公开(公告)号：US20240356255A1

公开(公告)日：2024-10-24

申请号：US18683758

申请日：2022-08-12

Applicant: Tesla, Inc.

Inventor： Rishabh Bhandari ,  Yong guo Li ,  Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Shiva Farzinazar ,  Mitchell Heschke

IPC: H01R12/71 ,  H01R13/24 ,  H01R13/46 ,  H05K7/20

CPC classification number: H01R12/716 ,  H01R13/2421 ,  H01R13/46 ,  H05K7/20927

Abstract: An array of compliant connectors for electronic assemblies is provided. In one aspect, a system includes an array of first electronic components and an array of second electronic components. Each of the second electronic components is paired with corresponding to one of the first electronic components. Each pair of the first and second electronic components is coupled via a plurality of compliant connectors.

公开(公告)号：US20240312863A1

公开(公告)日：2024-09-19

申请号：US18576230

申请日：2022-06-28

Applicant: Tesla, Inc.

Inventor： Yong guo Li ,  Rishabh Bhandari ,  Aydin Nabovati ,  Vijaykumar Krithivasan ,  William Chang

IPC: H01L23/367 ,  H01L21/48 ,  H01L23/40

CPC classification number: H01L23/3675 ,  H01L21/4882 ,  H01L23/40

Abstract: Wafer assemblies and related methods of manufacture are disclosed. Such assemblies and methods can account for different heights of electronic modules positioned on a wafer. In an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. A first thermal interface material (TIM) can be disposed between the first electronic module and a first portion of the cooling system. A second TIM can be disposed between the second electronic module and a second portion of the cooling system. The height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. Other wafer assemblies and methods of manufacture are disclosed.

公开(公告)号：US20240363485A1

公开(公告)日：2024-10-31

申请号：US18683335

申请日：2022-08-09

Applicant: Tesla, Inc.

Inventor： Yong guo Li

IPC: H01L23/40

CPC classification number: H01L23/4006 ,  H01L2023/4087

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a cooling component, and a frame structure that is coupled to the cooling component by way of at least one fastener. The SoW assembly can include an interposer assembly that is disposed on a SoW. At least a portion of the interposer assembly can be disposed between the cooling component and the frame structure. The SoW assembly can include a gasket disposed between the portion of the interposer assembly and the frame structure.

公开(公告)号：US20240357729A1

公开(公告)日：2024-10-24

申请号：US18683754

申请日：2022-08-16

Applicant: Tesla, Inc.

Inventor： Mohamed Haitham Helmy Nasr ,  Samuel Lichy ,  Aydin Nabovati ,  Rishabh Bhandari ,  Yong guo Li ,  Zheng Gao

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H05K1/181 ,  H05K2201/064 ,  H05K2201/066

Abstract: Electronic assemblies with a cold plate having an opening are provided. In one aspect. a system includes an array of electronic components. a control board. and a cold plate having a plurality of openings therethrough. The cold plate can be arranged between the array of electronic components and the control board. The cold plate can cool the array of electronic components. The system can also include a plurality of pass through connectors arranged in the openings in the cold plate and configured to connect the array of electronic components to the control board. The cold plate can also be used to cool the control board electronics and the connectors passing through.

公开(公告)号：US20240234333A9

公开(公告)日：2024-07-11

申请号：US18548433

申请日：2022-02-23

Applicant: Tesla, Inc.

Inventor： Yong guo Li ,  Rishabh Bhandari ,  Aydin Nabovati ,  Ron Rosenberg ,  Vijaykumar Krithivasan ,  Mitchell Heschke

IPC: H01L23/544 ,  H01L23/367

CPC classification number: H01L23/544 ,  H01L23/367 ,  H01L2223/54426

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

公开(公告)号：US20240356285A1

公开(公告)日：2024-10-24

申请号：US18683432

申请日：2022-08-16

Applicant: Tesla, Inc.

