公开(公告)号：US11914411B2

公开(公告)日：2024-02-27

申请号：US17314637

申请日：2021-05-07

Applicant: Texas Instruments Incorporated

Inventor： Sandeep Shylaja Krishnan ,  Tallam Vishwanath ,  Akshay Yashwant Jadhav

IPC: G05F3/30 ,  G05F3/26 ,  H03F3/45 ,  G05F3/22

CPC classification number: G05F3/265 ,  G05F3/222 ,  G05F3/225 ,  G05F3/30 ,  H03F3/45179

Abstract: A bandgap reference circuit includes first through fourth bipolar junction transistors (BJTs). The base and collector of the first BJT are shorted together. The second BJT is coupled to the first BJT via a first resistor. The base of the third BJT is coupled to the base of the first BJT. The base and collector of the fourth BJT are coupled together and also are coupled to the base of the second BJT. A second resistor is coupled to the fourth emitter of the fourth BJT. A third resistor is coupled to the second resistor and to the emitter of the second BJT. An operational amplifier has a first input coupled to the first resistor and the collector of the second BJT, a second input coupled to the emitter of the third BJT and the collector of the fourth BJT, and an output coupled to the collectors of the first and third BJTs.

公开(公告)号：US12189411B2

公开(公告)日：2025-01-07

申请号：US18423948

申请日：2024-01-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sandeep Shylaja Krishnan ,  Tallam Vishwanath ,  Akshay Yashwant Jadhav

IPC: G05F3/30 ,  G05F3/22 ,  G05F3/26 ,  H03F3/45

Abstract: A bandgap reference circuit includes first through fourth bipolar junction transistors (BJTs). The base and collector of the first BJT are shorted together. The second BJT is coupled to the first BJT via a first resistor. The base of the third BJT is coupled to the base of the first BJT. The base and collector of the fourth BJT are coupled together and also are coupled to the base of the second BJT. A second resistor is coupled to the fourth emitter of the fourth BJT. A third resistor is coupled to the second resistor and to the emitter of the second BJT. An operational amplifier has a first input coupled to the first resistor and the collector of the second BJT, a second input coupled to the emitter of the third BJT and the collector of the fourth BJT, and an output coupled to the collectors of the first and third BJTs.

公开(公告)号：US11876490B2

公开(公告)日：2024-01-16

申请号：US17587105

申请日：2022-01-28

Applicant: Texas Instruments Incorporated

Inventor： Sandeep Shylaja Krishnan ,  Akshay Yashwant Jadhav ,  Tallam Vishwanath

IPC: H03F1/30 ,  G05F3/26

CPC classification number: H03F1/303 ,  G05F3/267 ,  H03F2200/375 ,  H03F2200/447 ,  H03F2200/468

Abstract: Described embodiments include an integrated circuit for temperature gradient compensation of a bandgap voltage. A bandgap core circuit has a bandgap feedback input, a bandgap adjustment input and a bandgap reference output. A resistor is coupled between the bandgap adjustment input and a ground terminal. An offset and slope correction circuit has an offset correction output that is coupled to the bandgap adjustment input. A signal at the offset correction output is trimmed at an ambient temperature. A thermal error cancellation (TEC) circuit has a TEC output coupled to the bandgap adjustment input. The TEC circuit includes first and second temperature sensors that are located apart from each other. A signal at the TEC output is responsive to temperatures at the first and second temperature sensors. An amplifier has an amplifier input and an amplifier output. The amplifier input is coupled to the bandgap reference output.

公开(公告)号：US20240168510A1

公开(公告)日：2024-05-23

申请号：US18423948

申请日：2024-01-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Sandeep Shylaja Krishnan ,  Tallam Vishwanath ,  Akshay Yashwant Jadhav

IPC: G05F3/26 ,  G05F3/22 ,  G05F3/30 ,  H03F3/45

CPC classification number: G05F3/265 ,  G05F3/222 ,  G05F3/225 ,  G05F3/30 ,  H03F3/45179

Abstract: A bandgap reference circuit includes first through fourth bipolar junction transistors (BJTs). The base and collector of the first BJT are shorted together. The second BJT is coupled to the first BJT via a first resistor. The base of the third BJT is coupled to the base of the first BJT. The base and collector of the fourth BJT are coupled together and also are coupled to the base of the second BJT. A second resistor is coupled to the fourth emitter of the fourth BJT. A third resistor is coupled to the second resistor and to the emitter of the second BJT. An operational amplifier has a first input coupled to the first resistor and the collector of the second BJT, a second input coupled to the emitter of the third BJT and the collector of the fourth BJT, and an output coupled to the collectors of the first and third BJTs.

公开(公告)号：US20240097621A1

公开(公告)日：2024-03-21

申请号：US18522321

申请日：2023-11-29

Applicant: Texas Instruments Incorporated

Inventor： Sandeep Shylaja Krishnan ,  Akshay Yashwant Jadhav ,  Tallam Vishwanath

IPC: H03F1/30 ,  G05F3/26

CPC classification number: H03F1/303 ,  G05F3/267 ,  H03F2200/375 ,  H03F2200/447 ,  H03F2200/468

Abstract: Described embodiments include an integrated circuit for temperature gradient compensation of a bandgap voltage. A bandgap core circuit has a bandgap feedback input, a bandgap adjustment input and a bandgap reference output. A resistor is coupled between the bandgap adjustment input and a ground terminal. An offset and slope correction circuit has an offset correction output that is coupled to the bandgap adjustment input. A signal at the offset correction output is trimmed at an ambient temperature. A thermal error cancellation (TEC) circuit has a TEC output coupled to the bandgap adjustment input. The TEC circuit includes first and second temperature sensors that are located apart from each other. A signal at the TEC output is responsive to temperatures at the first and second temperature sensors. An amplifier has an amplifier input and an amplifier output. The amplifier input is coupled to the bandgap reference output.

公开(公告)号：US20220329211A1

公开(公告)日：2022-10-13

申请号：US17587105

申请日：2022-01-28

Applicant: Texas Instruments Incorporated

Inventor： Sandeep Shylaja Krishnan ,  Akshay Yashwant Jadhav ,  Tallam Vishwanath

IPC: H03F1/30 ,  G05F3/26

Abstract: Described embodiments include an integrated circuit for temperature gradient compensation of a bandgap voltage. A bandgap core circuit has a bandgap feedback input, a bandgap adjustment input and a bandgap reference output. A resistor is coupled between the bandgap adjustment input and a ground terminal. An offset and slope correction circuit has an offset correction output that is coupled to the bandgap adjustment input. A signal at the offset correction output is trimmed at an ambient temperature. A thermal error cancellation (TEC) circuit has a TEC output coupled to the bandgap adjustment input. The TEC circuit includes first and second temperature sensors that are located apart from each other. A signal at the TEC output is responsive to temperatures at the first and second temperature sensors. An amplifier has an amplifier input and an amplifier output. The amplifier input is coupled to the bandgap reference output.