公开(公告)号：US3859177A

公开(公告)日：1975-01-07

申请号：US29035772

申请日：1972-09-19

Applicant: THOMSON CSF

Inventor： GIGOUX CLAUDE

IPC: H05K3/06 ,  H05K3/00 ,  H05K3/20 ,  H05K3/42 ,  H05K3/46 ,  C23B5/48

CPC classification number: H05K3/42 ,  H05K3/0064 ,  H05K3/205 ,  H05K3/46 ,  H05K2201/0361 ,  H05K2203/0376 ,  H05K2203/1184

Abstract: A novel method of manufacturing ''''printed circuits'''' arrangements, with one or several layers of conductors, is provided. By successive operations of photogravure and metal deposition using electrolysis, there is constructed, without any mechanical procedure, a structure comprising a temporary skeleton and conductors arranged at different layers and interconnected by conductive eyelets. The metal constituting the temporary structure is selectively attacked and replaced by resin to constitute a new insulating structure.

公开(公告)号：US3913223A

公开(公告)日：1975-10-21

申请号：US40929573

申请日：1973-10-24

Applicant: THOMSON CSF

Inventor： GIGOUX CLAUDE

IPC: H05K3/06 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/462 ,  H05K3/062 ,  H05K3/205 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/42 ,  H05K3/4623 ,  H05K3/4647 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0367 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2203/0376 ,  H05K2203/0726 ,  Y10T29/49158

Abstract: A method for manufacturing a double-sided circuit designed to form a multilayers circuit structure comprises successively deposition of conductor layer and conductor stud having contact surface upon a temporary substrate which is eliminated by etching with a chemical agent and replaced by a dielectric material which recovers the double sided-circuit except on a level with said contact surfaces.

Abstract translation: 用于制造设计成形成多层电路结构的双面电路的方法包括：将导体层和具有接触表面的导体柱连续沉积在临时衬底上，该临时衬底通过用化学试剂蚀刻而消除并由电介质材料代替 双面电路除了与所述接触表面的水平线之外。