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公开(公告)号:US20230301049A1
公开(公告)日:2023-09-21
申请号:US18304301
申请日:2023-04-20
Inventor: Hidehiro FUJIWARA , Chih-Yu LIN , Hsien-Yu PAN , Yasutoshi OKUNO , Yen-Huei CHEN , Hung-Jen LIAO
IPC: H10B10/00 , H01L23/528 , H01L27/02 , H01L23/522 , G06F30/392
CPC classification number: H10B10/12 , G06F30/392 , H01L23/5226 , H01L23/5286 , H01L27/0207
Abstract: A method of forming a memory circuit includes generating a layout design of the memory circuit, and manufacturing the memory circuit based on the layout design. The generating of the layout design includes generating a first active region layout pattern corresponding to fabricating a first active region of a first pull down transistor, generating a second active region layout pattern corresponding to fabricating a second active region of a first pass gate transistor, and generating a first metal contact layout pattern corresponding to fabricating a first metal contact. The first metal contact layout pattern overlaps the cell boundary of the memory circuit and the first active region layout pattern. The first metal contact electrically coupled to a source of the first pull down transistor. The memory circuit being a four transistor (4T) memory cell including a first and second pass gate transistor, and a first and second pull down transistor.
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公开(公告)号:US20230064056A1
公开(公告)日:2023-03-02
申请号:US17461216
申请日:2021-08-30
Inventor: Hua-Hsin YU , Hung-Jen LIAO , Cheng-Hung LEE , Hau-Tai SHIEH
IPC: G11C7/06
Abstract: A device is disclosed and includes an input stage circuit, a switching circuit, and a first latch circuit. The input stage circuit generates a first input signal having a first voltage and a second input signal based on a third input signal. The switching circuit operates in response to a first control signal, and adjusts a voltage level of a first data line according to the first input signal and a voltage level of a second data line according to the second input signal. The first latch circuit is coupled to the switching circuit by the first data line and the second data line. The first latch circuit latches a data in response to the first control signal and a second control signal, and adjusts the voltage level of the first data line based on a second voltage different from the first voltage.
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公开(公告)号:US20220366965A1
公开(公告)日:2022-11-17
申请号:US17816048
申请日:2022-07-29
Inventor: Hidehiro FUJIWARA , Hung-Jen LIAO , Li-Wen WANG , Jonathan Tsung-Yung CHANG , Yen-Huei CHEN
IPC: G11C11/4094 , G11C7/12 , G11C11/4096 , G11C5/06 , G11C11/419 , H01L21/48 , H01L27/11
Abstract: A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells that are connected correspondingly between the LWB and LWB_bar lines; and a distributed write driving arrangement including a global write driver and local write drivers included correspondingly in the segments; and the global write driver including a first equalizer circuit, arranged in a switched-coupling between the LWB line and the LWB_bar line, and arranged in a control-coupling with respect to signals correspondingly on the GWB line and the GWB_bar line, and the global write driver and the local write drivers each including first inversion couplings (coupled in parallel between the GWB line and the LWB line) and second inversion couplings (coupled in parallel between the GWB_bar line and the LWB_bar line).
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公开(公告)号:US20220328096A1
公开(公告)日:2022-10-13
申请号:US17808536
申请日:2022-06-23
Inventor: Yen-Huei CHEN , Hidehiro FUJIWARA , Hung-Jen LIAO , Jonathan Tsung-Yung CHANG
IPC: G11C11/419 , G11C11/412 , G06N3/08 , G06F17/16
Abstract: A memory circuit includes a first memory array including first memory cells wherein a plurality of first word lines is coupled with a plurality of rows of first memory cells in a first segment of the first memory array, and a plurality of second word lines is coupled with the plurality of rows of first memory cells in a second segment of the first memory array. The memory circuit also includes a read circuit configured to retrieve data from the first memory cells of the first memory array and a computation circuit configured to perform a matrix computation by combining first data retrieved from the first memory cells of the first segment with second data retrieved from the first memory cells of the second segment.
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公开(公告)号:US20210280437A1
公开(公告)日:2021-09-09
申请号:US17241687
申请日:2021-04-27
Inventor: Hidehiro FUJIWARA , Hung-Jen LIAO , Li-Wen WANG , Jonathan Tsung-Yung CHANG , Yen-Huei CHEN
IPC: H01L21/48 , H01L27/11 , G11C11/419 , G11C5/06
Abstract: A method of fabricating (a distributed write driving arrangement for a semiconductor memory device) includes: forming bit cells and a local write driver in a first device layer; forming a local write bit (LWB) line and a local write bit_bar (LWB_bar) line in a first metallization layer; connecting each of the bit cells correspondingly between the LWB and LWB_bar lines; connecting the local write driver to the LWB line and the LWB_bar line; forming a global write bit (GWB) line and a global write bit_bar (GWBL_bar) line in a second metallization layer; connecting the GWB line to the LWB line; connecting the GWB line and the GWBL_bar line to the corresponding LWB line and LWB_bar line; forming a global write driver in a second device layer; and connecting the global write driver to the GWB line and the GWBL_bar line.
