公开(公告)号：US20210257210A1

公开(公告)日：2021-08-19

申请号：US16468383

申请日：2017-11-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoichi TOKUNAGA

IPC: H01L21/02 ,  B08B3/04 ,  B08B3/08 ,  H01L21/67 ,  H01L21/687 ,  H01L21/66

Abstract: There is provided a substrate processing apparatus including: a rotatable holding part configured to rotate a substrate while holding the substrate; a liquid supply part configured to supply a processing liquid to a peripheral edge portion of the substrate held by the rotatable holding part; a sensor configured to detect a temperature distribution at the peripheral edge portion; and a controller configured to execute an operation of detecting a boundary portion between a region of the peripheral edge portion to which the processing liquid adheres and a region of the peripheral edge portion to which the processing liquid does not adhere, based on the temperature distribution.

公开(公告)号：US20170283977A1

公开(公告)日：2017-10-05

申请号：US15458327

申请日：2017-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tadashi IINO ,  Toru IHARA ,  Yoshihiro KAI ,  Yoichi TOKUNAGA

IPC: C25D17/08 ,  H01L21/67 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12 ,  C25D17/00 ,  H01L21/687 ,  H01L21/677

CPC classification number: C25D17/08 ,  C25D7/12 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67023 ,  H01L21/67173 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68785 ,  H01L21/68792

Abstract: A substrate processing apparatus includes a holding device that includes a conductive member and holds a substrate, a conduction path structure that includes a conductive material and positioned such that the conduction path structure is in contact with the holding device, a supply device that supplies a processing liquid to the substrate held by the holding device, and a grounding structure including a variable resistance device that changes a resistance such that the grounding structure has a first end portion connected the conduction path structure and a second end portion connected to a ground potential.

公开(公告)号：US20140102474A1

公开(公告)日：2014-04-17

申请号：US14049815

申请日：2013-10-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Akihiro FUJIMOTO ,  Shuuichi NISHIKIDO ,  Dai KUMAGAI ,  Naoto YOSHITAKA ,  Takahiro KITANO ,  Yoichi TOKUNAGA

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A substrate cleaning apparatus for cleaning a substrate back surface includes a first substrate supporting portion supporting the substrate at a first area of the substrate back surface, the back surface facing down; a second substrate supporting portion supporting the substrate at a second area of the substrate back surface, the second area being separated from the first area; a cleaning liquid supplying portion supplying cleaning liquid to the substrate back surface; a drying portion drying the second area of the substrate back surface; and a cleaning portion cleaning a third area of the substrate back surface when the substrate is supported by the first substrate supporting portion, the third area including the second area, and cleaning a fourth area of the substrate back surface when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area.

Abstract translation: 用于清洗衬底背面的衬底清洁装置包括在衬底背面的第一区域处支撑衬底的第一衬底支撑部分，其背面朝下; 第二基板支撑部，在所述基板背面的第二区域支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，其向所述基板背面供给清洗液; 干燥部，干燥所述基板背面的第二区域; 以及当所述基板被所述第一基板支撑部支撑时，所述清洁部分清洁所述基板背面的第三区域，所述第三区域包括所述第二区域，以及当所述基板被所述第二区域支撑时，清洁所述基板背面的第四区域 第二基板支撑部分，除第二区域之外的第四区域。

公开(公告)号：US20200328095A1

公开(公告)日：2020-10-15

申请号：US16890332

申请日：2020-06-02

Applicant: TOKYO ELECTRON LIMITED

Inventor： Hiromitsu NAMBA ,  Fitrianto ,  Yoichi TOKUNAGA ,  Yoshifumi AMANO

IPC: H01L21/67 ,  H01L21/306 ,  H01L21/02 ,  H01L21/3213 ,  H01L21/683

Abstract: A substrate processing apparatus includes a substrate holder that holds a substrate in a horizontal direction; a rotation driver that rotates the substrate holder; a first processing liquid nozzle that supplies a first processing liquid to a peripheral portion of the substrate; a first gas supply source that supplies a first gas at a first temperature to the peripheral portion of the substrate; and a second gas supply source that supplies a second gas at a second temperature to an inner side of the substrate in a radial direction. The first gas supply source includes a heater that heats the first gas into the first temperature, and a first gas ejection port that supplies the first gas heated by the heater through a conduit, and the second gas supply source includes a second gas ejection port that supplies the second gas through a gas supply pipe.

