公开(公告)号：US20240370070A1

公开(公告)日：2024-11-07

申请号：US18683342

申请日：2022-08-15

Applicant: Tesla, Inc.

Inventor： Jin Zhao ,  Shishuang Sun ,  Yang Sun ,  Vijaykumar Krithivasan ,  William Chang ,  Jianjun Li

IPC: G06F1/26

Abstract: Aspects of this disclosure relate to power delivery to chips in an array. An array of power conversion paths can be positioned vertically relative to the chips of the array. A power conversion path can convert a high voltage, low current signal to a low voltage, high current. The power conversion path can include a first power conversion stage and a second power conversion stage. The power conversion path can be implemented in a power supply module, for example.

公开(公告)号：US20240145432A1

公开(公告)日：2024-05-02

申请号：US18549307

申请日：2022-03-01

Applicant: TESLA, INC.

Inventor： Mengzhi Pang ,  Yang Sun ,  Yong guo Li ,  Jianjun Li ,  Rodrigo Rodriguez Navarrete ,  Vijaykumar Krithivasan ,  Rishabh Bhandari

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01L23/60

CPC classification number: H01L25/0652 ,  H01L23/3672 ,  H01L23/552 ,  H01L23/60 ,  H01L24/48 ,  H01L24/16 ,  H01L2224/16221 ,  H01L2224/48245

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.