公开(公告)号：US20170283977A1

公开(公告)日：2017-10-05

申请号：US15458327

申请日：2017-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tadashi IINO ,  Toru IHARA ,  Yoshihiro KAI ,  Yoichi TOKUNAGA

IPC: C25D17/08 ,  H01L21/67 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12 ,  C25D17/00 ,  H01L21/687 ,  H01L21/677

CPC classification number: C25D17/08 ,  C25D7/12 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67023 ,  H01L21/67173 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68785 ,  H01L21/68792

Abstract: A substrate processing apparatus includes a holding device that includes a conductive member and holds a substrate, a conduction path structure that includes a conductive material and positioned such that the conduction path structure is in contact with the holding device, a supply device that supplies a processing liquid to the substrate held by the holding device, and a grounding structure including a variable resistance device that changes a resistance such that the grounding structure has a first end portion connected the conduction path structure and a second end portion connected to a ground potential.