MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS

    公开(公告)号:US20220037280A1

    公开(公告)日:2022-02-03

    申请号:US16941818

    申请日:2020-07-29

    Abstract: A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first layer, a passive component including at least one capacitor or resistor electrically coupled to the metal trace, and a second set of metal pillars extending from the metal trace to an opposing side of the second layer, and a third layer stacked on the second layer, the third layer including at least one inductor electrically coupled to metal pillars of the second set of metal pillars.

    ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY

    公开(公告)号:US20200227328A1

    公开(公告)日:2020-07-16

    申请号:US16725738

    申请日:2019-12-23

    Inventor: Naweed Anjum

    Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.

    Multi-layer semiconductor package with stacked passive components

    公开(公告)号:US11587899B2

    公开(公告)日:2023-02-21

    申请号:US16941818

    申请日:2020-07-29

    Abstract: A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first layer, a passive component including at least one capacitor or resistor electrically coupled to the metal trace, and a second set of metal pillars extending from the metal trace to an opposing side of the second layer, and a third layer stacked on the second layer, the third layer including at least one inductor electrically coupled to metal pillars of the second set of metal pillars.

    Electronic device with crack arrest structure

    公开(公告)号:US11495549B2

    公开(公告)日:2022-11-08

    申请号:US17185589

    申请日:2021-02-25

    Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

    ELECTRONIC DEVICE WITH CRACK ARREST STRUCTURE

    公开(公告)号:US20220270984A1

    公开(公告)日:2022-08-25

    申请号:US17185589

    申请日:2021-02-25

    Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

    ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY

    公开(公告)号:US20250022761A1

    公开(公告)日:2025-01-16

    申请号:US18901210

    申请日:2024-09-30

    Inventor: Naweed Anjum

    Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.

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