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    MULTI-FREQUENCY HYBRID PIEZO ACTUATION AND CAPACTIVE TRANSDUCER
    1.
    发明公开
    MULTI-FREQUENCY HYBRID PIEZO ACTUATION AND CAPACTIVE TRANSDUCER 审中-公开

    公开(公告)号：US20230311161A1

    公开(公告)日：2023-10-05

    申请号：US18206282

    申请日：2023-06-06

    Applicant: Texas Instruments Incorporated

    Inventor： Mohammad Hadi Motieian Najar ,  Peter Smeys

    IPC: B06B1/06 ,  B06B1/02 ,  H10N30/87 ,  H10N30/88 ,  H10N30/00

    CPC classification number: B06B1/0622 ,  B06B1/0215 ,  H10N30/87 ,  H10N30/88 ,  H10N30/1071

    Abstract: A method includes receiving, by a piezoelectric stack of a transducer, a first piezoelectric voltage. The transducer has a base structure and a first layer, the base structure having a first displacement between a first portion of the base structure and the first layer. The method also includes transmitting, by the transducer, a first ultrasound frequency while receiving a first piezoelectric voltage, and receiving, by the transducer, a first bias voltage. The received first bias voltage alters the first displacement between the first portion of the base structure and the first layer, and the altered first displacement is smaller than the first displacement. The method further includes receiving, by the piezoelectric stack of the transducer, a second piezoelectric voltage to the transducer, and transmitting, by the transducer, a second ultrasound frequency while receiving the first bias voltage and the second piezoelectric voltage.

    THERMAL AND STRESS ISOLATION FOR PRECISION CIRCUIT
    4.
    发明申请
    THERMAL AND STRESS ISOLATION FOR PRECISION CIRCUIT 审中-公开

    公开(公告)号：US20200043828A1

    公开(公告)日：2020-02-06

    申请号：US16055395

    申请日：2018-08-06

    Applicant: Texas Instruments Incorporated

    Inventor： Peter Smeys ,  Ting-Ta Yen ,  Barry Jon Male ,  Paul Merle Emerson

    IPC: H01L23/433 ,  H01L23/31 ,  H01L23/495 ,  H01L23/00

    Abstract: Described examples include microelectronic devices and integrated circuits with an active first circuit in a first segment of a first wafer, a second circuit in a second segment of the first wafer, and second and third wafers bonded to different surfaces of the first wafer to provide first and second cavities with surfaces spaced from the first segment. An opening extends through the first wafer between the first and second cavities to separate portions of the first and second segments and to form a sealed cavity that surrounds the first segment. A bridge segment of the first wafer supports the first segment in the sealed cavity and includes one or more conductive structures to electrically connect the first and second circuits.

    INDUCTIVE HUMIDITY SENSOR AND METHOD
    5.
    发明申请
    INDUCTIVE HUMIDITY SENSOR AND METHOD 审中-公开

    公开(公告)号：US20190204269A1

    公开(公告)日：2019-07-04

    申请号：US15856490

    申请日：2017-12-28

    Applicant: Texas Instruments Incorporated

    Inventor： Peter Smeys ,  Joyce Marie Mullenix

    IPC: G01N27/60 ,  G01D5/20 ,  H01F27/24 ,  H01F17/00

    CPC classification number: G01N27/605 ,  G01D5/2006 ,  H01F17/0006 ,  H01F27/24

    Abstract: Described examples include devices and methods for measuring relative humidity of an environment using inductance. The devices can include a resonant circuit, including a capacitor and an inductor. The inductor includes a moisture-absorbing core with at least a portion thereof exposed to an environment, with at least one magnetic property of the core being variable in response to changing levels of moisture in the environment. An excitation circuit provides an AC excitation signal to the resonant circuit. A sense circuit determines an inductance of the inductor according to a sense signal from the resonant circuit. The sense circuit is coupled to generate an output signal that indicates a humidity level of the environment according to the sense signal.

    Using Acoustic Reflector to Reduce Spurious Modes
    7.
    发明申请
    Using Acoustic Reflector to Reduce Spurious Modes 审中-公开

    公开(公告)号：US20200373908A1

    公开(公告)日：2020-11-26

    申请号：US16422494

    申请日：2019-05-24

    Applicant: Texas Instruments Incorporated

    Inventor： Ting-Ta Yen ,  Jeronimo Segovia Fernandez ,  Bichoy Bahr ,  Peter Smeys

    IPC: H03H9/17 ,  H03H9/13 ,  H03H9/05 ,  H03H9/10

    Abstract: A micromechanical system (MEMS) resonator includes a base substrate. A piezoelectric layer has a first electrode attached to a first surface of the piezoelectric layer and a second electrode attached to a second surface of the piezoelectric layer opposite the first electrode. The first electrode is bounded by a perimeter edge. A patterned acoustic mirror is formed on a top surface of the first electrode opposite the piezoelectric layer, such that the patterned acoustic mirror covers a border strip of the top surface of the first electrode at the perimeter edge and does not cover an active portion of the top surface of the first electrode.

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