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公开(公告)号:US20230297235A1
公开(公告)日:2023-09-21
申请号:US18321615
申请日:2023-05-22
IPC分类号: G06F3/06 , G11C11/419 , G06F7/544
CPC分类号: G06F3/061 , G11C11/419 , G06F3/0673 , G06F3/0655 , G06F7/5443
摘要: An in-memory computing device includes in some examples a two-dimensional array of memory cells arranged in rows and columns, each memory cell made of a nine-transistor current-based SRAM. Each memory cell includes a six-transistor SRAM cell and a current source coupled by a switching transistor, which is controlled by input signals on an input line, to an output line associates with the column of memory cells the memory cell is in. The current source includes a switching transistor controlled by the state of the six-transistor SRAM cell, and a current regulating transistor adapted to generate a current at a level determined by a control signal applied at the gate. The control signal can be set such that the total current in each output line is increased by a factor of 2 in each successive column of the memory cells.
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公开(公告)号:US20220366965A1
公开(公告)日:2022-11-17
申请号:US17816048
申请日:2022-07-29
IPC分类号: G11C11/4094 , G11C7/12 , G11C11/4096 , G11C5/06 , G11C11/419 , H01L21/48 , H01L27/11
摘要: A semiconductor memory device includes: a local write bit (LWB) line; a local write bit_bar (LWB_bar) line; a global write bit (GWB) line; a global write bit_bar (GWBL_bar) line; a column of segments, each segment including bit cells that are connected correspondingly between the LWB and LWB_bar lines; and a distributed write driving arrangement including a global write driver and local write drivers included correspondingly in the segments; and the global write driver including a first equalizer circuit, arranged in a switched-coupling between the LWB line and the LWB_bar line, and arranged in a control-coupling with respect to signals correspondingly on the GWB line and the GWB_bar line, and the global write driver and the local write drivers each including first inversion couplings (coupled in parallel between the GWB line and the LWB line) and second inversion couplings (coupled in parallel between the GWB_bar line and the LWB_bar line).
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公开(公告)号:US20220328096A1
公开(公告)日:2022-10-13
申请号:US17808536
申请日:2022-06-23
IPC分类号: G11C11/419 , G11C11/412 , G06N3/08 , G06F17/16
摘要: A memory circuit includes a first memory array including first memory cells wherein a plurality of first word lines is coupled with a plurality of rows of first memory cells in a first segment of the first memory array, and a plurality of second word lines is coupled with the plurality of rows of first memory cells in a second segment of the first memory array. The memory circuit also includes a read circuit configured to retrieve data from the first memory cells of the first memory array and a computation circuit configured to perform a matrix computation by combining first data retrieved from the first memory cells of the first segment with second data retrieved from the first memory cells of the second segment.
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公开(公告)号:US20220019407A1
公开(公告)日:2022-01-20
申请号:US17203130
申请日:2021-03-16
发明人: Yu-Der CHIH , Hidehiro FUJIWARA , Yi-Chun SHIH , Po-Hao LEE , Yen-Huei CHEN , Chia-Fu LEE , Jonathan Tsung-Yung CHANG
IPC分类号: G06F7/501 , G06F7/53 , G11C7/10 , G11C11/4074
摘要: A memory circuit includes a selection circuit, a column of memory cells, and an adder tree. The selection circuit is configured to receive input data elements, each input data element including a number of bits equal to H, and output a selected set of kth bits of the H bits of the input data elements. Each memory cell of the column of memory cells includes a first storage unit configured to store a first weight data element and a first multiplier configured to generate a first product data element based on the first weight data element and a first kth bit of the selected set of kth bits. The adder tree is configured to generate a summation data element based on each of the first product data elements.
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公开(公告)号:US20210280437A1
公开(公告)日:2021-09-09
申请号:US17241687
申请日:2021-04-27
IPC分类号: H01L21/48 , H01L27/11 , G11C11/419 , G11C5/06
摘要: A method of fabricating (a distributed write driving arrangement for a semiconductor memory device) includes: forming bit cells and a local write driver in a first device layer; forming a local write bit (LWB) line and a local write bit_bar (LWB_bar) line in a first metallization layer; connecting each of the bit cells correspondingly between the LWB and LWB_bar lines; connecting the local write driver to the LWB line and the LWB_bar line; forming a global write bit (GWB) line and a global write bit_bar (GWBL_bar) line in a second metallization layer; connecting the GWB line to the LWB line; connecting the GWB line and the GWBL_bar line to the corresponding LWB line and LWB_bar line; forming a global write driver in a second device layer; and connecting the global write driver to the GWB line and the GWBL_bar line.