Inventor： Yong guo Li ,  Peter Groen ,  Rishabh Bhandari ,  Aydin Nabovati ,  Xuyang Zhang

IPC: H01R13/631 ,  H01R12/71 ,  H01R13/518

CPC classification number: H01R13/6315 ,  H01R12/716 ,  H01R13/518

Abstract: A connector system is disclosed. The connector system can include a support structure, a holder coupled to the support structure, an alignment adjustment structure positioned between the support structure and the holder, and an actuator. The holder can receive a first connector of a connection line. The alignment adjustment structure is compressible along a first axis and movable along a second axis different from the first axis. The actuator is configured to provide movement of the holder so as to connect the first connector to a second connector of a processor system, such as a system on wafer (SoW) assembly.

公开(公告)号：US20240145432A1

公开(公告)日：2024-05-02

申请号：US18549307

申请日：2022-03-01

Applicant: TESLA, INC.

Inventor： Mengzhi Pang ,  Yang Sun ,  Yong guo Li ,  Jianjun Li ,  Rodrigo Rodriguez Navarrete ,  Vijaykumar Krithivasan ,  Rishabh Bhandari

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/367 ,  H01L23/552 ,  H01L23/60

CPC classification number: H01L25/0652 ,  H01L23/3672 ,  H01L23/552 ,  H01L23/60 ,  H01L24/48 ,  H01L24/16 ,  H01L2224/16221 ,  H01L2224/48245

Abstract: The present disclosure relates to processing systems and more specifically to integrated circuit (IC) packages designed to reduce the effects of electrostatic discharge and/or electromagnetic interference during integrated circuit manufacture and/or use. The IC assembly may include a wafer positioned between a cooling system and thermal dissipation structure. The cooling system and thermal dissipation structure include electrically conductive material at a ground potential such that the thermal systems act as electrical ground. The wafer may be electrically connected to the cooling system and thermal dissipation structure to reduce static charge accumulation during the assembly process. The cooling system and thermal dissipation structure may further provide radio frequency (RF) shielding to reduce electromagnetic interference during use of the IC assembly.

公开(公告)号：US20240136303A1

公开(公告)日：2024-04-25

申请号：US18548433

申请日：2022-02-23

Applicant: Tesla, Inc.

Inventor： Yong guo Li ,  Rishabh Bhandari ,  Aydin Nabovati ,  Ron Rosenberg ,  Vijaykumar Krithivasan ,  Mitchell Heschke

IPC: H01L23/544 ,  H01L23/367

CPC classification number: H01L23/544 ,  H01L23/367 ,  H01L2223/54426

Abstract: A system on a wafer (SoW) assembly is disclosed. The SoW assembly can include a first SoW assembly structure with a first coefficient of thermal expansion (CTE). The first SoW assembly structure includes first to third slots at different locations. The SoW assembly can include a second SoW assembly structure stacked on the first SoW assembly structure. The second SoW assembly structure has a second CTE different from the first CTE. The second SoW assembly structure has first to third pins extending therefrom and disposed in the first to third slots. The first and second slots shaped to allow the first and second pins to move along a first axis, and the third slot shaped to allow the third pin to move along a second axis. The first SoW assembly structure can be a SoW and the second SoW assembly structure can be a heat dissipation structure in certain applications.

公开(公告)号：US20240061482A1

公开(公告)日：2024-02-22

申请号：US18260216

申请日：2022-01-20

Applicant: Tesla, Inc.

Inventor： Vijaykumar Krithivasan ,  Samuel Lichy ,  Yong guo Li

IPC: G06F1/26 ,  H01L23/498 ,  H01L23/367 ,  H01L25/18 ,  H01L23/00

CPC classification number: G06F1/26 ,  H01L23/49816 ,  H01L23/367 ,  H01L25/18 ,  H01L23/562

Abstract: A voltage regulating module design is provided. In one aspect, a voltage regulating module (VRM) includes a first layer configured to output a regulated voltage that is based on a stepped down voltage, and a second layer stacked with the first layer, and a plurality of contacts, such as a ball grid array (BGA), on the first layer. The second layer includes a plurality of active components configured to provide the stepped down voltage to the first layer. The first and second layers have overlapping recesses, and the recess of the first layer has a larger footprint than the recess of the second layer. A plurality of the VRMS can be arranged to form an opening including a counterbore. A faster, such as a bolt, can be positioned in the opening. The first layer can have a larger clearance from the fastener positioned in the opening than the second layer.