, 62 are connected electrically to LED chip 40, extending from the position where the LED is mounted to leads 21 and 22, to which they are connected by soldering. LED chip 40 is supported by being held inside concave part 23 in one lead 21 at this time.

摘要翻译： LED芯片不会被破坏的发光二极管包括安装在发光二极管内的板状布线装置60上的LED芯片40。 导线装置60包括电导向一对相对表面的导电通路61和62。 上表面用于安装LED芯片。 导电路径61,62的一部分电连接到LED芯片40，从LED被安装的位置延伸到引线21和22，它们通过焊接连接到它们。 此时，LED芯片40被保持在一个引​​线21内的凹部23内。

公开(公告)号：US07470936B2

公开(公告)日：2008-12-30

申请号：US11684473

申请日：2007-03-09

申请人： Akira Takekuma

发明人： Akira Takekuma

IPC分类号： H01L29/26

CPC分类号： H01L33/58 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

摘要： It is to be made easy to arrange light emitting diodes, each including a lens having a hemispherical light emitting surface, and cover the base of the light emitting diodes with resin material.A light emitting diode 1 has a light emitting element 2, a lead section 3 that supplies power to the light emitting element 2, a base 4 that covers the lead section 3, a lens 5 having a convex light emitting surface and connected to the base 4 to cover the light emitting element 2, and a step section 6 disposed such that it surrounds the outer side of the lens 5, part of the step 6 having a different width. The step section 6 has a height that defines the amount of resin material enough to cover the lead section 3. There is also provided a light emitting diode display device 10 using a plurality of such light emitting diodes.

摘要翻译： 可以容易地布置发光二极管，每个发光二极管包括具有半球形发光表面的透镜，并用树脂材料覆盖发光二极管的基部。 发光二极管1具有发光元件2，向发光元件2供电的引线部3，覆盖引线部3的基座4，具有凸出的发光面的透镜5，并与基座 4，覆盖发光元件2;以及台阶部6，其布置成使得其包围透镜5的外侧，台阶6的一部分具有不同的宽度。 步骤部分6具有限定足以覆盖引线部分3的树脂材料的量的高度。还提供了使用多个这种发光二极管的发光二极管显示装置10。

公开(公告)号：US20080101066A1

公开(公告)日：2008-05-01

申请号：US11923274

申请日：2007-10-24

申请人： Akira Takekuma ,  Chew Tong Fatt

发明人： Akira Takekuma ,  Chew Tong Fatt

IPC分类号： F21V15/01 ,  F21V5/00

CPC分类号： H01L33/62 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01079 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

摘要： A light emitting diode package comprising a substrate electrically connectable to an external unit with a reduced height. A flexible PCB for electrical connection between a light emitting diode and the external unit is directly connected to a light emitting element. The direct connection is conducted by applying a conductive resin to an electrode on the flexible PCB, on which the light emitting element is mounted; mounting the light emitting element; curing the conductive resin in a high-temperature furnace. The present invention requires neither a lead frame for electrical connection of the light emitting element to the flexible PCB nor a rigid PCB for supporting the flexible PCB, thus reducing the total height of the light emitting diode package.

摘要翻译： 一种发光二极管封装，其包括电连接到具有减小的高度的外部单元的基板。 用于发光二极管和外部单元之间的电连接的柔性PCB直接连接到发光元件。 通过将导电树脂施加到安装有发光元件的柔性PCB上的电极上来进行直接连接; 安装发光元件; 在高温炉中固化导电树脂。 本发明不需要用于将发光元件电连接到柔性PCB的引线框架以及用于支撑柔性PCB的刚性PCB，从而降低发光二极管封装的总高度。