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公开(公告)号:US20230326521A1
公开(公告)日:2023-10-12
申请号:US17716609
申请日:2022-04-08
发明人: Yu-Der CHIH , Yun-Sheng CHEN , Jonathan Tsung-Yung CHANG , Hsin-Yuan YU , Chrong Jung LIN , Ya-Chin KING
IPC分类号: G11C11/54
CPC分类号: G11C11/54
摘要: A memory device includes a first active area, a first doped structure of a first doping type, a second active area, a first gate structure and a second doped structure of a second doping type different from the first doping type. The second active area is disposed between the first active area and the first doped structure. The first gate structure is disposed between the first active area and the second active area in a layout view, and configured to store a first bit with the first active area and the second active area. The second doped structure is coupled to the first gate structure and disposed between the first doped structure and the second active area. The second doped structure and the first doped structure are configured to receive a first signal corresponding to the first bit from the first gate structure.
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公开(公告)号:US20230050279A1
公开(公告)日:2023-02-16
申请号:US17589638
申请日:2022-01-31
发明人: Rawan NAOUS , Kerem AKARVARDAR , Hidehiro FUJIWARA , Haruki MORI , Yu-Der CHIH , Mahmut SINANGIL , Yih WANG , Jonathan Tsung-Yung CHANG
IPC分类号: G06F7/544
摘要: An integrated circuit includes a first encoder, a compute in-memory (CIM) array and a de-encoder. The first encoder is configured to quantize a first received signal into a first signal. The first received signal has a first floating point number format. The first signal has an integer number format. The compute in-memory (CIM) array is coupled to the first encoder. The CIM array is configured to generate a CIM signal in response to at least the first signal. The CIM signal has the integer number format. The de-encoder is coupled to the CIM array, and is configured to generate a first output signal in response to the CIM signal. The first output signal has a second floating point number format.
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公开(公告)号:US20220293492A1
公开(公告)日:2022-09-15
申请号:US17209878
申请日:2021-03-23
发明人: Hidehiro FUJIWARA , Tze-Chiang HUANG , Hong-Chen CHENG , Yen-Huei CHEN , Hung-Jen LIAO , Jonathan Tsung-Yung CHANG , Yun-Han LEE , Lee-Chung LU
IPC分类号: H01L23/48 , H01L21/768 , H01L27/11 , G11C11/418
摘要: A memory macro structure includes a first memory array, a second memory array, a cell activation circuit coupled to the first and second memory arrays and positioned between the first and second memory arrays, a control circuit coupled to the cell activation circuit and positioned adjacent to the cell activation circuit, and a through-silicon via (TSV) extending through one of the cell activation circuit or the control circuit.
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公开(公告)号:US20210287726A1
公开(公告)日:2021-09-16
申请号:US17335866
申请日:2021-06-01
发明人: Chien-Kuo SU , Chiting CHENG , Pankaj AGGARWAL , Yen-Huei CHEN , Cheng Hung LEE , Hung-Jen LIAO , Jonathan Tsung-Yung CHANG , Jhon Jhy LIAW
IPC分类号: G11C7/12 , G11C7/22 , G11C11/419
摘要: A memory macro includes a first memory cell array, a first tracking circuit, a first and a second transistor. The first memory cell array includes rows of memory cells and columns of memory cells. The first tracking circuit includes a first set of memory cells configured as a first set of loading cells responsive to a first control signal, a second set of memory cells configured as a first set of pull-down cells responsive to a second control signal, and a first tracking bit line coupled to the first and second set of memory cells. The first set of pull-down cells or loading cells is configured to track a memory cell of the first memory cell array. The first and second transistor are coupled to the first tracking bit line, and configured to charge the first tracking bit line to a pre-charge voltage level responsive to a tracking enable signal.
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公开(公告)号:US20180294020A1
公开(公告)日:2018-10-11
申请号:US16005121
申请日:2018-06-11
发明人: Chien-Kuo SU , Cheng Hung LEE , Chiting CHENG , Hung-Jen LIAO , Jonathan Tsung-Yung CHANG , Yen-Huei CHEN , Pankaj AGGARWAL , Jhon Jhy LIAW
IPC分类号: G11C7/12 , G11C11/419 , G11C7/22
CPC分类号: G11C7/12 , G11C7/227 , G11C11/419
摘要: A memory macro includes a first set of memory cells, a second set of memory cells and a set of conductive lines. The first set of memory cells is arranged in columns and rows. Each memory cell of the first set of memory cells includes a voltage supply node configured to receive a first voltage of a first supply voltage or a second voltage of a second supply voltage. The second set of memory cells includes a set of retention circuits configured to supply the second voltage of the second supply voltage to the first set of memory cells during a sleep operational mode. The set of conductive lines is coupled to the set of retention circuits and the voltage supply node of each memory cell of the first set of memory cells.
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