公开(公告)号：US11862538B2

公开(公告)日：2024-01-02

申请号：US17463124

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Hao Lin ,  Hung-Yu Chou ,  Bo-Hsun Pan ,  Dong-Ren Peng ,  Pi-Chiang Huang ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/181

Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

公开(公告)号：US20210043548A1

公开(公告)日：2021-02-11

申请号：US16537535

申请日：2019-08-10

Applicant: Texas Instruments Incorporated

Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

IPC: H01L23/495 ,  H01L23/492 ,  H01L23/00

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.

公开(公告)号：US11081428B2

公开(公告)日：2021-08-03

申请号：US16537535

申请日：2019-08-10

Applicant: Texas Instruments Incorporated

Inventor： Stanley Chou ,  Yuh-Harng Chien ,  Steven Alfred Kummerl ,  Bo-Hsun Pan ,  Pi-Chiang Huang ,  Frank Yu ,  Chih-Chien Ho

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/492

Abstract: An electronic device includes a package structure with opposite first and second sides spaced apart along a first direction, opposite third and fourth sides spaced apart along a second direction, opposite fifth and sixth sides spaced apart along a third direction, the first, second, and third directions being orthogonal to one another. A set of first leads extend outward from the first side along the first direction, a set of second leads extend outward from the second side along the first direction, and a thermal pad includes a first portion that extends along a portion of the fifth side, and a second portion that extends along a portion of the third side to facilitate cooling and visual solder inspection when soldered to a host printed circuit board.