ESD protection structures for semiconductor components
    8.
    发明授权
    ESD protection structures for semiconductor components 有权
    半导体元件的ESD保护结构

    公开(公告)号:US07943928B2

    公开(公告)日:2011-05-17

    申请号:US11603340

    申请日:2006-11-21

    IPC分类号: H01L29/04

    CPC分类号: H01L27/0255 H01L29/861

    摘要: An ESD protection structure includes a structure to be protected disposed in a semiconductor body. A region of a first conductivity type is disposed within the semiconductor body and a channel is disposed in the semiconductor body and extends through the region of the first conductivity type. A semiconductor of a second conductivity type is disposed within the channel adjacent the region of the first conductivity type such that the region of the first conductivity type and the semiconductor of the second conductivity type form a diode. At least one of the region of the first conductivity type and the semiconductor of the second conductivity type is electrically coupled to the structure to be protected.

    摘要翻译: ESD保护结构包括被配置在半导体本体中的要被保护的结构。 第一导电类型的区域设置在半导体本体内,并且沟道设置在半导体本体中并且延伸穿过第一导电类型的区域。 第二导电类型的半导体设置在与第一导电类型的区域相邻的沟道内,使得第一导电类型的区域和第二导电类型的半导体形成二极管。 第一导电类型的区域和第二导电类型的半导体中的至少一个电耦合到待保护的结构。

    ESD protection structures for semiconductor components
    10.
    发明申请
    ESD protection structures for semiconductor components 有权
    半导体元件的ESD保护结构

    公开(公告)号:US20080035924A1

    公开(公告)日:2008-02-14

    申请号:US11603340

    申请日:2006-11-21

    IPC分类号: H01L29/04

    CPC分类号: H01L27/0255 H01L29/861

    摘要: An ESD protection structure includes a structure to be protected disposed in a semiconductor body. A region of a first conductivity type is disposed within the semiconductor body and a channel is disposed in the semiconductor body and extends through the region of the first conductivity type. A semiconductor of a second conductivity type is disposed within the channel adjacent the region of the first conductivity type such that the region of the first conductivity type and the semiconductor of the second conductivity type form a diode. At least one of the region of the first conductivity type and the semiconductor of the second conductivity type is electrically coupled to the structure to be protected.

    摘要翻译: ESD保护结构包括被配置在半导体本体中的要被保护的结构。 第一导电类型的区域设置在半导体本体内,并且沟道设置在半导体本体中并且延伸穿过第一导电类型的区域。 第二导电类型的半导体设置在与第一导电类型的区域相邻的沟道内,使得第一导电类型的区域和第二导电类型的半导体形成二极管。 第一导电类型的区域和第二导电类型的半导体中的至少一个电耦合到待保护的结构。