公开(公告)号：US20150228599A1

公开(公告)日：2015-08-13

申请号：US14694780

申请日：2015-04-23

申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

发明人： Yu-Chia LAI ,  Hsien-Ming TU ,  Tung-Liang SHAO ,  Hsien-Wei CHEN ,  Chang-Pin HUANG ,  Ching-Jung YANG

IPC分类号： H01L23/00 ,  H01L21/56

CPC分类号： H01L24/11 ,  H01L21/563 ,  H01L23/3192 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02235 ,  H01L2224/0225 ,  H01L2224/02255 ,  H01L2224/02313 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/10125 ,  H01L2224/11015 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2924/181 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/00

摘要： A packaged semiconductor device includes a semiconductor substrate, a metal pad, a metal base, a polymer insulating layer, a copper-containing structure and a conductive bump. The metal pad and the metal base are disposed on the semiconductor substrate. The polymer insulating layer overlies the metal base and the semiconductor substrate. The copper-containing structure is disposed over the polymer insulating layer, and includes a support structure and a post-passivation interconnect (PPI) line. The support structure is aligned with the metal base. The PPI line is located partially within the support structure, and extends out through an opening of the support structure, in which a top of the support structure is elevated higher than a top of the PPI line. The conductive bump is held by the support structure.

摘要翻译： 封装半导体器件包括半导体衬底，金属焊盘，金属基底，聚合物绝缘层，含铜结构和导电凸块。 金属焊盘和金属基底设置在半导体衬底上。 聚合物绝缘层覆盖金属基底和半导体基底。 含铜结构设置在聚合物绝缘层之上，并且包括支撑结构和钝化后互连（PPI）线。 支撑结构与金属基座对准。 PPI线部分地位于支撑结构内，并且通过支撑结构的开口延伸出，其中支撑结构的顶部升高到高于PPI线的顶部。 导电凸块由支撑结构保持。