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公开(公告)号:US20190096895A1
公开(公告)日:2019-03-28
申请号:US16205751
申请日:2018-11-30
Inventor: Tsung-Hsien HUANG , Hong-Chen CHENG , Cheng Hung LEE , Hung-Jen LIAO
IPC: H01L27/112 , G11C7/18
Abstract: A method of making a semiconductor device includes forming a first memory device, connecting a first word line to the first memory device, forming at least a first via, forming a second memory device, connecting a second word line to the second memory device, connecting a bit line to the first memory device and connecting the bit line to the second memory device by the first via. The first and second memory devices are separated by an inter-layer dielectric, and the first via connects the first memory device and the second memory device.
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公开(公告)号:US20160372181A1
公开(公告)日:2016-12-22
申请号:US15251260
申请日:2016-08-30
Inventor: Hidehiro FUJIWARA , Li-Wen WANG , Yen-Huei CHEN , Hung-Jen LIAO
IPC: G11C11/419
CPC classification number: G11C11/419 , G11C8/14 , G11C11/418 , H01L27/0207 , H01L27/1116
Abstract: A memory circuit includes first and second memory cells. The first memory cell has an access port having a pass gate. The second memory cell also has an access port having a pass gate. The first and second memory cells abut one another along a column direction. The circuit includes at least one conductive structure over the first and second memory cells. The conductive structure may be two interconnected conductive lines. The conductive structure extends along a row direction in a conductive layer and is electrically coupled to the gate terminals of the pass gates.
Abstract translation: 存储电路包括第一和第二存储单元。 第一存储器单元具有具有通孔的访问端口。 第二存储单元还具有具有通孔的访问端口。 第一和第二存储器单元沿列方向彼此邻接。 电路包括在第一和第二存储器单元上的至少一个导电结构。 导电结构可以是两个互连的导电线。 导电结构在导电层中沿着行方向延伸并且电耦合到通孔的栅极端子。
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公开(公告)号:US20150364412A1
公开(公告)日:2015-12-17
申请号:US14835788
申请日:2015-08-26
Inventor: Hung-Jen LIAO , Jung-Hsuan CHEN , Chien Chi TIEN , Ching-Wei WU , Jui-Che TSAI , Hong-Chen CHENG , Chung-Hsing WANG
IPC: H01L23/50 , H01L27/11 , H01L27/02 , H01L23/528 , H01L23/522
CPC classification number: H01L23/50 , H01L23/49811 , H01L23/49827 , H01L23/5226 , H01L23/528 , H01L23/53204 , H01L27/0203 , H01L27/11 , H01L2924/0002 , H01L2924/00
Abstract: An integrated circuit (IC) memory device includes a first conductive layer. The IC memory device also includes a second conductive layer over the first conductive layer. The IC memory device further includes a first-type pin box electrically coupled with the first conductive layer. The IC memory device additionally includes a second-type pin box, different from the first-type pin box, electrically coupled with the second conductive layer.
Abstract translation: 集成电路(IC)存储器件包括第一导电层。 IC存储器件还包括在第一导电层上的第二导电层。 IC存储器件还包括与第一导电层电耦合的第一型引脚盒。 IC存储器件还包括与第一类型引脚盒不同的第二型引脚盒,与第二导电层电耦合。
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公开(公告)号:US20240361819A1
公开(公告)日:2024-10-31
申请号:US18764379
申请日:2024-07-05
Inventor: Chia-Chen KUO , Yangsyu LIN , Yu-Hao HSU , Cheng Hung LEE , Hung-Jen LIAO
IPC: G06F1/3206 , G06F1/3234
CPC classification number: G06F1/3206 , G06F1/3275
Abstract: A circuit includes a power detector and a logic circuit. The power detector is configured to output a first power management signal according to a first power supply signal from a first power supply and a status signal. The circuit is configured to operate in different modes in response to the status signal. The logic circuit is configured to output a second power management signal, according to the first power management signal and the status signal.
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公开(公告)号:US20240357788A1
公开(公告)日:2024-10-24
申请号:US18756363
申请日:2024-06-27
Inventor: Hidehiro FUJIWARA , Chih-Yu LIN , Hsien-Yu PAN , Yasutoshi OKUNO , Yen-Huei CHEN , Hung-Jen LIAO
IPC: H10B10/00 , G06F30/392 , H01L23/522 , H01L23/528 , H01L27/02
CPC classification number: H10B10/12 , G06F30/392 , H01L23/5226 , H01L23/5286 , H01L27/0207
Abstract: A memory circuit includes a first pull down transistor, a first pass gate transistor coupled to the first pull down transistor, a second pull down transistor, a second pass gate transistor and a first metal contact. The second pull down transistor has a first active region located on a first level. The second pass gate transistor has a second active region located on the first level, and being coupled to the second pull down transistor. The first metal contact extends from the first active region to the second active region, being located on a second level, and electrically coupling a drain of the second pull down transistor to a drain of the second pass gate transistor. The first pass gate transistor, the second pass gate transistor, the first pull down transistor and the second pull down transistor are part of a four transistor (4T) memory cell.
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