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    Semiconductor processing tool and methods of operation
    2.
    发明授权
    Semiconductor processing tool and methods of operation 有权

    公开(公告)号：US12164235B2

    公开(公告)日：2024-12-10

    申请号：US18362135

    申请日：2023-07-31

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Shao-Hua Wang ,  Kueilin Ho ,  Cheng Wei Sun ,  Zong-You Yang ,  Chih-Chun Chiang ,  Yi-Fam Shiu ,  Chueh-Chi Kuo ,  Heng-Hsin Liu ,  Li-Jui Chen

    IPC: G03F7/00

    Abstract: Some implementations described herein include operating components in a lithography system at variable speeds to reduce, minimize, and/or prevent particle generation due to rubbing of or collision between contact parts of the components. In some implementations, a component in a path of transfer of a semiconductor substrate in the lithography system is operated at a relatively high movement speed through a first portion of an actuation operation, and is operated at a reduced movement speed (e.g., a movement speed that is less than the high movement speed) through a second portion of the actuation operation in which contact parts of the component are to interact. The reduced movement speed reduces the likelihood of particle generation and/or release from the contact parts when the contact parts interact, while the high movement speed provides a high semiconductor substrate throughput in the lithography system.

    Semiconductor processing tool and methods of operation
    4.
    发明授权
    Semiconductor processing tool and methods of operation 有权

    公开(公告)号：US12111583B2

    公开(公告)日：2024-10-08

    申请号：US18446698

    申请日：2023-08-09

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Kai-Chieh Chang ,  Kai-Fa Ho ,  Li-Jui Chen ,  Heng-Hsin Liu

    IPC: G03F7/00

    CPC classification number: G03F7/70741 ,  G03F7/70033 ,  G03F7/70633 ,  G03F7/70875 ,  G03F7/70891

    Abstract: A reticle is pre-heated prior to an exposure operation of a semiconductor substrate lot to reduce substrate to substrate temperature variations of the reticle in the exposure operation. The reticle may be pre-heated while being stored in a reticle storage slot, while being transferred from the reticle storage slot to a reticle stage of an exposure tool, and/or in another location prior to being secured to the reticle stage for the exposure operation. In this way, the reduction in temperature variation of the reticle in the exposure operation provided by pre-heating the reticle may reduce overlay deltas and misalignment for the semiconductor substrates that are processed in the exposure operation. This increases overlay performance, increases yield of the exposure tool, and increases semiconductor device quality. Moreover, pre-heating the reticle prior to securing the reticle to the reticle stage for the exposure operation reduces and/or minimizes the impact that the pre-heating has on throughput and processing times of the exposure tool.

    Reticle cleaning device and method of use
    8.
    发明授权
    Reticle cleaning device and method of use 有权

    公开(公告)号：US11650512B2

    公开(公告)日：2023-05-16

    申请号：US17655877

    申请日：2022-03-22

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Che-Chang Hsu ,  Sheng-Kang Yu ,  Shang-Chieh Chien ,  Li-Jui Chen ,  Heng-Hsin Liu

    IPC: G03F7/20 ,  G03F1/82 ,  G03F1/62

    CPC classification number: G03F7/70925 ,  G03F1/62 ,  G03F1/82 ,  G03F7/70033

    Abstract: Some implementations described herein provide a reticle cleaning device and a method of use. The reticle cleaning device includes a support member configured for extension toward a reticle within an extreme ultraviolet lithography tool. The reticle cleaning device also includes a contact surface disposed at an end of the support member and configured to bond to particles contacted by the contact surface. The reticle cleaning device further includes a stress sensor configured to measure an amount of stress applied to the support member at the contact surface. During a cleaning operation in which the contact surface is moving toward the reticle, the stress sensor may provide an indication that the amount of stress applied to the support member satisfies a threshold. Based on satisfying the threshold, movement of the contact surface and/or the support member toward the reticle ceases to avoid damaging the reticle.

    INSPECTION SYSTEM FOR EXTREME ULTRAVIOLET (EUV) LIGHT SOURCE
    9.
    发明申请
    INSPECTION SYSTEM FOR EXTREME ULTRAVIOLET (EUV) LIGHT SOURCE 有权

    公开(公告)号：US20220326624A1

    公开(公告)日：2022-10-13

    申请号：US17382955

    申请日：2021-07-22

    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

    Inventor： Chiao-Hua Cheng ,  Shang-Chieh Chien ,  Heng-Hsin Liu ,  Li-Jui Chen ,  Sheng-Kang Yu

    IPC: G03F7/20 ,  H04N5/232 ,  G06T7/00

    Abstract: A method for inspecting an extreme ultraviolet (EUV) light source includes: removing a collector mirror of the EUV light source from a collector chamber; installing an inspection apparatus within the collector chamber, the apparatus including a selectively extendable and retractable member and a camera at one end of the member; operating a first actuator to extend the member along a path through the interior chamber of the EUV light source, thereby moving the camera to a given position within the interior chamber of the EUV light source; operating a second actuator to pan the camera about an axis of rotation, thereby establishing a given camera orientation within the interior of the EUV light source; and, capturing an image of the interior chamber of the EUV light source with the camera while the camera is at the given position and orientation established by the operation of the first and second actuators.

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