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公开(公告)号：US10250219B2
公开(公告)日：2019-04-02
申请号：US15430849
申请日：2017-02-13
摘要： An acoustic wave device includes: a first substrate that includes a first acoustic wave filter located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second acoustic wave filter on a lower surface of the second substrate, the lower surface of the second substrate facing the upper surface of the first substrate across an air gap; and a shield electrode that is supported by the upper surface of the first substrate, and is located between at least a part of the first acoustic wave filter and at least a part of the second acoustic wave filter through the air gap.
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公开(公告)号：US11050408B2
公开(公告)日：2021-06-29
申请号：US16510568
申请日：2019-07-12
摘要： An acoustic wave device includes: a first substrate that has a first surface and a second surface, the second surface being an opposite surface of the first substrate from the first surface; an acoustic wave element that is located on the first surface; a wiring portion that electrically connects the acoustic wave element and a metal portion through a through hole, the metal portion being located on the second surface, the through hole penetrating through the first substrate; and a sealing portion that is located on the first surface so as to surround the acoustic wave element, overlaps with at least a part of the through hole in plan view, and seals the acoustic wave element in an air gap.
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公开(公告)号：US10056878B2
公开(公告)日：2018-08-21
申请号：US14945129
申请日：2015-11-18
CPC分类号： H03H9/02992 , H03H3/08 , H03H9/02921 , H03H9/02952 , H03H9/6483 , H03H9/725
摘要： An acoustic wave device includes: a substrate; a first acoustic wave resonator and a second acoustic wave resonator located on the substrate; a first wiring line electrically coupled to the first acoustic wave resonator, located on the substrate, and located between the first acoustic wave resonator and the second acoustic wave resonator; and a second wiring line electrically coupled to the second acoustic wave resonator, located on the substrate, located between the first acoustic wave resonator and the second acoustic wave resonator, having an electric potential different from an electric potential of the first wiring line, and having a thickness greater than a thickness of the first wiring line.
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公开(公告)号：US10250223B2
公开(公告)日：2019-04-02
申请号：US15451684
申请日：2017-03-07
发明人： Tomoyuki Kurihara , Kazushige Hatakeyama , Takuma Kuroyanagi , Yohei Shimizu , Masahiro Sato , Naoki Kakita , Kazutaka Suzuki
摘要： An acoustic wave device includes: a first substrate including a support substrate and a piezoelectric substrate bonded on an upper surface of the support substrate, and including a first acoustic wave element located on an upper surface of the piezoelectric substrate; a ring-shaped metal layer located in a region that surrounds the first acoustic wave element and in which the piezoelectric substrate is removed, a second substrate flip-chip mounted on an upper surface of the first substrate and including a functional element located on a lower surface of the second substrate; and a metallic member located on an upper surface of the ring-shaped metal layer, surrounding the second substrate in plan view, not located between the first substrate and the second substrate, and sealing the first acoustic wave element and the functional element so that the first acoustic wave element and the functional element are located across an air gap.
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公开(公告)号：US10250222B2
公开(公告)日：2019-04-02
申请号：US15430818
申请日：2017-02-13
摘要： An electronic device includes: a first substrate including a first functional element located on an upper surface of the first substrate; a second substrate that is flip-chip mounted on the upper surface of the first substrate through a bump, and includes a second functional element located on a lower surface of the second substrate; and a sealing member that is located on the upper surface of the first substrate, surrounds the second substrate in plan view, is not located between the first substrate and the second substrate, seals the first functional element and the second functional element so that the first functional element and the second functional element are located across an air gap.
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公开(公告)号：US10218334B2
公开(公告)日：2019-02-26
申请号：US14971567
申请日：2015-12-16
摘要： An acoustic wave device includes: a substrate; an acoustic wave resonator that is formed on the substrate; a first wiring line that is formed on the substrate and is electrically coupled to the acoustic wave resonator; and a second wiring line that is electrically coupled to the first wiring line, at least a part of the second wiring line being formed immediately above the acoustic wave resonator across an air gap.
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公开(公告)号：US09663861B2
公开(公告)日：2017-05-30
申请号：US15008051
申请日：2016-01-27
CPC分类号： C23C18/1633 , C23C18/1653 , C23C18/42 , C25D7/123 , H03H3/08 , H03H9/25 , H03H9/64
摘要： An acoustic wave device includes: a substrate; an acoustic wave element that is formed on the substrate; a first wiring that is formed on the substrate and electrically connected to the acoustic wave element; a second wiring that is formed above the substrate via an air gap, and includes an edge fixed to the first wiring; a fixer that is formed on an edge of the first wiring, projects upwardly, and is fixed to the second wiring; and a projection that contacts the fixer, projects upwardly, and is formed on the edge of the first wiring and on an outside of the second wiring in a direction intersecting an extension direction of the second wiring.
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