SPATIAL MULTIPLEXING OF LENS ARRAYS WITH SURFACE-EMITTING LASERS FOR MULTI-ZONE ILLUMINATION

    公开(公告)号:US20200310005A1

    公开(公告)日:2020-10-01

    申请号:US16828815

    申请日:2020-03-24

    Abstract: Systems, methods, and devices disclosed herein relate to optical assemblies for spatial multiplexing, multi-zone illumination, and optical assemblies. In embodiments, light source arrays are aligned with one or more micro-lens assemblies to generate a specific field of illumination. In embodiments, surface-emitting light sources may be light-emitting diodes and/or surface-emitting lasers. The micro-lens array may be aligned with the light source arrays, on-axis or off-axis to a principal axis of corresponding lenses such that the light sources may be expanded to a desired divergence and field of illumination. In embodiments, multiple light sources may be combined to increase power output for a specific area of the field of illumination, and light sources may be driven independently depending on intended illumination.

    Compact multi-zone infrared laser illuminator

    公开(公告)号:US10244181B2

    公开(公告)日:2019-03-26

    申请号:US15040975

    申请日:2016-02-10

    Inventor: Mial E. Warren

    Abstract: Methods, devices and systems are described for selectively illuminating different zones of a field of view by a multi-zone illumination device. In one aspect, a multi-zone illuminator may include a plurality of vertical cavity surface emitting lasers (VCSELs), and a plurality of micro-optical devices aligned with apertures of individual or groups of VCSELs, which are configured to be individually activated to provide adjustable illumination to different zones of a field of view of an image sensor. In another aspect, a method of selective illumination may include receiving information specifying a field of view of a camera, and controlling at least two sub arrays or individual illuminators of an illuminating array to output light at independently adjustable illumination powers, wherein each of the at least two sub arrays are independently configurable to illuminate at least one of a plurality of separate zones corresponding to the field of view of the camera.

    Single-chip series connected VCSEL array

    公开(公告)号:US10530128B2

    公开(公告)日:2020-01-07

    申请号:US16045633

    申请日:2018-07-25

    Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.

    WIDE-ANGLE ILLUMINATOR MODULE
    5.
    发明申请

    公开(公告)号:US20190268068A1

    公开(公告)日:2019-08-29

    申请号:US16406846

    申请日:2019-05-08

    Abstract: A wide-angle illuminator module including a rigid support structure having a plurality of angled faces, a flexible circuit including one or more VCSEL arrays, each VCSEL array positioned over a face among the plurality of angled faces, each VCSEL array including a plurality of integrated microlenses with one microlens positioned over each VCSEL in the VCSEL array, and a driver circuit for providing electrical pulses to each VCSEL array, wherein the plurality of VCSEL arrays address illumination zones in a combined field of illumination. The support structure may also be a heatsink. The flexible circuit may be a single flexible circuit configured to be placed over the support structure or a plurality of flexible circuits, each including one VCSEL array.

    Single-chip series connected VCSEL array

    公开(公告)号:US10756515B2

    公开(公告)日:2020-08-25

    申请号:US16733901

    申请日:2020-01-03

    Abstract: Methods, devices and systems are described for enabling a series-connected, single chip vertical-cavity surface-emitting laser (VCSEL) array. In one aspect, the single chip includes one or more non-conductive regions one the conductive layer to produce a plurality of electrically separate conductive regions. Each electrically separate region may have a plurality of VCSEL elements, including an anode region and a cathode region connected in series. The chip is connected to a sub-mount with a metallization pattern, which connects each electrically separate region on the conductive layer in series. In one aspect, the metallization pattern connects the anode region of a first electrically separate region to the cathode region of a second electrically separate region. The metallization pattern may also comprise cuts that maintain electrical separation between the anode and cathode regions on each conductive layer region, and that align with the etched regions.

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