公开(公告)号：US11664260B2

公开(公告)日：2023-05-30

申请号：US17227079

申请日：2021-04-09

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Daniel M. Y. Yang ,  Che-Fu Chen

IPC分类号： H01L21/68 ,  H01L21/687 ,  G01N21/95 ,  H01L21/67

CPC分类号： H01L21/681 ,  G01N21/9503 ,  G01N21/9505 ,  H01L21/67288 ,  H01L21/68707 ,  H01L21/68764

摘要： In an embodiment, a system includes: an orientation sensor configured to detect an orientation fiducial on a bevel of a wafer; a pedestal configured to rotate the wafer to allow the orientation sensor to detect the orientation fiducial and place the orientation fiducial at a predetermined orientation position; and a defect sensor configured to detect a wafer defect along a surface of the wafer while rotated by the pedestal.

公开(公告)号：US20200058529A1

公开(公告)日：2020-02-20

申请号：US16443168

申请日：2019-06-17

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Che-fu Chen

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  B65G47/90

摘要： The present disclosure relates to a semiconductor device manufacturing system. The semiconductor device manufacturing system includes a processing module and a transfer module. The processing module includes a processing chamber that is configured to process a semiconductor wafer and a gate valve that is configured to provide access to the processing chamber. The transfer module includes a transfer chamber that is coupled to the processing chamber and a liner that is coupled to an inner surface of the transfer chamber. The liner is configured to reduce a volume of the transfer chamber prior to or during a transfer chamber pressure adjustment operation of the transfer module.

公开(公告)号：US20190237354A1

公开(公告)日：2019-08-01

申请号：US16189908

申请日：2018-11-13

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Hung-Wen Chen ,  Che-Fu Chen

IPC分类号： H01L21/687 ,  H01L21/67 ,  B65G47/90 ,  B25J15/08

CPC分类号： H01L21/68707 ,  B25J15/08 ,  B65G47/90 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67201 ,  H01L21/67248 ,  H01L21/67259 ,  H01L21/67288

摘要： In an embodiment, a system includes: an airlock; a first semiconductor processing chamber, a second semiconductor processing chamber; and a transfer module configured to move a sensor into and out of the first semiconductor processing chamber and the second semiconductor processing chamber, wherein the sensor is configured to: collect sensor data characterizing the first semiconductor processing chamber when within the first semiconductor processing chamber; and collect sensor data characterizing the second semiconductor processing chamber when within the second semiconductor processing chamber, wherein the transfer module, the first semiconductor processing chamber, and the second semiconductor processing chamber are within a controlled internal atmosphere on a first side of the airlock and separated by the airlock from an uncontrolled external atmosphere on a second side of the airlock.

公开(公告)号：US11456203B2

公开(公告)日：2022-09-27

申请号：US16445870

申请日：2019-06-19

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Che-Fu Chen

IPC分类号： H01L21/66 ,  H01L21/687 ,  G01L5/00 ,  H01L21/683

摘要： The present disclosure describes a method that prevents pre-mature de-chucking in processing modules. The method includes placing a wafer onto a chuck equipped with lift pins. One or more of the lift pins include a pressure sensor configured to measure a pressure exerted by the wafer. The method further includes measuring a first pressure applied to the one or more lift pins by the wafer, lowering the lift pins to place the wafer on the chuck, and processing the wafer. The method also includes removing the wafer from the chuck by pressing the one or more lift pins against the wafer to measure a second pressure exerted by the wafer. If the measured second pressure is equal to the first pressure, the method raises the wafer using the lift pins above the chuck.

公开(公告)号：US11177183B2

公开(公告)日：2021-11-16

申请号：US16505360

申请日：2019-07-08

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yan-Hong Liu ,  Chien-Chih Wu ,  Che-Fu Chen

IPC分类号： H01L21/00 ,  H01L21/66 ,  H01L21/67 ,  H01L21/677 ,  H01L21/687

摘要： A system includes a factory interface, a deposition tool, and at least one measuring device. The factory interface is configured to carry a wafer. The deposition tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the deposition tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of a thickness of a material on the wafer that is carried in the factory interface or the deposition tool.

公开(公告)号：US20210233797A1

公开(公告)日：2021-07-29

申请号：US17226362

申请日：2021-04-09

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Ming-Feng Chen ,  Che-fu Chen ,  Hung-Wen Chen

IPC分类号： H01L21/687 ,  H01L21/677 ,  H01L21/67

摘要： In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.

公开(公告)号：US20210035834A1

公开(公告)日：2021-02-04

申请号：US17074191

申请日：2020-10-19

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Chien-Chih Wu ,  Che-Fu Chen

IPC分类号： H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  G06T7/00

摘要： In an embodiment, a workstation includes: a processing chamber configured to process a workpiece; a load port configured to interface with an environment external to the workstation; a robotic arm configured to transfer the workpiece between the load port and the processing chamber; and a defect sensor configured to detect a defect along a surface of the workpiece when transferred between the load port and the processing chamber.

公开(公告)号：US11756840B2

公开(公告)日：2023-09-12

申请号：US16444792

申请日：2019-06-18

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yan-Hong Liu ,  Daniel M. Y. Yang ,  Che-Fu Chen

IPC分类号： H01L21/66 ,  H01L21/687 ,  H01L21/67 ,  H01L21/3213 ,  G01N21/55 ,  H05K3/06

CPC分类号： H01L22/12 ,  G01N21/55 ,  H01L21/32137 ,  H01L21/67253 ,  H01L21/68707 ,  H05K3/068

摘要： A system includes a factory interface, an etching tool, and at least one measuring device. The factory interface is configured to carry a wafer. The etching tool is coupled to the factory interface and configured to process the wafer transferred from the factory interface. The at least one measuring device is equipped in the factory interface, the etching tool, or the combination thereof. The at least one measuring device is configured to perform real-time measurements of reflectance from the wafer that is carried in the factory interface or the etching tool.

公开(公告)号：US11211232B2

公开(公告)日：2021-12-28

申请号：US16398667

申请日：2019-04-30

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Ian Hsieh ,  Che-fu Chen ,  Yan-Hong Liu

IPC分类号： H01L21/67 ,  H01L21/683 ,  H01J37/32 ,  A01D5/00

摘要： The present disclosure describes a chuck-based device and a method for cleaning a semiconductor manufacturing system. The semiconductor manufacturing system can include a chamber with the chuck-based device configured to clean the chamber, a loading port coupled to the chamber and configured to hold one or more wafer storage devices, and a control device configured to control a translational displacement and a rotation of the chuck-based device. The chuck-based device can include a based stage, one or more supporting rods disposed at the base stage and configured to be vertically extendable or retractable, and a padding film disposed on the one or more supporting rods.

公开(公告)号：US10978333B2

公开(公告)日：2021-04-13

申请号：US15883525

申请日：2018-01-30

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yan-Hong Liu ,  Ming-Feng Chen ,  Che-fu Chen ,  Hung-Wen Chen

IPC分类号： G05B19/04 ,  H01L21/687 ,  H01L21/677 ,  H01L21/67

摘要： In an embodiment, a robotic arm includes: a base; at least one link secured to the base; a gripper secured to the at least one link, wherein: the gripper comprises a finger, the gripper is configured to secure a wafer while the at least one link is in motion, and the gripper is configured to release the wafer while the at least one link is stopped, a sensor disposed on the finger, the sensor configured to collect sensor data characterizing the robotic arm's interaction with a semiconductor processing chamber while the wafer is secured using the finger.