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公开(公告)号：US10689247B2
公开(公告)日：2020-06-23
申请号：US15860357
申请日：2018-01-02
发明人： Yu-Chia Liu , Chia-Hua Chu , Chun-Wen Cheng
摘要： Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
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公开(公告)号：US10273148B2
公开(公告)日：2019-04-30
申请号：US14826249
申请日：2015-08-14
发明人： Chun-Wen Cheng , Jung-Huei Peng , Chia-Hua Chu , Nien-Tsung Tsai , Yao-Te Huang , Li-Min Hung , Yu-Chia Liu
摘要： Some embodiments of the present disclosure provide a microelectromechanical systems (MEMS). The MEMS includes a semiconductive block. The semiconductive block includes a protruding structure. The protruding structure includes a bottom surface. The semiconductive block includes a sensing structure. A semiconductive substrate includes a conductive region. The conductive region includes a first surface under the sensing structure. The first surface is substantially coplanar with the bottom surface. A dielectric region includes a second surface not disposed over the first surface.
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公开(公告)号：US09868628B2
公开(公告)日：2018-01-16
申请号：US15066799
申请日：2016-03-10
发明人： Yu-Chia Liu , Chia-Hua Chu , Chun-Wen Cheng
CPC分类号： B81B7/0006 , B81B7/0051 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81C1/00246 , B81C2201/0132 , B81C2201/0133 , B81C2201/0176 , B81C2201/0181 , B81C2201/112 , B81C2203/0714 , B81C2203/0735
摘要： Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
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公开(公告)号：US20170260042A1
公开(公告)日：2017-09-14
申请号：US15066799
申请日：2016-03-10
发明人： Yu-Chia Liu , Chia-Hua Chu , Chun-Wen Cheng
CPC分类号： B81B7/0006 , B81B7/0051 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81C1/00246 , B81C2201/0132 , B81C2201/0133 , B81C2201/0176 , B81C2201/0181 , B81C2201/112 , B81C2203/0714 , B81C2203/0735
摘要： Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
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公开(公告)号：US10202278B2
公开(公告)日：2019-02-12
申请号：US15255606
申请日：2016-09-02
发明人： Jung-Huei Peng , Yi-Chien Wu , Yu-Chia Liu , Chun-Wen Cheng
摘要： The present disclosure provides a semiconductor structure. The semiconductor structure includes a cavity disposed in a substrate and enclosed by a first surface and a second surface opposite to the first surface. The semiconductor structure also includes a first electrode pair having a first electrode on the first surface and a second electrode on the second surface. The first electrode pair is configured to measure a first spacing between the first surface and the second surface. The semiconductor structure further includes a second electrode pair having a third electrode on the first surface and a fourth electrode on the second surface. The second electrode pair is configured to measure a second spacing between the first surface and the second surface.
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公开(公告)号：US20180118560A1
公开(公告)日：2018-05-03
申请号：US15860357
申请日：2018-01-02
发明人： Yu-Chia Liu , Chia-Hua Chu , Chun-Wen Cheng
摘要： Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
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