公开(公告)号：US20170215279A1

公开(公告)日：2017-07-27

申请号：US15448485

申请日：2017-03-02

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hitoshi Kubo ,  Yusuke Ohshima ,  Noriaki Nakamura ,  Hiroshi Noguchi ,  Junichi Taniuchi ,  Yuichi Makita

IPC: H05K1/09 ,  C09D11/52 ,  B22F1/00 ,  B22F9/30 ,  H01B1/22 ,  H05K3/12

CPC classification number: H05K1/097 ,  B22F1/0044 ,  B22F1/0062 ,  B22F9/30 ,  B22F2001/0066 ,  B22F2998/10 ,  C09D11/52 ,  H01B1/22 ,  H05K3/1291 ,  Y10T428/268 ,  B22F3/10

Abstract: Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100° C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 μΩ cm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.

公开(公告)号：US20150245480A1

公开(公告)日：2015-08-27

申请号：US14614196

申请日：2013-07-11

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hitoshi Kubo ,  Yusuke Ohshima ,  Noriaki Nakamura ,  Hiroshi Noguchi ,  Junichi Taniuchi ,  Yuichi Makita

IPC: H05K1/09 ,  H01B1/22 ,  B22F1/00 ,  C09D11/52

CPC classification number: H05K1/097 ,  B22F1/0044 ,  B22F1/0062 ,  B22F9/30 ,  B22F2001/0066 ,  B22F2998/10 ,  C09D11/52 ,  H01B1/22 ,  H05K3/1291 ,  Y10T428/268 ,  B22F3/10

Abstract: Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100° C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 μΩcm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.

Abstract translation: 提供一种由己胺，十二烷胺，油酸，细银粒子和溶剂构成的细银粒子墨，其中通过旋涂将油墨施加到基底上后获得的在100℃下的烧结体的体积电阻率是 8〜25μΩ·cm，其烧结体及其制造方法。 当通过银 - 胺络合物分解方法产生含有包覆的细银颗粒的细银颗粒油墨时，可以顺利进行生产。 即使在低温下也可以烧结细银粒子墨，并且其烧结体具有镜面和低体积电阻。

公开(公告)号：US09674953B2

公开(公告)日：2017-06-06

申请号：US14614196

申请日：2013-07-11

Applicant: TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hitoshi Kubo ,  Yusuke Ohshima ,  Noriaki Nakamura ,  Hiroshi Noguchi ,  Junichi Taniuchi ,  Yuichi Makita

IPC: H05K1/09 ,  H01B1/22 ,  B22F1/00 ,  C09D11/52 ,  B22F9/30

CPC classification number: H05K1/097 ,  B22F1/0044 ,  B22F1/0062 ,  B22F9/30 ,  B22F2001/0066 ,  B22F2998/10 ,  C09D11/52 ,  H01B1/22 ,  H05K3/1291 ,  Y10T428/268 ,  B22F3/10

Abstract: Provided are a fine silver particle ink composed of hexylamine, dodecylamine, oleic acid, fine silver particles and a solvent, in which the volume resistivity of a sintered body at 100° C. obtained after the ink is applied on a substrate by spin coating is 8 to 25 μΩcm, a sintered body thereof, and a method for producing a fine silver particle ink. When a fine silver particle ink containing coated fine silver particles is produced by a silver-amine complex decomposition method, production can be carried out smoothly. The fine silver particle ink can be sintered even at a low temperature, and a sintered body thereof has a mirror surface and low volume resistance.

公开(公告)号：US09607922B2

公开(公告)日：2017-03-28

申请号：US14778684

申请日：2014-03-03

Applicant: Tanaka Kikinzoku Kogyo K.K.

Inventor： Kenji Matsuda ,  Dai Shinozaki ,  Yuichi Makita ,  Hitoshi Kubo ,  Yusuke Ohshima ,  Hidekazu Matsuda ,  Junichi Taniuchi

IPC: H01L23/34 ,  H01L23/367 ,  H01L23/00 ,  H01L23/373 ,  H01L23/36 ,  H05K7/20

CPC classification number: H01L23/367 ,  H01L23/34 ,  H01L23/36 ,  H01L23/373 ,  H01L23/3736 ,  H01L24/01 ,  H01L2924/0002 ,  H05K7/20409 ,  H01L2924/00

Abstract: A semiconductor device includes a semiconductor chip which can be a heat-generating semiconductor chip or a semiconductor relay substrate in which an integrated circuit or wiring is built in. A sintered-silver-coated film is adhered on a surface layer part of the semiconductor substrate, interposed by a silicon oxide film. A heat-dissipating fin (heat sink), which may be copper or aluminum, is bonded on the sintered-silver-coated film, interposed by an adhesive layer.