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公开(公告)号:US20220028767A1
公开(公告)日:2022-01-27
申请号:US16940243
申请日:2020-07-27
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum , Michael Gerald Amaro , Makarand Ramkrishna Kulkarni
IPC: H01L23/495 , H01L23/498
Abstract: A lead for a surface mount package for a semiconductor device, and the surface mount package employing the same. In one example, the lead includes a central segment with a first side and a second side, a first extension from a portion of the first side, and a second extension from a portion of the second side. The lead also includes a recess extending through a portion of the central segment, the first extension and the second extension.
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公开(公告)号:US20220037280A1
公开(公告)日:2022-02-03
申请号:US16941818
申请日:2020-07-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Yiqi Tang , Naweed Anjum , Liang Wan , Michael Gerald Amaro
IPC: H01L23/00 , H01L23/58 , H01L23/498 , H01L21/56
Abstract: A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first layer, a passive component including at least one capacitor or resistor electrically coupled to the metal trace, and a second set of metal pillars extending from the metal trace to an opposing side of the second layer, and a third layer stacked on the second layer, the third layer including at least one inductor electrically coupled to metal pillars of the second set of metal pillars.
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公开(公告)号:US20200227328A1
公开(公告)日:2020-07-16
申请号:US16725738
申请日:2019-12-23
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum
IPC: H01L21/66 , G06F30/367 , G01R31/28
Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.
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公开(公告)号:US11587899B2
公开(公告)日:2023-02-21
申请号:US16941818
申请日:2020-07-29
Applicant: TEXAS INSTRUMENTS INCORPORATED
Inventor: Yiqi Tang , Naweed Anjum , Liang Wan , Michael Gerald Amaro
Abstract: A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first layer, a passive component including at least one capacitor or resistor electrically coupled to the metal trace, and a second set of metal pillars extending from the metal trace to an opposing side of the second layer, and a third layer stacked on the second layer, the third layer including at least one inductor electrically coupled to metal pillars of the second set of metal pillars.
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公开(公告)号:US11495549B2
公开(公告)日:2022-11-08
申请号:US17185589
申请日:2021-02-25
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum , Michael Gerald Amaro , Charles Allen Devries, Jr.
IPC: H05K1/18 , H01L23/00 , H01L23/495
Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.
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公开(公告)号:US12131967B2
公开(公告)日:2024-10-29
申请号:US16725738
申请日:2019-12-23
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum
IPC: G06F30/30 , G01R31/28 , G06F30/367 , H01L21/66 , G06F113/18 , G06F119/02 , G06F119/18
CPC classification number: H01L22/34 , G01R31/2853 , G01R31/2856 , G01R31/2896 , G06F30/367 , H01L22/32 , G06F2113/18 , G06F2119/02 , G06F2119/18
Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.
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公开(公告)号:US11798900B2
公开(公告)日:2023-10-24
申请号:US17806694
申请日:2022-06-13
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum , Michael Gerald Amaro , Charles Allen Devries, Jr.
IPC: H05K1/02 , H01L23/00 , H01L23/495 , H05K1/18
CPC classification number: H01L23/562 , H01L23/49503 , H01L23/49534 , H01L23/49541 , H05K1/181 , H05K2201/1003 , H05K2201/10015
Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.
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公开(公告)号:US20220270984A1
公开(公告)日:2022-08-25
申请号:US17185589
申请日:2021-02-25
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum , Michael Gerald Amaro , Charles Allen Devries, JR.
IPC: H01L23/00 , H01L23/495 , H05K1/18
Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.
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公开(公告)号:US20250022761A1
公开(公告)日:2025-01-16
申请号:US18901210
申请日:2024-09-30
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum
IPC: H01L21/66 , G01R31/28 , G06F30/367 , G06F113/18 , G06F119/02 , G06F119/18
Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.
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公开(公告)号:US20240071889A1
公开(公告)日:2024-02-29
申请号:US17897974
申请日:2022-08-29
Applicant: Texas Instruments Incorporated
Inventor: Naweed Anjum , Michael Gerald Amaro , Makarand Ramkrishna Kulkarni
IPC: H01L23/498 , H01L23/00
CPC classification number: H01L23/49838 , H01L23/49805 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/32245 , H01L2224/48245 , H01L2224/73265
Abstract: A lead for a surface mount package for a semiconductor device, and the surface mount package employing the same. In one example, the lead includes a central segment with a first side and a second side, a first extension from a portion of the first side, and a second extension from a portion of the second side. The lead also includes a recess extending through a portion of the central segment, the first extension and the second extension.
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