公开(公告)号：US20230102259A1

公开(公告)日：2023-03-30

申请号：US17906294

申请日：2021-01-21

Applicant: THREEBOND CO., LTD.

Inventor： Jyunya IWASAWA ,  Kouki MIHASHI

IPC: C08G59/66 ,  C08G59/50

Abstract: An epoxy resin composition comprising the following components (A) to (E). Component (A) is a compound containing two or more epoxy groups. Component (B) is phenyl monoglycidyl ether having an alkyl group with 1 to 10 carbon atoms. Component (C) is an oxetane compound. Component (D) is a thiol curing agent. Component (E) is a curing accelerator.

公开(公告)号：US20240043607A1

公开(公告)日：2024-02-08

申请号：US18546707

申请日：2022-02-04

Applicant: THREEBOND CO., LTD.

Inventor： Jyunya IWASAWA

IPC: C08G59/24 ,  C08K3/36 ,  C08K9/06 ,  C08G59/50 ,  C08G59/40 ,  C08G59/22

CPC classification number: C08G59/245 ,  C08K3/36 ,  C08K9/06 ,  C08G59/502 ,  C08G59/4064 ,  C08G59/223 ,  C08K2201/005 ,  C08K2201/006 ,  C08G2170/00 ,  C08G2190/00

Abstract: The present invention relates to an epoxy resin composition having excellent low-temperature curability and excellent permeability into a clearance of a narrow portion. An epoxy resin composition containing components (A) to (C) below:



the component (A): a compound having two or more epoxy groups;
the component (B): silica treated with phenylaminosilane; and
the component (C): a compound curing the component (A).

公开(公告)号：US20230331904A1

公开(公告)日：2023-10-19

申请号：US18245597

申请日：2021-08-31

Applicant: THREEBOND CO., LTD.

Inventor： Jyunya IWASAWA

IPC: C08G59/38 ,  C08G59/40 ,  C08G59/50 ,  C08K7/18 ,  C08L63/00

CPC classification number: C08G59/38 ,  C08G59/4064 ,  C08G59/5006 ,  C08K7/18 ,  C08L63/00 ,  C08G2170/00 ,  C08G2190/00

Abstract: An epoxy resin has excellent adhesiveness to different materials. An epoxy resin composition includes the following (A) to (E): (A) a compound with an epoxy equivalent of less than 210 g/eq. that is liquid at 25° C. and has two or more epoxy groups in one molecule, (B) (B-1) a compound with an epoxy equivalent of 210 g/eq. or more that is liquid at 25° C. and has two or more epoxy groups in one molecule and/or (B-2) a compound that is solid at 25° C. and has two or more epoxy groups in one molecule, (C) a thiol curing agent, (D) a latent curing agent, and (E) a reactive diluent.