Acoustic device with a piezoelectric element

    公开(公告)号:US11581825B2

    公开(公告)日:2023-02-14

    申请号:US16871410

    申请日:2020-05-11

    申请人: TDK Corporation

    IPC分类号: H02N2/00 B06B1/06

    摘要: An acoustic device includes a piezoelectric element, an attachment member to which the piezoelectric element is attached, and a spacer. The piezoelectric element includes first and second principal surfaces opposing each other. The attachment opposes the first principal surface. The spacer is disposed between the piezoelectric element and the attachment member in such a manner as to form an acoustic space between the piezoelectric element and the attachment member. The spacer includes an adhesive layer including a principal surface in contact with the first principal surface and a principal surface in contact with the attachment member.

    Semiconductor ceramic composition and PTC thermistor
    4.
    发明授权
    Semiconductor ceramic composition and PTC thermistor 有权
    半导体陶瓷组合物和PTC热敏电阻

    公开(公告)号:US09362031B2

    公开(公告)日:2016-06-07

    申请号:US14502123

    申请日:2014-09-30

    申请人: TDK CORPORATION

    IPC分类号: H01C7/02 H01C7/00 H01C1/14

    摘要: A semiconductor ceramic composition which includes a compound represented by the following formula (1) as a main component, (Ba1-x-y-wBixAyREw)m(Ti1-zTMz)O3 (1) (wherein, A is at least one element selected from Na or K, RE is at least one element selected from the group consisting of Y, La, Ce, Pr, Nd, Sm, Gd, Dy and Er, TM is at least one element selected from the group consisting of V, Nb and Ta, w, x, y, z and m satisfy the following relationships of (2)˜(5), 0.007≦x≦0.125 (2), x

    摘要翻译: 包含下述式(1)表示的化合物作为主要成分的(Ba1-xy-wBixAyREw)m(Ti1-zTMz)O3(1)的半导体陶瓷组合物(其中,A为选自Na 或K,RE为选自Y,La,Ce,Pr,Nd,Sm,Gd,Dy和Er中的至少一种元素,TM为选自V,Nb和Ta中的至少一种元素 (2)〜(5),0.007≦̸ x≦̸ 0.125(2),x

    Acceleration sensor
    8.
    发明授权

    公开(公告)号:US10018649B2

    公开(公告)日:2018-07-10

    申请号:US15257511

    申请日:2016-09-06

    申请人: TDK CORPORATION

    IPC分类号: G01P15/09

    CPC分类号: G01P15/09

    摘要: An acceleration sensor capable of improving sensitivity is provided. In the acceleration sensor, although a solder fillet is formed in a lower end of a terminal electrode exposed from a covering portion, the covering portion suppresses the rise of the solder fillet. Due to this, the operation of the acceleration sensor is not easily limited by the solder fillet, and the acceleration sensor can generate electric charge which corresponds to a load more accurately. Therefore, the sensitivity of the acceleration sensor can be improved.