摘要:
Light is irradiated to a light curing resin material within a mold. The light penetrates through the light curing resin material at a position off a mask. The light curing resin material gets cured at the position off the mask. The mold in this manner serves to form the contour of a molded product. On the other hand, the mask partly blocks the light. An uncured section is established in the light curing resin material behind the mask. When the light curing resin material is removed from the uncured section, the uncured section provides a hole, for example. If the mask is finely formed, it is possible to form a fine hole in an easier manner in a shorter time. It is possible to realize the mass production of a molded product having a fine hole.
摘要:
A spring member manufacturing device that manufactures the spring member by laser irradiation includes a laser irradiation unit including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member. In the spring member manufacturing device, the laser irradiation devices are configured so that laser irradiated conditions different from each other are preset for the respective laser irradiation devices, and are arranged so that the respective irradiated positions do not overlap each other. The laser irradiation apparatus is constituted by combining laser irradiation devices having laser irradiation conditions being 2 to the (n−1)th power, n being a positive integer,of predetermined minimum adjustment amount for adjusting load on the spring member. The combination of the laser irradiation devices are selected in accordance with load adjusting amount required for the spring member.
摘要:
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
摘要:
A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.
摘要:
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
摘要:
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate to cut the laminate into elements.
摘要:
A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.
摘要:
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
摘要:
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
摘要:
A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object.