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公开(公告)号：US20160104940A1
公开(公告)日：2016-04-14
申请号：US14510796
申请日：2014-10-09
发明人： Chuei-Tang WANG , Jeng-Shieh HSIEH , Chung-Hao TSAI , Monsen LIU , Chen-Hua YU
IPC分类号： H01Q19/10 , H01Q19/185 , H01Q19/00
CPC分类号： H01Q21/065 , H01L23/66 , H01L24/20 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01Q1/2283 , H01Q19/005 , H01Q19/10 , H01Q19/185
摘要： An integrated fan out (InFO) antenna includes a reflector on a surface of a substrate; and a package. The package includes a redistribution layer (RDL) arranged to form an antenna ground, and a patch antenna over the RDL, wherein the RDL is between the patch antenna and the reflector. The InFO antenna further includes a plurality of connecting elements bonding the package to the reflector. Each connecting element of the plurality of connecting elements is located inside an outer perimeter of the reflector. The InFO antenna is configured to output a signal having a wavelength.
摘要翻译： 集成的风扇输出（InFO）天线包括在基板的表面上的反射器; 和一个包。 该封装包括布置成形成天线接地的再分配层（RDL）和RDL上的贴片天线，其中RDL位于贴片天线和反射器之间。 InFO天线还包括将封装结合到反射器的多个连接元件。 多个连接元件的每个连接元件位于反射器的外周边内。 InFO天线被配置为输出具有波长的信号。
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公开(公告)号：US20230387961A1
公开(公告)日：2023-11-30
申请号：US18361816
申请日：2023-07-28
发明人： En-Hsiang YEH , Monsen LIU , Chuei-Tang WANG
CPC分类号： H04B1/48 , H04B1/18 , H04B1/0458
摘要： A method includes switching a receiver path network of a front-end module to a first matching mode in a receive mode. The method further includes switching a transmitter path network of the front-end module to a first resonance mode in the receive mode. The method further includes switching the transmitter path network to a second matching mode in a transmit mode. The method further includes switching the receiver path network to a second resonance mode in the transmit mode.
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公开(公告)号：US20230154892A1
公开(公告)日：2023-05-18
申请号：US17669914
申请日：2022-02-11
发明人： Yen-Chu TU , Shang-Lun TSAI , Monsen LIU , Shuo-Mao CHEN , Shin-Puu JENG
IPC分类号： H01L25/065 , H01L23/538 , H01L23/31 , H01L23/498 , H01L23/00 , H01L25/00 , H01L21/56 , H01L21/48
CPC分类号： H01L25/0655 , H01L23/5383 , H01L23/5386 , H01L23/3157 , H01L23/49811 , H01L24/17 , H01L24/16 , H01L24/73 , H01L25/50 , H01L21/563 , H01L21/4857 , H01L2224/17177 , H01L2224/16227 , H01L2224/73204
摘要： A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a connecting element, a first semiconductor device, a second semiconductor device, a first underfill layer, and a package layer. The interposer substrate is disposed on the carrier substrate. The connecting element is disposed in the interposer substrate. The connecting element includes a dielectric element and first conductive features disposed in the dielectric element. The first semiconductor device and the second semiconductor device are disposed on the interposer substrate. The first semiconductor device is electrically connected to the second semiconductor device through the connecting element. The first underfill layer is disposed between the first semiconductor device, the second semiconductor device, and the interposer substrate. The package layer surrounds the first semiconductor device, the second semiconductor device, and the first underfill layer.
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公开(公告)号：US20210028811A1
公开(公告)日：2021-01-28
申请号：US17066113
申请日：2020-10-08
发明人： En-Hsiang YEH , Monsen LIU , Chuei-Tang WANG
摘要： A method includes switching a receiver path network of a front-end module to a first matching mode in a receive mode. The method further includes switching a transmitter path network of the front-end module to a first resonance mode in the receive mode. The method further includes switching the transmitter path network to a second matching mode in a transmit mode. The method further includes switching the receiver path network to a second resonance mode in the transmit mode.
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公开(公告)号：US20200067560A1
公开(公告)日：2020-02-27
申请号：US16665546
申请日：2019-10-28
发明人： En-Hsiang YEH , Monsen LIU , Chuei-Tang WANG
摘要： A method includes (a) switching a receiver path network of a front end module to a first matching mode in a receive mode. The method further includes (b) switching a transmitter path network of the front end module to a first resonance mode in the receive mode. The method further includes (c) switching the transmitter path network to a second matching mode in a transmit mode. The method further includes (d) switching the receiver path network to a second resonance mode in the transmit mode.
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6.发明申请公开(公告)号：US20180102595A1
公开(公告)日：2018-04-12
申请号：US15837480
申请日：2017-12-11
发明人： Chuei-Tang WANG , Jeng-Shieh HSIEH , Chung-Hao TSAI , Monsen LIU , Chen-Hua YU
IPC分类号： H01Q21/06 , H01Q1/22 , H01Q19/00 , H01Q19/185 , H01Q19/10
CPC分类号： H01Q21/065 , H01L23/66 , H01L24/20 , H01L2223/6677 , H01L2224/04105 , H01L2224/12105 , H01Q1/2283 , H01Q19/005 , H01Q19/10 , H01Q19/185
摘要： A semiconductor device includes an active device. The semiconductor device further includes a plurality of antenna grounds electrically connected to the active device. The semiconductor device further includes a plurality of patch antennas, wherein each patch antenna of the plurality of patch antennas is over a corresponding antenna ground of the plurality of antenna grounds. The semiconductor device further includes a plurality of reflectors, wherein each antenna ground of the plurality of antenna ground is between a corresponding patch antenna of the plurality of patch antennas and a corresponding reflector of the plurality of reflectors. An area of each antenna ground of the plurality of antenna grounds is greater than an area of each reflector of the plurality of reflectors.
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公开(公告)号：US20160093588A1
公开(公告)日：2016-03-31
申请号：US14496327
申请日：2014-09-25
发明人： Chuei-Tang WANG , Monsen LIU , Sen-Kuei HSU , Chen-Hua YU
IPC分类号： H01L25/065
CPC分类号： H01L23/50 , B23H7/10 , H01L23/49822 , H01L23/49827 , H01L24/18 , H01L25/03 , H01L25/16 , H01L25/18 , H01L2224/16225 , H01L2225/06513 , H01L2225/06541 , H01L2924/15311 , H01L2924/181 , H05K1/181 , H05K2201/10159 , H05K2201/10515 , H01L2924/00012
摘要： A semiconductor device includes a device die, a first power supply die, and a second power supply die different from the first power supply die. The device die includes a first circuit and a second circuit. The first power supply die is electrically coupled to the first circuit and configured to supply power for the first circuit. The second power supply die is electrically coupled to the second circuit and configured to supply power for the second circuit. The first and second power supply dies are attached to the device die, and overlap the device die in a thickness direction of the device die.
摘要翻译： 半导体器件包括与第一电源裸片不同的器件管芯，第一电源管芯和第二电源管芯。 器件裸片包括第一电路和第二电路。 第一电源管芯电耦合到第一电路并且被配置为为第一电路供电。 第二电源裸片电耦合到第二电路并且被配置为为第二电路供电。 第一和第二电源模具附接到器件管芯，并且沿着器件管芯的厚度方向与器件管芯重叠。
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