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    DEVICE AND METHOD FOR MANUFACTURING SPRING MEMBER
    1.
    发明申请
    DEVICE AND METHOD FOR MANUFACTURING SPRING MEMBER 审中-公开
    用于制造弹簧构件的装置和方法

    公开(公告)号：US20090195934A1

    公开(公告)日：2009-08-06

    申请号：US12335932

    申请日：2008-12-16

    申请人： Toshikazu Furui ,  Naohisa Matsushita

    发明人： Toshikazu Furui ,  Naohisa Matsushita

    IPC分类号： G11B21/16 ,  B21D37/16 ,  B23K26/00

    CPC分类号： G11B5/4833 ,  Y10T29/49041

    摘要： A spring member manufacturing device that manufactures the spring member by laser irradiation includes a laser irradiation unit including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member. In the spring member manufacturing device, the laser irradiation devices are configured so that laser irradiated conditions different from each other are preset for the respective laser irradiation devices, and are arranged so that the respective irradiated positions do not overlap each other. The laser irradiation apparatus is constituted by combining laser irradiation devices having laser irradiation conditions being 2 to the (n−1)th power, n being a positive integer,of predetermined minimum adjustment amount for adjusting load on the spring member. The combination of the laser irradiation devices are selected in accordance with load adjusting amount required for the spring member.

    摘要翻译： 通过激光照射制造弹簧构件的弹簧构件制造装置包括：激光照射单元，包括相对于弹簧构件执行预定的激光照射的多个激光照射装置。 在弹簧部件制造装置中，对各激光照射装置预先设定激光照射条件彼此不同的激光照射装置，并且配置为使得各照射位置不重叠。 激光照射装置通过将具有激光照射条件为2的激光照射装置组合成具有预定的最小调节量的第（n-1）次功率n为正整数的激光照射装置，用于调节弹簧部件上的负载。 激光照射装置的组合根据弹簧构件所需的负载调整量来选择。

    Method of making molded product and molding apparatus
    2.
    发明申请
    Method of making molded product and molding apparatus 审中-公开
    制造成型品和成型装置的方法

    公开(公告)号：US20080012185A1

    公开(公告)日：2008-01-17

    申请号：US11898258

    申请日：2007-09-11

    申请人： Susumu Iida ,  Naohisa Matsushita ,  Toshikazu Furui

    发明人： Susumu Iida ,  Naohisa Matsushita ,  Toshikazu Furui

    IPC分类号： B29C35/08

    CPC分类号： B29C35/0894 ,  B29C2035/0827 ,  B29C2791/001 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002

    摘要： Light is irradiated to a light curing resin material within a mold. The light penetrates through the light curing resin material at a position off a mask. The light curing resin material gets cured at the position off the mask. The mold in this manner serves to form the contour of a molded product. On the other hand, the mask partly blocks the light. An uncured section is established in the light curing resin material behind the mask. When the light curing resin material is removed from the uncured section, the uncured section provides a hole, for example. If the mask is finely formed, it is possible to form a fine hole in an easier manner in a shorter time. It is possible to realize the mass production of a molded product having a fine hole.

    摘要翻译： 将光照射到模具内的光固化树脂材料上。 该光穿过光固化树脂材料在掩模的一个位置处。 光固化树脂材料在掩模的位置固化。 以这种方式的模具用于形成模制产品的轮廓。 另一方面，掩模部分地遮挡光。 在掩模后面的光固化树脂材料中建立未固化部分。 当光固化树脂材料从未固化部分移除时，未固化部分例如提供孔。 如果掩模精细地形成，则可以在更短的时间内以更容易的方式形成细孔。 可以实现具有细孔的成型体的批量生产。

    Method of fabricating element having microstructure
    4.
    发明申请
    Method of fabricating element having microstructure 失效
    具有微结构的元件的制造方法

    公开(公告)号：US20050269731A1

    公开(公告)日：2005-12-08

    申请号：US10967234

    申请日：2004-10-19

    申请人： Naohisa Matsushita ,  Toshikazu Furui

    发明人： Naohisa Matsushita ,  Toshikazu Furui

    IPC分类号： H01L21/301 ,  B29C37/00 ,  B81C1/00

    CPC分类号： B81C1/00873

    摘要： A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

    摘要翻译： 制造具有诸如MEMS器件的微结构的元件的方法使用其状态随着温度变化而变化的材料。 其表面上具有微结构的片状构件通过粘合片固定到真空吸盘，并且将其状态随温度变化而改变的材料施加到片状构件的表面，然后将材料冷却固化 在片状构件的表面和片状构件被切割成多个元件的同时材料处于固化状态，然后将分离的元件从粘合片上移除。

    Scanning mechanism, method of machining workpiece, and machine tool
    6.
    发明授权
    Scanning mechanism, method of machining workpiece, and machine tool 失效
    扫描机构，加工工件的方法和机床

    公开(公告)号：US07570407B2

    公开(公告)日：2009-08-04

    申请号：US12030309

    申请日：2008-02-13

    申请人： Naohisa Matsushita ,  Toshikazu Furui

    发明人： Naohisa Matsushita ,  Toshikazu Furui

    IPC分类号： G02B26/08

    CPC分类号： B23K26/0604 ,  B23K26/0619 ,  B23K26/067 ,  B23K26/082 ,  B23K26/355 ,  B23K2101/36 ,  G11B5/84

    摘要： A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object.

    摘要翻译： 利用光束扫描扫描对象的扫描机构具有用于收集由光源发射的光束的聚光装置; 用于在与所述集光装置的光轴正交的方向上驱动所述集光装置的驱动装置; 第一反射装置，设置在所述扫描对象的第一侧附近，用于反射由所述光收集装置收集的光束，以允许所述光束入射到所述扫描对象上; 以及第二反射装置，设置在与扫描对象的第一侧相对的扫描对象的第二侧附近，用于反射由聚光装置收集的光束，以允许光束入射到扫描对象上。

    SCANNING MECHANISM, METHOD OF MACHINING WORKPIECE, AND MACHINE TOOL
    7.
    发明申请
    SCANNING MECHANISM, METHOD OF MACHINING WORKPIECE, AND MACHINE TOOL 失效
    扫描机械，加工工具的方法和机床

    公开(公告)号：US20080198434A1

    公开(公告)日：2008-08-21

    申请号：US12030309

    申请日：2008-02-13

    申请人： Naohisa Matsushita ,  Toshikazu Furui

    发明人： Naohisa Matsushita ,  Toshikazu Furui

    IPC分类号： G02B26/10

    CPC分类号： B23K26/0604 ,  B23K26/0619 ,  B23K26/067 ,  B23K26/082 ,  B23K26/355 ,  B23K2101/36 ,  G11B5/84

    摘要： A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first aide of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beats to be incident on the scanning object.

    摘要翻译： 利用光束扫描扫描对象的扫描机构具有用于收集由光源发射的光束的聚光装置; 用于在与所述集光装置的光轴正交的方向上驱动所述集光装置的驱动装置; 第一反射装置，设置在扫描对象的第一侧附近，用于反射由所述光收集装置收集的光束，以允许所述光束入射到所述扫描对象上; 以及第二反射装置，设置在与扫描对象的第一侧相对的扫描对象的第二侧附近，用于反射由聚光装置收集的光束，以允许光拍入入扫描对象。