公开(公告)号：US20210111054A1

公开(公告)日：2021-04-15

申请号：US17061967

申请日：2020-10-02

Applicant: Tokyo Electron Limited

Inventor： Kouzou KANAGAWA ,  Kotaro TSURUSAKI ,  Keiji ONZUKA ,  Yoshihiro KAI

IPC: H01L21/677 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a loading/unloading part into/from which a cassette that accommodates a plurality of substrates is loaded/unloaded; a batch-type processing part configured to collectively process a lot including the plurality of substrates; a single-substrate-type processing part configured to the plurality of substrates of the lot one by one; and an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part, wherein the loading/unloading part, the single-substrate-type processing part, the interface part, and the batch-type processing part are arranged in this order, and wherein the interface part comprises a lot formation part configured to form the lot, and a transfer part configured to transfer the plurality of substrates from the single-substrate-type processing part to the lot formation part, and configured to transfer the plurality of substrates from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US20240242975A1

公开(公告)日：2024-07-18

申请号：US18619636

申请日：2024-03-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou KANAGAWA ,  Kotaro TSURUSAKI ,  Keiji ONZUKA ,  Yoshihiro KAI

IPC: H01L21/56 ,  H01L21/02

CPC classification number: H01L21/561 ,  H01L21/02101

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US20170283977A1

公开(公告)日：2017-10-05

申请号：US15458327

申请日：2017-03-14

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tadashi IINO ,  Toru IHARA ,  Yoshihiro KAI ,  Yoichi TOKUNAGA

IPC: C25D17/08 ,  H01L21/67 ,  C25D7/12 ,  H01L21/288 ,  C25D21/12 ,  C25D17/00 ,  H01L21/687 ,  H01L21/677

CPC classification number: C25D17/08 ,  C25D7/12 ,  C25D17/007 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/67023 ,  H01L21/67173 ,  H01L21/6723 ,  H01L21/67253 ,  H01L21/67742 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/6875 ,  H01L21/68785 ,  H01L21/68792

Abstract: A substrate processing apparatus includes a holding device that includes a conductive member and holds a substrate, a conduction path structure that includes a conductive material and positioned such that the conduction path structure is in contact with the holding device, a supply device that supplies a processing liquid to the substrate held by the holding device, and a grounding structure including a variable resistance device that changes a resistance such that the grounding structure has a first end portion connected the conduction path structure and a second end portion connected to a ground potential.

公开(公告)号：US20250087515A1

公开(公告)日：2025-03-13

申请号：US18958534

申请日：2024-11-25

Applicant: Tokyo Electron Limited

Inventor： Kouzou KANAGAWA ,  Kotaro TSURUSAKI ,  Keiji ONZUKA ,  Yoshihiro KAI

IPC: H01L21/677 ,  H01L21/02 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing system includes: a loading/unloading part into/from which a cassette that accommodates a plurality of substrates is loaded/unloaded; a batch-type processing part configured to collectively process a lot including the plurality of substrates; a single-substrate-type processing part configured to the plurality of substrates of the lot one by one; and an interface part configured to deliver the plurality of substrates between the batch-type processing part and the single-substrate-type processing part, wherein the loading/unloading part, the single-substrate-type processing part, the interface part, and the batch-type processing part are arranged in this order, and wherein the interface part comprises a lot formation part configured to form the lot, and a transfer part configured to transfer the plurality of substrates from the single-substrate-type processing part to the lot formation part, and configured to transfer the plurality of substrates from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US20210111038A1

公开(公告)日：2021-04-15

申请号：US17063169

申请日：2020-10-05

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou KANAGAWA ,  Kotaro TSURUSAKI ,  Keiji ONZUKA ,  Yoshihiro KAI

IPC: H01L21/56 ,  H01L21/02

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.

公开(公告)号：US20220392779A1

公开(公告)日：2022-12-08

申请号：US17886687

申请日：2022-08-12

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kouzou KANAGAWA ,  Kotaro TSURUSAKI ,  Keiji ONZUKA ,  Yoshihiro KAI

IPC: H01L21/56 ,  H01L21/02

Abstract: A substrate processing system includes: a batch-type processing part that collectively processes a lot including substrates arranged at a first pitch; a single-substrate-type processing part that processes the substrates of the lot one by one; and an interface part that delivers the substrates between the batch-type processing part and the single-substrate-type processing part. The batch-type processing part includes a processing bath that stores a processing solution having a lump shape or a mist shape, a first holder that holds the substrates arranged at the first pitch, and a second holder that receives the substrates arranged at a second pitch from the first holder in the processing solution. The interface part includes a transfer part that transfers the substrates held separately by the first and second holders in the processing solution, from the batch-type processing part to the single-substrate-type processing part.