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公开(公告)号：US20150126131A1
公开(公告)日：2015-05-07
申请号：US14476640
申请日：2014-09-03
发明人： Jin MIKATA
CPC分类号： H04M1/24 , H04B1/0458 , H04B1/18 , H04B17/309 , H04W24/00
摘要： In a wireless communication device, a reactance element is connected in series between an input/output terminal of a wireless communication and an impedance-matching circuit. A measuring reactance element is provided in an external measuring device, and the types and circuit contacts of respective elements are chosen such that when the reactance element and the measuring reactance element are connected in parallel during power measurement, they together form a band-stop filter circuit that blocks signals of a prescribed frequency band outputted from the wireless communication circuit.
摘要翻译： 在无线通信装置中，电抗元件串联连接在无线通信的输入/输出端与阻抗匹配电路之间。 在外部测量装置中提供测量电抗元件，并且选择各个元件的类型和电路触点，使得当在功率测量期间电抗元件和测量电抗元件并联连接时，它们一起形成带阻滤波器 阻断从无线通信电路输出的规定频带的信号的电路。
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公开(公告)号：US20180286817A1
公开(公告)日：2018-10-04
申请号：US15935829
申请日：2018-03-26
发明人： Kenzo KITAZAKI , Takehiko KAI , Masaya SHIMAMURA , Mikio AOKI , Jin MIKATA , Taiji ITO
IPC分类号： H01L23/552 , H01L23/66 , H01L21/56 , H01L21/78
摘要： Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.
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公开(公告)号：US20180159217A1
公开(公告)日：2018-06-07
申请号：US15828191
申请日：2017-11-30
发明人： Jin MIKATA , Masaya SHIMAMURA , Mikio AOKI , Takehiko KAI , Taiji ITO
摘要： A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.
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公开(公告)号：US20180159216A1
公开(公告)日：2018-06-07
申请号：US15828160
申请日：2017-11-30
发明人： Takehiko KAI , Masaya SHIMAMURA , Mikio AOKI , Jin MIKATA , Taiji ITO
CPC分类号： H01Q1/526 , H01L23/3121 , H01L23/552 , H01L23/66 , H01L2223/6677 , H01Q1/2283 , H01Q1/38 , H01Q9/0407 , H01Q9/42 , H01Q23/00
摘要： Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.
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公开(公告)号：US20180159209A1
公开(公告)日：2018-06-07
申请号：US15828178
申请日：2017-11-30
发明人： Jin MIKATA , Masaya SHIMAMURA , Mikio AOKI , Takehiko KAI , Taiji ITO
摘要： A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.
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公开(公告)号：US20170176587A1
公开(公告)日：2017-06-22
申请号：US15380986
申请日：2016-12-15
发明人： Yutaka AOKI , Ryuichi SUNAGAWA , Jin MIKATA , Ryuji MURATA
CPC分类号： G01S13/88 , G01S13/34 , G01S13/885 , H01Q15/14 , H01Q19/17 , H01Q19/185
摘要： A snow quality measuring apparatus according to one aspect of the present invention includes a plurality of reflectors, at least one transmitter, at least one receiver, and a measuring device. The plurality of reflectors are respectively arranged at a plurality of prescribed heights above the ground. The transmitter emits radio waves towards the plurality of reflectors, and the receiver receives the reflected waves of the radio waves from the plurality of reflectors. The measuring device measures snow quality of snow on the ground at the prescribed plurality of heights based on the respective reflected waves to from the plurality of reflectors as received by the receiver.
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公开(公告)号：US20190237409A1
公开(公告)日：2019-08-01
申请号：US16380990
申请日：2019-04-10
发明人： Kenzo KITAZAKI , Takehiko KAI , Masaya SHIMAMURA , Mikio AOKI , Jin MIKATA , Taiji ITO
IPC分类号： H01L23/552 , H01L25/10 , H01L23/28 , H01L23/02 , H01L23/31
CPC分类号： H01L23/552 , H01L21/561 , H01L23/02 , H01L23/28 , H01L23/3121 , H01L25/105 , H01L2224/16225 , H01L2224/97 , H01L2924/1815
摘要： A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.
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公开(公告)号：US20190193528A1
公开(公告)日：2019-06-27
申请号：US16226338
申请日：2018-12-19
发明人： Masashi HATTORI , Yosuke ONDA , Kenichi SHIMOMAI , Jin MIKATA , Taiji ITO
CPC分类号： B60H3/0085 , B60H1/00742 , B60H3/06
摘要： An air conditioning system includes: an air conditioner to regulate a state of air in a room; a sensor device including at least one detector to detect an amount of an odor-causing substance included in the air in the room; and a control device to control operation of the air conditioner. The control device includes: a first acquisition unit to acquire a detected value of each of the at least one detector at a first timing when a person is present in the room; a second acquisition unit to acquire a detected value of each of the at least one detector at a second timing later than the first timing; a difference calculator to calculate a difference between the detected value at the first timing and the detected value at the second timing; and an instruction unit to control operation of the air conditioner based on the difference.
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公开(公告)号：US20180286816A1
公开(公告)日：2018-10-04
申请号：US15934829
申请日：2018-03-23
发明人： Kenzo KITAZAKI , Takehiko KAI , Masaya SHIMAMURA , Mikio AOKI , Jin MIKATA , Taiji ITO
IPC分类号： H01L23/552 , H01L23/28 , H01L23/02
摘要： To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.
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公开(公告)号：US20130271339A1
公开(公告)日：2013-10-17
申请号：US13849241
申请日：2013-03-22
发明人： Jin MIKATA
IPC分类号： H01Q1/50
摘要： A passive element has an electrical length such that a resonance mode thereof is in a target frequency band, and first and second feed elements, each of which has an electrical length such that a resonance mode thereof is not in the target frequency band. The first feed element has a first coupling conductive part, and a first connecting conductive part, which has a continuous shape with the first coupling conductive part. The second feed element has a second coupling conductive part, and a second connecting conductive part, which has a continuous shape with the second coupling conductive part. The first coupling conductive part is disposed parallel and adjacent to the passive element. The second coupling conductive part is disposed parallel and adjacent to the passive element. The first connecting conductive part and the second connecting conductive part are disposed adjacent and parallel to each other.
摘要翻译： 无源元件具有使得其谐振模式为目标频带的电气长度，以及第一和第二馈电元件，每个馈电元件具有使其谐振模式不在目标频带中的电气长度。 第一馈电元件具有第一耦合导电部分和与第一耦合导电部分具有连续形状的第一连接导电部分。 第二馈电元件具有第二耦合导电部分和与第二耦合导电部分具有连续形状的第二连接导电部分。 第一耦合导电部分平行并邻近无源元件设置。 第二耦合导电部分平行且邻近无源元件设置。 第一连接导电部分和第二连接导电部分彼此相邻并平行设置。
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