公开(公告)号：US20180108821A1

公开(公告)日：2018-04-19

申请号：US15562024

申请日：2016-03-23

Applicant: TORAY ENGINEERING CO., LTD.

Inventor： Takayoshi FUJIMOTO ,  Masamichi YAMASHITA ,  Masaki MORI ,  Yutaka OKA

IPC: H01L33/60 ,  H01L33/52 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/52 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

Abstract: In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.