公开(公告)号：US20170013748A1

公开(公告)日：2017-01-12

申请号：US15115868

申请日：2015-02-04

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tetsuo SAJI ,  Yohei ICHIKAWA ,  Hiroshi NAKAMURA

IPC: H05K9/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H01L23/00 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/185 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00

Abstract: One object is to prevent electromagnetic wave interference between electronic components with restricted increase of the size of a circuit module. A circuit module according to an embodiment includes a circuit board, a plurality of electronic components provided on the circuit board, a resin mold provided on the circuit board so as to seal the plurality of electronic components in an insulating manner, a conductive shield covering the top surface and the side surfaces of the resin mold, and a plurality of conductive poles having a columnar shape provided in the resin mold and connecting the top surface of the conductive shield and the ground of the circuit board. The resonance caused by frequencies equal to or less than a predetermined maximum usable frequency is restricted.

Abstract translation: 一个目的是通过限制电路模块尺寸的增加来防止电子元件之间的电磁波干扰。 根据实施例的电路模块包括电路板，设置在电路板上的多个电子部件，设置在电路板上以便以绝缘方式密封多个电子部件的树脂模具，覆盖 树脂模具的顶表面和侧表面以及设置在树脂模具中的具有柱状的多个导电极，并且将导电屏蔽的顶表面与电路板的接地连接。 由等于或小于预定最大可用频率的频率引起的共振受到限制。

公开(公告)号：US20150119102A1

公开(公告)日：2015-04-30

申请号：US14481779

申请日：2014-09-09

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Tetsuo SAJI ,  Yohei ICHIKAWA ,  Hiroshi NAKAMURA

IPC: H04M1/02

CPC classification number: H04M1/026 ,  H01L24/20 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/73267 ,  H01L2924/0002 ,  H01L2924/19105 ,  H04B1/38 ,  H04B1/3888 ,  H04B15/02 ,  H04B15/04 ,  H05K1/0218 ,  H05K1/0243 ,  H05K3/284 ,  H05K9/0022 ,  H05K9/0045 ,  H05K2201/0715 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.

Abstract translation: 通信模块包括具有与移动电话通信相关的第一高频处理部分的电路基板，处理与卫星定位系统相关的接收信号的第二高频处理部分，具有基带处理部分和应用处理部分的系统部分 以及电源电路部，覆盖安装在电路基板上的电子部件的密封部件，形成在密封部件的表面上的导电性屏蔽层和形成在密封部件中的屏蔽壁， 第一高频处理部和第二高频处理部的安装区域。