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公开(公告)号：US20170194544A1
公开(公告)日：2017-07-06
申请号：US15392860
申请日：2016-12-28
发明人： Pen-Yi LIAO , Chia-Tai CHEN , Wen-Chia TSAI , Jing-Yi YANG , Ai-Ling LIN
CPC分类号： H01L33/642 , H01L21/4871 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting device includes a heat sinking substrate, an electrically insulating layer, a circuit pattern layer, and at least one light emitting diode (LED) chip. The electrically insulating layer is partially formed on the heat sinking substrate so as to expose a portion of the heat sinking substrate. The circuit pattern layer is formed on the electrically insulating layer. The LED chip is electrically connected to the circuit pattern layer, and is indirectly and non-electrically mounted to the portion of the heat sinking substrate exposed from the electrically insulating layer and the circuit pattern layer. A method of making the light emitting device is also provided.
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公开(公告)号：US20190074421A1
公开(公告)日：2019-03-07
申请号：US16182381
申请日：2018-11-06
发明人： Pen-Yi LIAO , Chia-Tai CHEN , Wen-Chia TSAI , Jing-Yi YANG , Ai-Ling LIN
CPC分类号： H01L33/642 , H01L21/4871 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting device includes a heat sinking substrate, an electrically insulating layer partially formed on the heat sinking substrate, a circuit pattern layer formed on the electrically insulating layer, a light emitting diode (LED) chip, and an electrically insulating and thermally conductive interlayer. The LED chip is indirectly and non-electrically mounted to the heat sinking substrate. The electrically insulating and thermally conductive interlayer is interposed between the bottom portion of the LED chip and a portion of the heat sinking substrate exposed from the electrically insulating layer. A bottom portion of the LED chip bridges the electrically insulating and thermally conductive interlayer and the circuit pattern layer.
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3.发明申请ILLUMINATION ASSEMBLY, METHOD OF MANUFACTURING THE ILLUMINATION ASSEMBLY, AND BACKLIGHT MODULE INCLUDING THE ILLUMINATION ASSEMBLY 审中-公开照明装置，制造照明装置的方法和包括照明装置的背光模组公开(公告)号：US20160111401A1
公开(公告)日：2016-04-21
申请号：US14879496
申请日：2015-10-09
发明人： Yu-Chuan LIN , Pen-Yi LIAO , Hui-Ching CHUANG , Chih-Hao CHEN , Ai-Ling LIN
IPC分类号： H01L25/075 , H01L21/48 , H01L33/48 , H01L33/60 , H01L33/62
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.
摘要翻译： 照明组件包括基板，布线结构，反射层和多个发光二极管。 布线结构形成在基板的一部分上，并且包括覆盖基板的一部分的催化剂层和形成在催化剂层上的导电层。 反射层形成在从布线结构露出的基板的另一部分上。 发光二极管配置在布线结构上，与布线结构电连接。
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公开(公告)号：US20190006330A1
公开(公告)日：2019-01-03
申请号：US16124036
申请日：2018-09-06
发明人： Yu-Chuan LIN , Pen-Yi LIAO , Hui-Ching CHUANG , Chih-Hao CHEN , Ai-Ling LIN
IPC分类号： H01L25/075 , H01L33/60
CPC分类号： H01L25/0753 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
摘要： An illumination assembly includes a substrate, a wiring structure, a reflecting layer and a plurality of light-emitting diodes. The wiring structure is formed on a part of the substrate, and includes a catalyst layer covering the part of the substrate, and a conducting layer formed on the catalyst layer. The reflecting layer is formed on another part of the substrate that is exposed from the wiring structure. The light-emitting diodes are disposed on the wiring structure and are electrically connected to the wiring structure.
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公开(公告)号：US20160336499A1
公开(公告)日：2016-11-17
申请号：US15150925
申请日：2016-05-10
发明人： Pen-Yi LIAO , Chih-Hao CHEN , Hui-Ching CHUANG , Ai-Ling LIN
CPC分类号： H01L33/62 , H01L24/00 , H01L33/486 , H01L2224/16 , H01L2224/81192 , H01L2933/0066
摘要： A method of making an electronic device includes: providing a base unit including a metal substrate, an insulating layer disposed on the metal substrate, and a first circuit unit disposed on the insulating layer; and laser ablating the first circuit unit, the insulating layer and the metal substrate in such a manner that a hole defined by a hole-defining wall is formed to expose the metal substrate, and that an interconnecting layer is formed on the hole-defining wall during laser ablation of the metal substrate.
摘要翻译： 一种制造电子设备的方法包括：提供包括金属基板，设置在金属基板上的绝缘层的基座单元和设置在绝缘层上的第一电路单元; 并且激光烧蚀第一电路单元，绝缘层和金属基板，使得由孔限定壁限定的孔形成以暴露金属基板，并且在孔限定壁上形成互连层 在金属基板的激光烧蚀过程中。
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