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公开(公告)号：US20240116274A1
公开(公告)日：2024-04-11
申请号：US18263953
申请日：2022-02-22
申请人： TOYOBO CO., LTD.
发明人： Kaya TOKUDA , Satoshi MAEDA , Tetsuo OKUYAMA , Naoki WATANABE
CPC分类号： B32B17/10 , B32B7/12 , B32B27/08 , B32B27/281 , B32B27/32 , B32B27/36 , B32B2307/538 , B32B2457/00
摘要： An inorganic substrate/polymer film laminate with an attached protective film that allows for easy individual removal even when stored in a stacked state for a long period of time is provided. A first laminate is characterized by including an inorganic substrate, a polymer film layer and a first protective film, in that order, wherein the surface roughness Ra of the surface of the inorganic substrate opposite of the polymer film layer is 0.02-1.2 μm.
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公开(公告)号：US20240075718A1
公开(公告)日：2024-03-07
申请号：US18263100
申请日：2022-06-09
申请人： TOYOBO CO., LTD.
CPC分类号： B32B27/08 , B32B3/30 , B32B7/06 , B32B17/10 , B32B27/16 , B32B27/281 , B32B27/36 , B32B2255/10 , B32B2255/26 , B32B2307/306 , B32B2307/748
摘要： The invention provides a laminate having a protective film release auxiliary tape and comprising a rigid temporary support body (inorganic substrate) and a polymer film provided with a protective film. The laminate is configured such that the protective film can be peeled from the polymer film without separating the polymer film from the temporary support body. The laminate comprises an inorganic substrate, a heat-resistant polymer film, a protective film, and a protective film release auxiliary tape in this order. The adhesion strength F1 according to a 90 degree peeling method between the inorganic substrate and the heat-resistant polymer film, the adhesion strength F2 according to a 90 degree peeling method between the heat-resistant polymer film and the protective film, and the adhesion strength F3 according to a 90 degree peeling method between the protective film and the protective film release auxiliary tape satisfy the relationship F3>F1>F2.
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公开(公告)号：US20230180865A1
公开(公告)日：2023-06-15
申请号：US17925405
申请日：2021-05-06
申请人： TOYOBO CO., LTD.
发明人： Michihiko IRIE , Yusuke SHIMIZU , Yuichiro OMOTE , Satoshi MAEDA
CPC分类号： A41D13/1281 , A61B5/6804 , A61B5/27 , A41D31/04 , A61B2562/125
摘要： An object is to provide a garment-type biological information measurement device having a biological contact-type electrode and having excellent durability against washing. A garment-type biological information measurement device comprising an electrode, wherein the electrode comprises a stretchable conductive layer containing a flexible resin and a conductive filler, a stretchable adhesion acceleration layer, a stretchable hot melt adhesive layer, and a garment fabric, in this order.
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公开(公告)号：US20170225433A1
公开(公告)日：2017-08-10
申请号：US15503382
申请日：2015-08-24
申请人： TOYOBO CO., LTD.
IPC分类号： B32B9/04 , H01L21/683 , B32B37/10
CPC分类号： B32B9/04 , B32B27/34 , B32B37/10 , B32B2255/20 , B32B2457/00 , C08J7/00 , C08J7/065 , C08J2379/08 , H01L21/6836 , Y02P20/582
摘要： It is provided that a polymer film; a preparation method of the polymer film; and a laminated body used the polymer film. The polymer film is suitable for use in producing a laminate body which comprises a support and a polymer film, and is reduced in foreign-matter trapping and which can be used for supplying film devices using conventional apparatuses for glass substrates or silicon substrates. The polymer film coated with the layer of silane coupling agent, which is suitable for producing a laminate that comprises a support and a polymer film, comprises a silane coupling agent layer formed on at least one surface of the polymer film, wherein the silane coupling agent layer has a three-dimensional surface roughness (Sa) of 5.0 nm or less. The method of efficient for producing the polymer film coated with the above layer is the method for producing without using a vacuum.
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公开(公告)号：US20240227373A1
公开(公告)日：2024-07-11
申请号：US18553972
申请日：2022-07-07
申请人： TOYOBO CO., LTD.
CPC分类号： B32B27/34 , B32B27/281 , B32B2307/306 , B32B2307/54 , B32B2377/00 , B32B2379/08 , B32B2457/08
摘要： The present invention provides a multilayer body of an inorganic substrate and a heat-resistant polymer film, the multilayer body being suppressed in vibrations during handling. A multilayer body of a heat-resistant polymer film and an inorganic substrate according to the present invention does not substantially use an adhesive and is characterized in that: the heat-resistant polymer film is transparent; the tensile elastic modulus E1 (GPa) and the thickness T1 (μm) of the multilayer body satisfy formula (1); and the storage elastic modulus E2 (GPa) at 280° C. and the thickness T1 (μm) of the multilayer body satisfy formula (2). (1): 25,000≤E1×T1 (2): E2×T1≤52,000
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6.发明公开公开(公告)号：US20240059057A1
公开(公告)日：2024-02-22
申请号：US18261394
申请日：2021-10-28
申请人： TOYOBO CO., LTD.
发明人： Kaya TOKUDA , Tetsuo OKUYAMA , Satoshi MAEDA , Naoki WATANABE , Mayumi AKASHI
CPC分类号： B32B27/36 , B32B7/12 , B32B27/08 , B32B27/281 , B32B43/003 , B32B37/1284 , B32B2250/03 , B32B2250/24 , B32B2305/30 , B32B2367/00 , B32B2379/08 , B32B2307/536
摘要： Provided is a laminated film that includes a heat-resistant polymer film and a first protective film laminated on one of the surfaces of the heat-resistant polymer film, wherein: the first protective film has a first substrate and a first adhesive layer provided on the first substrate; the first substrate, the first adhesive layer, and the heat-resistant polymer film are laminated in this order; the first substrate is a polyester film or a polyolefin film; the first adhesive layer contains a urethane-based resin; and the maximum diameter of a gelled product in the first adhesive layer is equal to or less than 14 μm.
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公开(公告)号：US20240227363A1
公开(公告)日：2024-07-11
申请号：US18558962
申请日：2022-07-07
申请人： TOYOBO CO., LTD.
CPC分类号： B32B17/10 , B32B27/281 , B32B27/34 , B32B2250/02 , B32B2255/26 , B32B2307/306 , B32B2307/308 , B32B2307/4026 , B32B2307/412 , B32B2307/54 , B32B2307/542 , B32B2377/00 , B32B2379/08
摘要： Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.
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公开(公告)号：US20230150252A1
公开(公告)日：2023-05-18
申请号：US17996745
申请日：2021-06-09
申请人： TOYOBO CO., LTD.
发明人： Kaya TOKUDA , Tetsuo OKUYAMA , Satoshi MAEDA , Naoki WATANABE , Harumi YONEMUSHI , Denichirou MIZUGUCHI
CPC分类号： B32B37/02 , B32B7/022 , B32B9/045 , B32B27/281 , B32B38/10 , B32B2307/306 , B32B2307/538 , B32B2037/0092
摘要： The invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. The multilayer body uses substantially no adhesive and is characterized by (1) a tensile elastic modulus of the highly heat-resistant film of 4 GPa or more, (2) a bonding strength between the highly heat-resistant film and the inorganic substrate of 0.3 N/cm or less, (3) a surface roughness Ra of a surface of the highly heat-resistant film, said surface being in contact with the inorganic substrate, of 5 nm or less, and (4) a surface roughness Ra of the surface of the inorganic substrate after removal of the highly heat-resistant film from the multilayer body of 3 nm or less.
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