公开(公告)号：US11862538B2

公开(公告)日：2024-01-02

申请号：US17463124

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Chung-Hao Lin ,  Hung-Yu Chou ,  Bo-Hsun Pan ,  Dong-Ren Peng ,  Pi-Chiang Huang ,  Yuh-Harng Chien

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49513 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/4952 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2924/181

Abstract: In some examples a semiconductor chip package includes a conductive terminal. In addition, the semiconductor chip package includes a die pad including a top side and a recess extending into the top side. The die pad is downset relative to the conductive terminal. Further, the semiconductor ship package includes a semiconductor die positioned within the recess, wherein the semiconductor die has an outer perimeter, and a solder fillet engaged within the recess and with the outer perimeter of the semiconductor die. Still further, the semiconductor chip package includes a wire bond coupled to the semiconductor die and the conductive terminal, and a mold compound covering the conductive terminal, the wire bond, the die pad, and the semiconductor die.

公开(公告)号：US11948721B2

公开(公告)日：2024-04-02

申请号：US16883614

申请日：2020-05-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ying-Chuan Kao ,  Hung-Yu Chou ,  Dong-Ren Peng ,  Jun Jie Kuo ,  Kenji Otake ,  Chih-Chien Ho

IPC: H01F27/28 ,  H01F19/08 ,  H01L23/64 ,  H01L49/02

CPC classification number: H01F27/2804 ,  H01L23/645 ,  H01L28/10 ,  H01F2019/085 ,  H01F2027/2809

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.

公开(公告)号：US20210375525A1

公开(公告)日：2021-12-02

申请号：US16883614

申请日：2020-05-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ying-Chuan Kao ,  Hung-Yu Chou ,  Dong-Ren Peng ,  Jun Jie Kuo ,  Kenji Otake ,  Chih-Chien Ho

IPC: H01F27/28 ,  H01L23/64 ,  H01L49/02

Abstract: An apparatus includes a laminate, the laminate including a dielectric layer having a first surface and a second surface opposed to the first surface, and a conductive layer forming a circuit element overlying the first surface of the dielectric layer. The apparatus further includes a magnetic layer over the conductive layer. A first edge surface of the magnetic layer is coplanar with a first edge surface of the laminate, and a second edge surface of the magnetic layer is coplanar with a second edge surface of the laminate.