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    MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS
    2.
    发明申请
    MULTI-LAYER SEMICONDUCTOR PACKAGE WITH STACKED PASSIVE COMPONENTS 有权

    公开(公告)号：US20220037280A1

    公开(公告)日：2022-02-03

    申请号：US16941818

    申请日：2020-07-29

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Yiqi Tang ,  Naweed Anjum ,  Liang Wan ,  Michael Gerald Amaro

    IPC: H01L23/00 ,  H01L23/58 ,  H01L23/498 ,  H01L21/56

    Abstract: A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first layer, a passive component including at least one capacitor or resistor electrically coupled to the metal trace, and a second set of metal pillars extending from the metal trace to an opposing side of the second layer, and a third layer stacked on the second layer, the third layer including at least one inductor electrically coupled to metal pillars of the second set of metal pillars.

    ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY
    3.
    发明申请
    ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY 审中-公开

    公开(公告)号：US20200227328A1

    公开(公告)日：2020-07-16

    申请号：US16725738

    申请日：2019-12-23

    Applicant: Texas Instruments Incorporated

    Inventor： Naweed Anjum

    IPC: H01L21/66 ,  G06F30/367 ,  G01R31/28

    Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.

    Multi-layer semiconductor package with stacked passive components
    4.
    发明授权
    Multi-layer semiconductor package with stacked passive components 有权

    公开(公告)号：US11587899B2

    公开(公告)日：2023-02-21

    申请号：US16941818

    申请日：2020-07-29

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Yiqi Tang ,  Naweed Anjum ,  Liang Wan ,  Michael Gerald Amaro

    IPC: H01L21/44 ,  H01L23/52 ,  H01L23/00 ,  H01L23/58 ,  H01L23/498 ,  H01L21/56

    Abstract: A semiconductor package includes a first layer including a semiconductor die embedded within a dielectric substrate, and a first set of metal pillars extending through the dielectric substrate, a second layer stacked on the first layer, the second layer including a metal trace patterned on the dielectric substrate of the first layer, a passive component including at least one capacitor or resistor electrically coupled to the metal trace, and a second set of metal pillars extending from the metal trace to an opposing side of the second layer, and a third layer stacked on the second layer, the third layer including at least one inductor electrically coupled to metal pillars of the second set of metal pillars.

    Electronic device with crack arrest structure
    5.
    发明授权
    Electronic device with crack arrest structure 有权

    公开(公告)号：US11495549B2

    公开(公告)日：2022-11-08

    申请号：US17185589

    申请日：2021-02-25

    Applicant: Texas Instruments Incorporated

    Inventor： Naweed Anjum ,  Michael Gerald Amaro ,  Charles Allen Devries, Jr.

    IPC: H05K1/18 ,  H01L23/00 ,  H01L23/495

    Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

    ELECTRONIC DEVICE WITH CRACK ARREST STRUCTURE
    8.
    发明申请
    ELECTRONIC DEVICE WITH CRACK ARREST STRUCTURE 有权

    公开(公告)号：US20220270984A1

    公开(公告)日：2022-08-25

    申请号：US17185589

    申请日：2021-02-25

    Applicant: Texas Instruments Incorporated

    Inventor： Naweed Anjum ,  Michael Gerald Amaro ,  Charles Allen Devries, JR.

    IPC: H01L23/00 ,  H01L23/495 ,  H05K1/18

    Abstract: A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

    ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY
    9.
    发明申请
    ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY 有权

    公开(公告)号：US20250022761A1

    公开(公告)日：2025-01-16

    申请号：US18901210

    申请日：2024-09-30

    Applicant: Texas Instruments Incorporated

    Inventor： Naweed Anjum

    IPC: H01L21/66 ,  G01R31/28 ,  G06F30/367 ,  G06F113/18 ,  G06F119/02 ,  G06F119/18

    Abstract: In a described example, a method includes: providing a product package for a product die; building a product mimic die that mimics the product die and which is configured to make the product package functional for use in reliability testing; packaging the product mimic die in the product package to form a packaged product mimic die; reliability testing the packaged product mimic die; responsive to the reliability testing, revising the product package; and repeating the steps of reliability testing and revising the product package until the product package passes the reliability tests.

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