公开(公告)号：US20160314958A1

公开(公告)日：2016-10-27

申请号：US15204068

申请日：2016-07-07

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yasushi TAKIGUCHI ,  Taro YAMAMOTO ,  Akihiro FUJIMOTO ,  Shuuichi NISHIKIDO ,  Dai KUMAGAI ,  Naoto YOSHITAKA ,  Takahiro KITANO ,  Yoichi TOKUNAGA

IPC: H01L21/02 ,  H01L21/687 ,  B08B5/02 ,  B08B1/00 ,  B08B1/04 ,  B08B3/02 ,  H01L21/67 ,  B08B7/00

CPC classification number: H01L21/0209 ,  B08B1/002 ,  B08B1/04 ,  B08B3/02 ,  B08B5/02 ,  B08B7/0057 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/68742 ,  H01L21/68764

Abstract: A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

Abstract translation: 公开的用于清洁基板的背面的基板清洁装置包括：第一基板支撑部，其构造成在基板的背面的第一区域处支撑基板，所述背面朝下; 第二基板支撑部，其构造成在所述基板的背面的第二区域处支撑所述基板，所述第二区域与所述第一区域分离; 清洗液供给部，构成为向所述基板的背面供给清洗液; 干燥部，其构造成干燥所述基板的背面的第二区域; 以及清洁部，其构造成当所述基板被所述第一基板支撑部支撑所述基板时，清洁所述基板的背面的第三区域，所述第三区域包括所述第二区域以及所述基板的背面的第四区域， 基板由第二基板支撑部分支撑，除了后表面的第二区域之外的第四区域。

公开(公告)号：US20140352736A1

公开(公告)日：2014-12-04

申请号：US14460020

申请日：2014-08-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Taro YAMAMOTO ,  Naoto YOSHITAKA ,  Shuichi NISHIKIDO ,  Yoichi TOKUNAGA

IPC: B05D3/10 ,  B05D5/06 ,  B05D3/06

CPC classification number: B05D3/105 ,  B05D3/065 ,  B05D5/06 ,  G03F7/168 ,  H01L21/67046 ,  H01L21/67051

Abstract: A cleaning apparatus includes a first substrate-holding portion configured to hold a first area of a back surface of the substrate so that the top surface is kept face up; a second substrate-holding portion configured to hold a second area of the back surface of the substrate, the second area being not overlapped with the first area, and rotate the substrate; a top-surface cleaning nozzle configured to supply a top surface cleaning fluid to a top surface of the substrate; a bevel cleaning nozzle configured to supply a bevel cleaning fluid to a bevel portion of the substrate; a cleaning fluid supplying portion configured to supply a back surface cleaning fluid to the back surface of the substrate held by the first or the second substrate-holding portion; and a cleaning member configured to clean the back surface of the substrate held by the first or the second-substrate holding portion.

Abstract translation: 清洁装置包括：第一基板保持部，其构造成保持基板的背面的第一区域，使得顶面保持面朝上; 第二基板保持部构造成保持基板的背面的第二区域，第二区域与第一区域不重叠，并旋转基板; 顶表面清洁喷嘴，其构造成将顶表面清洁流体供应到所述基板的顶表面; 斜面清洁喷嘴，其构造成将倾斜清洁流体供应到所述基板的斜面部分; 清洗液供给部，其构造成将后表面清洗液供给到由所述第一或第二基板保持部保持的基板的背面; 以及清洁部件，其构造成清洁由所述第一或第二基板保持部保持的所述基板的背面。

公开(公告)号：US20130171831A1

公开(公告)日：2013-07-04

申请号：US13727671

申请日：2012-12-27

Applicant: Tokyo Electron Limited

Inventor： Hiromitsu NAMBA ,  Fitrianto ,  Yoichi TOKUNAGA ,  Yoshifumi AMANO

IPC: H01L21/67 ,  H01L21/306

CPC classification number: H01L21/6708 ,  H01L21/02087 ,  H01L21/30604 ,  H01L21/32134 ,  H01L21/67109 ,  H01L21/6838

Abstract: A substrate processing apparatus includes a substrate holding unit configured to hold a substrate; a first processing liquid nozzle configured to supply a first processing liquid to a peripheral portion of the substrate; a second processing liquid nozzle configured to supply a second processing liquid, the temperature of which is lower than that of the first processing liquid, to the peripheral portion of the substrate; a first gas supply port configured to supply a first gas at a first temperature to a first gas supplied place on the peripheral portion of the substrate; and a second gas supply port configured to supply a second gas at a second temperature lower than the first temperature to a place closer to the center in the radial direction as compared to the first gas supplied place with respect to the substrate.

Abstract translation: 基板处理装置包括：基板保持单元，被配置为保持基板; 第一处理液喷嘴，被配置为将第一处理液体供应到所述基板的周边部分; 第二处理液喷嘴，被配置为将温度低于第一处理液的第二处理液供给到基板的周边部分; 第一气体供给口，其构造成将第一温度的第一气体供给到所述基板的周边部的第一供气位置; 以及第二气体供给口，被配置为相对于与所述基板相对于所述第一气体供给位置，在比所述第一温度低的第二温度向所述径向中心附近供给第二气体。